UA78L08ACDR中文资料
PACKAGING INFORMATION
Orderable Device Status(1)Package
Type Package
Drawing
Pins Package
Qty
Eco Plan(2)Lead/Ball Finish MSL Peak Temp(3)
UA78L02ACD ACTIVE SOIC D875Green(RoHS&
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
UA78L02ACDE4ACTIVE SOIC D875Green(RoHS&
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM UA78L02ACDR OBSOLETE SOIC D8TBD Call TI Call TI
UA78L02ACLP ACTIVE TO-92LP31000TBD CU SNPB Level-NC-NC-NC UA78L02CD OBSOLETE SOIC D8TBD Call TI Call TI
UA78L02CLP OBSOLETE TO-92LP3TBD Call TI Call TI
UA78L05ACD ACTIVE SOIC D875Green(RoHS&
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
UA78L05ACDE4ACTIVE SOIC D875Green(RoHS&
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
UA78L05ACDG4ACTIVE SOIC D875Green(RoHS&
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
UA78L05ACDR ACTIVE SOIC D82500Green(RoHS&
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
UA78L05ACDRE4ACTIVE SOIC D82500Green(RoHS&
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
UA78L05ACDRG4ACTIVE SOIC D82500Green(RoHS&
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM UA78L05ACLP ACTIVE TO-92LP31000TBD CU SNPB Level-NC-NC-NC
UA78L05ACLPM ACTIVE TO-92LP32000TBD CU SNPB Level-NC-NC-NC
UA78L05ACLPR ACTIVE TO-92LP32000TBD CU SNPB Level-NC-NC-NC
UA78L05ACLPRE3ACTIVE TO-92LP32000Pb-Free
(RoHS)
CU SN Level-NC-NC-NC
UA78L05ACPK ACTIVE SOT-89PK31000TBD CU SNPB Level-1-220C-UNLIM UA78L05ACPKG3ACTIVE SOT-89PK31000Green(RoHS&
no Sb/Br)
CU SN Level-2-260C-1YEAR
UA78L05AID ACTIVE SOIC D875Green(RoHS&
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
UA78L05AIDE4ACTIVE SOIC D875Green(RoHS&
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
UA78L05AIDR ACTIVE SOIC D82500Green(RoHS&
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
UA78L05AIDRE4ACTIVE SOIC D82500Green(RoHS&
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM UA78L05AILP ACTIVE TO-92LP31000TBD CU SNPB Level-NC-NC-NC
UA78L05AILPR ACTIVE TO-92LP32000TBD CU SNPB Level-NC-NC-NC UA78L05AIPK ACTIVE SOT-89PK31000TBD CU SNPB Level-1-220C-UNLIM UA78L05AIPKG3ACTIVE SOT-89PK31000Green(RoHS&
no Sb/Br)
CU SN Level-2-260C-1YEAR UA78L05AQD OBSOLETE SOIC D8TBD Call TI Call TI
UA78L05AQDR OBSOLETE SOIC D8TBD Call TI Call TI
UA78L05CD ACTIVE SOIC D875Green(RoHS&
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
UA78L05CDE4ACTIVE SOIC D875Green(RoHS&
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Orderable Device Status(1)Package
Type Package
Drawing
Pins Package
Qty
Eco Plan(2)Lead/Ball Finish MSL Peak Temp(3)
UA78L05CDG4ACTIVE SOIC D875Green(RoHS&
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
UA78L05CDR ACTIVE SOIC D82500Green(RoHS&
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
UA78L05CDRE4ACTIVE SOIC D82500Green(RoHS&
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
UA78L05CDRG4ACTIVE SOIC D82500Green(RoHS&
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM UA78L05CLP ACTIVE TO-92LP31000TBD CU SNPB Level-NC-NC-NC
UA78L05CLPR ACTIVE TO-92LP32000TBD CU SNPB Level-NC-NC-NC
UA78L05CPKG3ACTIVE SOT-89PK31000Green(RoHS&
no Sb/Br)
CU SN Level-2-260C-1YEAR UA78L05QLP OBSOLETE TO-92LP3TBD Call TI Call TI
UA78L05QLPR OBSOLETE TO-92LP3TBD Call TI Call TI
UA78L06ACD OBSOLETE SOIC D8TBD Call TI Call TI
UA78L06ACDR OBSOLETE SOIC D8TBD Call TI Call TI
UA78L06ACLP ACTIVE TO-92LP31000TBD CU SNPB Level-NC-NC-NC
UA78L06ACLPR ACTIVE TO-92LP32000TBD CU SNPB Level-NC-NC-NC
UA78L06ACPK ACTIVE SOT-89PK31000TBD CU SNPB Level-1-220C-UNLIM UA78L06ACPKG3ACTIVE SOT-89PK31000Green(RoHS&
no Sb/Br)
CU SN Level-2-260C-1YEAR UA78L06CLP OBSOLETE TO-92LP3TBD Call TI Call TI
UA78L08ACD ACTIVE SOIC D875Green(RoHS&
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
UA78L08ACDE4ACTIVE SOIC D875Green(RoHS&
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
UA78L08ACDG4ACTIVE SOIC D875Green(RoHS&
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
UA78L08ACDR ACTIVE SOIC D82500Green(RoHS&
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
UA78L08ACDRE4ACTIVE SOIC D82500Green(RoHS&
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
UA78L08ACDRG4ACTIVE SOIC D82500Green(RoHS&
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM UA78L08ACLP ACTIVE TO-92LP31000TBD CU SNPB Level-NC-NC-NC
UA78L08ACLPR ACTIVE TO-92LP32000TBD CU SNPB Level-NC-NC-NC
UA78L08ACPK ACTIVE SOT-89PK31000TBD CU SNPB Level-1-220C-UNLIM UA78L08ACPKG3ACTIVE SOT-89PK31000Green(RoHS&
no Sb/Br)
CU SN Level-2-260C-1YEAR UA78L08AILP OBSOLETE TO-92LP3TBD Call TI Call TI
UA78L08AQDR OBSOLETE SOIC D8TBD Call TI Call TI
UA78L08CD ACTIVE SOIC D875Green(RoHS&
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
UA78L08CDE4ACTIVE SOIC D875Green(RoHS&
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
UA78L08CDR ACTIVE SOIC D82500Green(RoHS&
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
UA78L08CDRE4ACTIVE SOIC D82500Green(RoHS&
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Orderable Device Status(1)Package
Type Package
Drawing
Pins Package
Qty
Eco Plan(2)Lead/Ball Finish MSL Peak Temp(3)
UA78L08CLP OBSOLETE TO-92LP3TBD Call TI Call TI
UA78L08CPK OBSOLETE SOT-89PK3TBD Call TI Call TI
UA78L09ACD ACTIVE SOIC D875Green(RoHS&
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
UA78L09ACDE4ACTIVE SOIC D875Green(RoHS&
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
UA78L09ACDR ACTIVE SOIC D82500Green(RoHS&
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
UA78L09ACDRE4ACTIVE SOIC D82500Green(RoHS&
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM UA78L09ACLP ACTIVE TO-92LP31000TBD CU SNPB Level-NC-NC-NC
UA78L09ACLPR ACTIVE TO-92LP32000TBD CU SNPB Level-NC-NC-NC
UA78L09ACPK ACTIVE SOT-89PK31000TBD CU SNPB Level-1-220C-UNLIM UA78L09ACPKG3ACTIVE SOT-89PK31000Green(RoHS&
no Sb/Br)
CU SN Level-2-260C-1YEAR UA78L09AQDR OBSOLETE SOIC D8TBD Call TI Call TI
UA78L09CLP OBSOLETE TO-92LP3TBD Call TI Call TI
UA78L09CLPR OBSOLETE TO-92LP3TBD Call TI Call TI
UA78L10ACD ACTIVE SOIC D875Green(RoHS&
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
UA78L10ACDE4ACTIVE SOIC D875Green(RoHS&
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
UA78L10ACDR ACTIVE SOIC D82500Green(RoHS&
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
UA78L10ACDRE4ACTIVE SOIC D82500Green(RoHS&
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM UA78L10ACLP ACTIVE TO-92LP31000TBD CU SNPB Level-NC-NC-NC
UA78L10ACLPR ACTIVE TO-92LP32000TBD CU SNPB Level-NC-NC-NC
UA78L10ACPK ACTIVE SOT-89PK31000TBD CU SNPB Level-1-220C-UNLIM UA78L10ACPKG3ACTIVE SOT-89PK31000Green(RoHS&
no Sb/Br)
CU SN Level-2-260C-1YEAR UA78L10CD OBSOLETE SOIC D8TBD Call TI Call TI
UA78L10CLP OBSOLETE TO-92LP3TBD Call TI Call TI
UA78L10CLPR OBSOLETE TO-92LP3TBD Call TI Call TI
UA78L12ACD ACTIVE SOIC D875Green(RoHS&
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
UA78L12ACDE4ACTIVE SOIC D875Green(RoHS&
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
UA78L12ACDG4ACTIVE SOIC D875Green(RoHS&
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
UA78L12ACDR ACTIVE SOIC D82500Green(RoHS&
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
UA78L12ACDRE4ACTIVE SOIC D82500Green(RoHS&
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
UA78L12ACDRG4ACTIVE SOIC D82500Green(RoHS&
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM UA78L12ACLP ACTIVE TO-92LP31000TBD CU SNPB Level-NC-NC-NC
UA78L12ACLPM ACTIVE TO-92LP32000TBD CU SNPB Level-NC-NC-NC
Orderable Device Status(1)Package
Type Package
Drawing
Pins Package
Qty
Eco Plan(2)Lead/Ball Finish MSL Peak Temp(3)
UA78L12ACLPME3ACTIVE TO-92LP32000Pb-Free
(RoHS)
CU SN Level-NC-NC-NC
UA78L12ACLPR ACTIVE TO-92LP32000TBD CU SNPB Level-NC-NC-NC UA78L12ACPK ACTIVE SOT-89PK31000TBD CU SNPB Level-1-220C-UNLIM UA78L12ACPKG3ACTIVE SOT-89PK31000Green(RoHS&
no Sb/Br)
CU SN Level-2-260C-1YEAR UA78L12AQDR OBSOLETE SOIC D8TBD Call TI Call TI
UA78L12AQLPR OBSOLETE TO-92LP3TBD Call TI Call TI
UA78L12CD OBSOLETE SOIC D8TBD Call TI Call TI
UA78L12CLP OBSOLETE TO-92LP3TBD Call TI Call TI
UA78L15ACD ACTIVE SOIC D875Green(RoHS&
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
UA78L15ACDE4ACTIVE SOIC D875Green(RoHS&
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
UA78L15ACDR ACTIVE SOIC D82500Green(RoHS&
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
UA78L15ACDRE4ACTIVE SOIC D82500Green(RoHS&
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM UA78L15ACLP ACTIVE TO-92LP31000TBD CU SNPB Level-NC-NC-NC UA78L15ACLPR ACTIVE TO-92LP32000TBD CU SNPB Level-NC-NC-NC UA78L15ACPK ACTIVE SOT-89PK31000TBD CU SNPB Level-1-220C-UNLIM UA78L15ACPKG3ACTIVE SOT-89PK31000Green(RoHS&
no Sb/Br)
CU SN Level-2-260C-1YEAR UA78L15CD OBSOLETE SOIC D8TBD Call TI Call TI
UA78L15CLP OBSOLETE TO-92LP3TBD Call TI Call TI
(1)The marketing status values are defined as follows:
ACTIVE:Product device recommended for new designs.
LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect.
NRND:Not recommended for new designs.Device is in production to support existing customers,but TI does not recommend using this part in a new design.
PREVIEW:Device has been announced but is not in production.Samples may or may not be available.
OBSOLETE:TI has discontinued the production of the device.
(2)Eco Plan-The planned eco-friendly classification:Pb-Free(RoHS)or Green(RoHS&no Sb/Br)-please check https://www.wendangku.net/doc/bd13941819.html,/productcontent for the latest availability information and additional product content details.
TBD:The Pb-Free/Green conversion plan has not been defined.
Pb-Free(RoHS):TI's terms"Lead-Free"or"Pb-Free"mean semiconductor products that are compatible with the current RoHS requirements for all6substances,including the requirement that lead not exceed0.1%by weight in homogeneous materials.Where designed to be soldered at high temperatures,TI Pb-Free products are suitable for use in specified lead-free processes.
Green(RoHS&no Sb/Br):TI defines"Green"to mean Pb-Free(RoHS compatible),and free of Bromine(Br)and Antimony(Sb)based flame retardants(Br or Sb do not exceed0.1%by weight in homogeneous material)
(3)MSL,Peak Temp.--The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications,and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.TI bases its knowledge and belief on information provided by third parties,and makes no representation or warranty as to the accuracy of such information.Efforts are underway to better integrate information from third parties.TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary,and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s)at issue in this document sold by TI
to Customer on an annual basis.
元器件交易网https://www.wendangku.net/doc/bd13941819.html,
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Microcontrollers https://www.wendangku.net/doc/bd13941819.html, Security https://www.wendangku.net/doc/bd13941819.html,/security
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