GB9662 Datasheet_V1.9_20120720
SPEC. NO.：REV： 1.9 DATE：07.20. 2012
PRODUCT NAME：GB9662
AMPAK
GB9662
Wi-Fi SIP Module Spec Sheet
Revision History
Date Revision Content Revised By Version 2011/08/22 -Initial released Andy 1.0 2011/09/27 -Modify physical dimensions Andy 1.1 2011/10/19 -Modify block diagram Andy 1.2 2011/12/23 -Add Power Consumption Andy 1.3 2012/01/12 -Modify dimension Andy 1.4 2012/03/09 -Add packing information Andy 1.5 2012/03/19 -More info to recommended footprint Andy 1.6 2012/05/03 -Pin description revised Bart 1.7
2012/05/18 -Modify Recommended Footprint
-Modify Physical Dimensions
Bart 1.8
2012/07/20 -Modify Physical Dimensions Bart 1.9
AMPAK Technology Inc. https://www.wendangku.net/doc/b616196606.html, Proprietary & Confidential Information 1
Contents
Revision History (1)
Contents (2)
1.Introduction (3)
2.Features (4)
3.Deliverables (5)
3.1 Deliverables (5)
3.2 Regulatory certifications (5)
4.General Specification (6)
4.1 Wi-Fi RF Specification (6)
4.2 Voltages (7)
4.2.1 Absolute Maximum Ratings (7)
4.2.2 Recommended Operating Ratings (7)
5.Pin Assignments (8)
5.1 PCB Pin Outline (8)
5.2 Pin Definition (8)
6.Dimensions (11)
6.1 Physical Dimensions (11)
6.2 Recommended Footprint (12)
7.External clock reference (13)
7.1 SDIO Pin Description (13)
8.Host Interface Timing Diagram (14)
8.1 Power-up Sequence Timing Diagram (14)
8.2 SDIO Default Mode Timing Diagram (14)
8.3 SDIO High Speed Mode Timing Diagram (15)
9.Recommended Reflow Profile (16)
10.Packing Information (17)
10.1 Label (17)
10.2 Dimension (18)
10.3 MSL Level / Storage Condition (20)
1. Introduction
AMPAK Technology would like to announce a low-cost and low-power consumption module which has all of the Wi-Fi functionalities. The highly integrated GB9662 module makes the possibilities of web browsing, VoIP, headsets and other applications. With seamless roaming capabilities and advanced security, GB9662 can also interact with different vendors’ 802.11b/g/n Access Points in the wireless LAN.
This wireless module complies with IEEE 802.11 b/g/n standard and it can achieve up to a speed of 72.2Mbps with single stream in 802.11n draft, 54Mbps as specified in IEEE 802.11g, or 11Mbps for IEEE 802.11b to connect to the wireless LAN. The integrated module provides SDIO interface for Wi-Fi.
This compact module is a total solution for Wi-Fi technologies. The module is specifically developed for Smart phones and Portable devices.
2. Features
Single-band 2.4GHz IEEE 802.11b/g/n
Supports standard interfaces SDIO v2.0(50MHz, 4-bit and 1-bit) and generic SPI(up to 50MHz)
Integrated ARM Cortex-M3TM CPU with on-chip memory enables running IEEE802.11 firmware that can be field-upgraded with future features.
Supports per packet Rx antenna diversity
Security:
i. Hardware WAPI acceleration engine
ii. AES and TKIP in hardware for faster data encryption and IEEE 802.11i compatibility
iii. WPA TM– and WPA2TM - (Personal) support for powerful encryption and authentication
A simplified block diagram of the module is depicted in the figure below.
3. Deliverables
3.1 Deliverables
The following products and software will be part of the product.
Module with packaging
Evaluation Kits
Software utility for integration, performance test.
Product Datasheet.
Agency certified pre-tested report with the adapter board.
3.2 Regulatory certifications
The product delivery is a pre-tested module, without the module level certification. For module approval, the platform’s antennas are required for the certification.
4. General Specification
4.1 Wi-Fi RF Specification
Conditions : VBAT=3.6V ; VDDIO=3.3V ; Temp:25°C Feature Description
Product Name GB9662 Wi-Fi SIP Module WLAN Standard IEEE 802.11b/g/n, WiFi compliant Host Interface SDIO
Dimension L x W x H: 9.5 x 9.5 x 1.5 (typical) mm Frequency Range 2.412 GHz ~ 2.4835 GHz (2.4 GHz ISM Band) Number of Channels 11 for North America, 13 for Europe, and 14 for Japan Modulation
802.11b : DQPSK, DBPSK, CCK
802.11g/n : OFDM /64-QAM,16-QAM, QPSK, BPSK 802.11b /11Mbps : 16 dBm ± 1.5 dB @ EVM ≤ -9dB
802.11g /54Mbps : 15 dBm ± 1.5 dB @ EVM ≤ -25dB Output Power
802.11n /65Mbps : 14 dBm ± 1.5 dB @ EVM ≤ -28dB - MCS=0 PER @ -85 ± 1dBm, typical - MCS=1
PER @ -84 ± 1dBm, typical - MCS=2 PER @ -82 ± 1dBm, typical - MCS=3 PER @ -80 ± 1dBm, typical - MCS=4 PER @ -77 ± 1dBm, typical - MCS=5 PER @ -73 ± 1dBm, typical - MCS=6 PER @ -71 ± 1dBm, typical Receive Sensitivity (11n,20MHz) @10% PER
- MCS=7 PER @ -69 ± 1dBm, typical - 6Mbps PER @ -87 ± 1dBm, typical - 9Mbps PER @ -86 ± 1dBm, typical - 12Mbps
PER @ -85 ± 1dBm, typical - 18Mbps PER @ -83 ± 1dBm, typical - 24Mbps
PER @ -81 ± 1dBm, typical - 36Mbps PER @ -78 ± 1dBm, typical - 48Mbps PER @ -74 ± 1dBm, typical Receive Sensitivity (11g) @10% PER - 54Mbps PER @ -72 ± 1dBm, typical - 1Mbps
PER @ -90 ± 1dBm, typical - 2Mbps PER @ -89 ± 1dBm, typical - 5.5Mbps
PER @ -87 ± 1dBm, typical Receive Sensitivity (11b) @8% PER - 11Mbps
PER @ -84 ± 1dBm, typical
802.11b : 1, 2, 5.5, 11Mbps
Data Rate
802.11g : 6, 9, 12, 18, 24, 36, 48, 54Mbps
Data Rate
(20MHz ,Long GI,800ns)
802.11n: 6.5, 13, 19.5, 26, 39, 52, 58.5, 65Mbps
Data Rate
(20MHz ,short GI,400ns)
802.11n : 7.2, 14.4, 21.7, 28.9, 43.3, 57.8, 65,72.2Mbps
802.11b : -10 dBm
Maximum Input Level
802.11g/n : -20 dBm
Operating temperature -30°C to 85°C
Storage temperature -40°C to 85°C
Humidity Operating Humidity 10% to 95% Non-Condensing Storage Humidity 5% to 95% Non-Condensing
4.2 Voltages
4.2.1 Absolute Maximum Ratings
Symbol Description Min.Max.Unit VBAT Input supply Voltage -0.5 6.5 V VDDIO Digital/Bluetooth/SDIO/SPI I/O Voltage -0.5 4.1 V
4.2.2 Recommended Operating Ratings
Test conditions: At room temperature 25°C
Symbol Min. Typ. Max. Unit
VBAT 3.0 3.6 4.8 V
1.7 1.8 1.92 V
VDDIO
2.97
3.3 3.6 V
Note: The voltage of VDDIO is depended on system I/O voltage.
Test conditions: At operating temperature -10°C ~65°C
Symbol Min. Typ. Max. Unit
VBAT 3.0 3.6 4.8 V
VDDIO 1.7 - 3.35 V
Note: VDDIO operating voltage range from 1.7V to 3.35V at operating temperature is guaranteed.
5. Pin Assignments
5.1 PCB Pin Outline
< TOP VIEW >
5.2 Pin Definition
NO Name Type Description
1WLAN_ANT I/O RF signal I/O port
2GND － Ground
3JTAG_TRST_L I JTAG interface, if JTAG not used unconnected (NC)
4JTAG_TDO_UART_TX O JTAG interface, if JTAG not used unc onnected (NC) this pin. This pin is also muxed with UART_TX, which can be enabled by software
5JTAG_TDI_UART_RX I JTAG interface, if JTAG not used unconnected (NC) this pin. This pin is also muxed with UART_RX, which can be enabled by software
6JTAG_TCK I JTAG interface, if JTAG not used unconnected (NC) 7JTAG_TMS I JTAG interface, if JTAG not used unconnected (NC) 8GND － Ground
9OSC_IN I XTAL oscillator input
10OSC_OUT I/O XTAL oscillator output
11GND － Ground
12RF_SW_CTRL0 － Floating (Don’t connected to ground)
13RF_SW_CTRL3 － Floating (Don’t connected to ground)
15GND － Ground
16GND － Ground
17GND － Ground
18VIO I Digital I/O Voltage input
19CLK_32K I Sleep clock (32.768KHz) input
20SDIO_DATA_2 I/O SDIO data line 2
21SDIO_DATA_0 I/O SDIO data line 0
22SDIO_CLK I SDIO clock
23SDIO_CMD I/O SDIO command line
24SDIO_DATA_1 I/O SDIO data line 1
25SDIO_DATA_3 I/O SDIO data line 3
26VIN_LDO I Internal DC-DC regulator input
27GND － Ground
28SR_VLX O Internal DC-DC regulator output
29GND － Ground
30VBAT I DC voltage input
31WL_RST_N I Active low WLAN reset signal
32GND － Ground
33GND － Ground
34GND － Ground
35GND － Ground
36XTAL_PU O Floating (Don’t connected to ground)
37GND － Ground
38GND － Ground
39GND － Ground
40GND － Ground
41GND － Ground
42GND － Ground
43VDD_TCXO － Floating (Don’t connected to ground)
44GND － Ground
45TCXO_IN － Floating (Don’t connected to ground)
46GPIO_5 － Floating (Don’t connected to ground)
47GPIO_4 － Floating (Don’t connected to ground)
48GPIO_3 － Floating (Don’t connected to ground)
49GPIO_1 O WL_Host Wake,
50GPIO_0 － Mode selection, Low for SDIO, High for SPI mode 51WRF_GPIO_OUT － Floating (Don’t connected to ground)
53GND － Ground 54GND －Ground 55GND －Ground 56GND －Ground 57GND －Ground 58GND －Ground 59GND －Ground 60GND －Ground 61GND－ Ground
6. Dimensions
6.1 Physical Dimensions
(Unit: mm)
< TOP VIEW >
< Side View >
< TOP VIEW >
1.7 (MAX)
6.2 Recommended Footprint
(Unit: mm)
< TOP VIEW >
7. External clock reference
External LPO signal characteristics
Parameter LPO Clock Units Nominal input frequency 32.768 kHz Frequency accuracy 30
±ppm Duty cycle 30 - 70 % Input signal amplitude 1600 to 3300mV, p-p Signal type Square-wave or sine-wave-
Input impedance >100k
<5
?
pF
Clock jitter (integrated over 300Hz – 15KHz) <1 Hz
7.1 SDIO Pin Description
The GB9662 supports SDIO version 1.2 for both 1-bit (25 Mbps), 4-bit modes (100 Mbps), and high speed 4-bit (50 MHz clocks – 200 Mbps). It has the ability to stop the SDIO clock and map the interrupt signal into a GPIO pin. This ‘out-of-band’ interrupt signal notifies the host when the WLAN device wants to turn on the SDIO interface. The ability to force the control of the gated clocks from within the WLAN chip is also provided.
※ Function 0 Standard SDIO function (Max BlockSize / ByteCount = 32B)
※ Function 1 Backplane Function to access the internal System On Chip (SOC) address space (Max BlockSize / ByteCount = 64B)
※ Function 2 WLAN Function for efficient WLAN packet transfer through DMA (Max BlockSize / ByteCount = 512B)
SDIO Pin Description
SD 4-Bit Mode SD 1-Bit Mode SPI Mode
DATA0Data Line 0 DATA Data Line DO Data Output
DATA1Data Line 1 or
Interrupt
IRQ Interrupt IRQ Interrupt
DATA2Data Line 2 or
Read Wait
RW Read Wait NC Not Used
DATA3Data Line 3 NC Not Used CS Card Select CLK Clock CLK Clock SCLK Clock CMD Command Line CMD Command Line DI Data Input
8. Host Interface Timing Diagram
8.1 Power-up Sequence Timing Diagram
※ WL_RST_N: Low asserting Reset for WLAN Core. This pin must be driven high or low (not left floating).
8.2 SDIO Default Mode Timing Diagram
8.3 SDIO High Speed Mode Timing Diagram
9. Recommended Reflow Profile
Referred to IPC/JEDEC standard. Peak Temperature : <250°C Number of Times : ≤2 times
10
2.5/sec ℃
2.5°C/sec
40~70 sec
250℃
10. Packing Information
10.1 Label
Label A Anti-static and humidity notice
Label B MSL caution / Storage Condition
Label C Inner box label .
Label D Carton box label .
10.2 Dimension