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NE6500379中文资料

Document No. P13495EJ2V0DS00 (2nd edition) Date Published August 1998 N CP(K)

Printed in Japan The mark shows major revised points.

NE6500379中文资料

1998?

2

RECOMMENDED OPERATING LIMITS

Characteristics

Symbol Test Conditions

MIN.

TYP.MAX.Unit Drain to Source Voltage V DS 6.0

6.0V Gain Compression Gcomp 3.0dB Channel Temperature

T ch

+125

°C

ELECTRICAL CHARACTERISTICS

(T A = 25°C, Unless otherwise specified, using NEC standard test fixture.)

Characteristics

Symbol Test Conditions

MIN.

TYP.MAX.

Unit Saturated Drain Current I DSS V DS = 2.5 V, V GS = 0 V 4.5

A Pinch-off Voltage

V p V DS = 2.5 V, I D = 21 mA –3.6–1.6V Gate to Drain Break Down Voltage

BV gd I gd = 21 mA 17

V Thermal Resistance R th Channel to Case 56

°C/W Output Power at 1 dB Gain Compression Point P o(1dB)35.0

dBm

Drain Current

I D

1.0A Power Added Efficiency ηadd 50%Linear Gain Note 1

G L

f = 1.9 GHz, V DS = 6.0 V R

g = 30 ?

I Dset = 500 mA (RF OFF)Note 2

9.0

10.0

dB

Notes 1.Pin = 0 dBm

2.DC performance is 100% testing. RF performance is testing several samples per wafer.

Wafer rejection criteria for standard devices is 1 reject for several samples.

OUTPUT POWER, DRAIN CURRENT AND GATE CURRENT vs. INPUT POWER

NE6500379中文资料

3

4

APPLICATION CIRCUIT EXAMPLE (Unit: mm)

NE6500379中文资料

NE6500379中文资料

GND

Substrate: Teflon glass ( r = 2.6) t = 0.8 mm

εf = 1.9 GH Z VDS = 6 V

I Dset = 500 mA (RF OFF)

C1 = 30 pF C2 = 30 pF

Rg = 30 ?

VGS

VDS

NE6500379A S-PARAMETERS TEST CONDITIONS: V DS = 6.0 V, I Dset = 500 mA

FREQUENCY S11S21S12S22 MHz MAG.ANG. (deg.)MAG.ANG. (deg.)MAG.ANG. (deg.)MAG.ANG. (deg.)

14000.950173.00.93393.10.01954.00.833170.5 14500.946172.60.90691.60.02054.90.841170.5 15000.950171.90.88492.80.01958.10.832169.6 15500.947171.40.85193.30.02058.30.837169.6 16000.967171.60.84794.00.02061.00.847170.2 16500.948170.30.81892.50.02162.70.838168.8 17000.946169.80.81694.80.02163.20.835168.2 17500.944169.00.76293.00.02263.80.838168.0 18000.945168.50.78791.10.02267.70.836166.8 18500.947167.80.74294.40.02266.20.833166.9 19000.944167.10.71688.60.02468.40.835165.6 19500.939166.20.70492.60.02268.50.835165.8 20000.945165.50.66591.10.02469.30.831164.9 20500.944164.90.65593.30.02368.20.834164.5 21000.945163.90.64189.60.02473.00.831162.9 21500.936163.40.62196.70.02469.60.828162.4 22000.950162.40.59291.00.02675.80.828161.7

5

79A Package Dimensions (Unit: mm)

NE6500379中文资料

NE6500379中文资料

NE6500379中文资料

Bottom View

1

.

2

m

a

x

.

NE6500379中文资料

79A Package Recommended P.C.B. Layout (Unit: mm)

6

RECOMMENDED SOLDERING CONDITIONS

This product should be soldered under the following recommended conditions. For soldering methods and conditions other than those recommended below, contact your NEC sales representative.

Soldering Method Soldering Conditions Recommended Condition Symbol

Infrared Reflow Package peak temperature: 235°C or below

Time: 30 seconds or less (at 210°C)

Count: 2, Exposure limit Note: None

IR35-00-2

Partial Heating Pin temperature: 260°C

Time: 5 seconds or less (per pin row)

Exposure limit Note: None

Note After opening the dry pack, keep it in a place below 25°C and 65% RH for the allowable storage period.

Caution Do not use different soldering methods together (except for partial heating).

7

NE6500379中文资料

Caution

The Great Care must be taken in dealing with the devices in this guide.

The reason is that the material of the devices is GaAs (Gallium Arsenide), which is

designated as harmful substance according to the law concerned.

Keep the law concerned and so on, especially in case of removal.

The application circuits and their parameters are for reference only and are not intended for use in actual design-ins.

No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in this document.

NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from use of a device described herein or any other liability arising from use of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Corporation or others.

While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices, the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or property arising from a defect in an NEC semiconductor device, customers must incorporate sufficient safety measures in its design, such as redundancy, fire-containment, and anti-failure features.

NEC devices are classified into the following three quality grades:

"Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on a customer designated "quality assurance program" for a specific application. The recommended applications of a device depend on its quality grade, as indicated below. Customers must check the quality grade of each device before using it in a particular application.

Standard: Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic

equipment and industrial robots

Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed

for life support)

Specific: Aircrafts, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems or medical equipment for life support, etc.

The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books. If customers intend to use NEC devices for applications other than those specified for Standard quality grade, they should contact an NEC sales representative in advance.

Anti-radioactive design is not implemented in this product.

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