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SN74S158中文资料

SN74S158中文资料
SN74S158中文资料

PACKAGING INFORMATION

Orderable Device Status(1)Package

Type Package

Drawing

Pins Package

Qty

Eco Plan(2)Lead/Ball Finish MSL Peak Temp(3)

76002012A ACTIVE LCCC FK201TBD Call TI Level-NC-NC-NC 7600201EA ACTIVE CDIP J161TBD Call TI Level-NC-NC-NC 7600201FA ACTIVE CFP W161TBD Call TI Level-NC-NC-NC 76033012A ACTIVE LCCC FK201TBD Call TI Level-NC-NC-NC 7603301EA ACTIVE CDIP J161TBD Call TI Level-NC-NC-NC 7603301FA ACTIVE CFP W161TBD Call TI Level-NC-NC-NC

JM38510/07903BEA ACTIVE CDIP J161TBD Call TI Level-NC-NC-NC

JM38510/07903BFA ACTIVE CFP W161TBD Call TI Level-NC-NC-NC

JM38510/07904BEA OBSOLETE CDIP J16TBD Call TI Call TI

JM38510/07904BFA OBSOLETE CFP W16TBD Call TI Call TI

JM38510/30903B2A ACTIVE LCCC FK201TBD Call TI Level-NC-NC-NC

JM38510/30903BEA ACTIVE CDIP J161TBD Call TI Level-NC-NC-NC

JM38510/30903BFA ACTIVE CFP W161TBD Call TI Level-NC-NC-NC SN54157J ACTIVE CDIP J161TBD Call TI Level-NC-NC-NC SN54LS157J ACTIVE CDIP J161TBD Call TI Level-NC-NC-NC SN54LS158J ACTIVE CDIP J161TBD Call TI Level-NC-NC-NC SN54S157J ACTIVE CDIP J161TBD Call TI Level-NC-NC-NC SN54S158J OBSOLETE CDIP J16TBD Call TI Call TI

SN74157N OBSOLETE PDIP N16TBD Call TI Call TI

SN74157N3OBSOLETE PDIP N16TBD Call TI Call TI

SN74LS157D ACTIVE SOIC D1640Green(RoHS&

no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM

SN74LS157DG4ACTIVE SOIC D1640Green(RoHS&

no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM

SN74LS157DR ACTIVE SOIC D162500Green(RoHS&

no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM

SN74LS157DRG4ACTIVE SOIC D162500Green(RoHS&

no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM

SN74LS157N ACTIVE PDIP N1625Pb-Free

(RoHS)

CU NIPDAU Level-NC-NC-NC SN74LS157N3OBSOLETE PDIP N16TBD Call TI Call TI

SN74LS157NE4ACTIVE PDIP N1625Pb-Free

(RoHS)

CU NIPDAU Level-NC-NC-NC

SN74LS157NSR ACTIVE SO NS162000Green(RoHS&

no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM

SN74LS157NSRE4ACTIVE SO NS162000Green(RoHS&

no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM

SN74LS158D ACTIVE SOIC D1640Green(RoHS&

no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM

SN74LS158DE4ACTIVE SOIC D1640Green(RoHS&

no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM

SN74LS158DR ACTIVE SOIC D162500Green(RoHS&

no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM

SN74LS158DRE4ACTIVE SOIC D162500Green(RoHS&

no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM SN74LS158N ACTIVE PDIP N1625Pb-Free CU NIPDAU Level-NC-NC-NC

Orderable Device Status(1)Package

Type Package

Drawing

Pins Package

Qty

Eco Plan(2)Lead/Ball Finish MSL Peak Temp(3)

(RoHS)

SN74LS158N3OBSOLETE PDIP N16TBD Call TI Call TI

SN74LS158NE4ACTIVE PDIP N1625Pb-Free

(RoHS)

CU NIPDAU Level-NC-NC-NC

SN74LS158NSR ACTIVE SO NS162000Green(RoHS&

no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM

SN74LS158NSRE4ACTIVE SO NS162000Green(RoHS&

no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM

SN74S157D ACTIVE SOIC D1640Green(RoHS&

no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM

SN74S157DE4ACTIVE SOIC D1640Green(RoHS&

no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM

SN74S157N ACTIVE PDIP N1625Pb-Free

(RoHS)

CU NIPDAU Level-NC-NC-NC SN74S157N3OBSOLETE PDIP N16TBD Call TI Call TI

SN74S157NE4ACTIVE PDIP N1625Pb-Free

(RoHS)

CU NIPDAU Level-NC-NC-NC

SN74S157NSR ACTIVE SO NS162000Green(RoHS&

no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM

SN74S157NSRE4ACTIVE SO NS162000Green(RoHS&

no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM SN74S158D OBSOLETE SOIC D16TBD Call TI Call TI

SN74S158DR OBSOLETE SOIC D16TBD Call TI Call TI

SN74S158N OBSOLETE PDIP N16TBD Call TI Call TI

SN74S158N3OBSOLETE PDIP N16TBD Call TI Call TI

SNJ54157J ACTIVE CDIP J161TBD Call TI Level-NC-NC-NC

SNJ54157W ACTIVE CFP W161TBD Call TI Level-NC-NC-NC SNJ54LS157FK ACTIVE LCCC FK201TBD Call TI Level-NC-NC-NC SNJ54LS157J ACTIVE CDIP J161TBD Call TI Level-NC-NC-NC SNJ54LS157W ACTIVE CFP W161TBD Call TI Level-NC-NC-NC SNJ54LS158FK ACTIVE LCCC FK201TBD Call TI Level-NC-NC-NC SNJ54LS158J ACTIVE CDIP J161TBD Call TI Level-NC-NC-NC SNJ54LS158W ACTIVE CFP W161TBD Call TI Level-NC-NC-NC SNJ54S157FK ACTIVE LCCC FK201TBD Call TI Level-NC-NC-NC SNJ54S157J ACTIVE CDIP J161TBD Call TI Level-NC-NC-NC SNJ54S157W ACTIVE CFP W161TBD Call TI Level-NC-NC-NC SNJ54S158FK OBSOLETE LCCC FK20TBD Call TI Call TI

SNJ54S158J OBSOLETE CDIP J16TBD Call TI Call TI

SNJ54S158W OBSOLETE CFP W16TBD Call TI Call TI

(1)The marketing status values are defined as follows:

ACTIVE:Product device recommended for new designs.

LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect.

NRND:Not recommended for new designs.Device is in production to support existing customers,but TI does not recommend using this part in a new design.

PREVIEW:Device has been announced but is not in production.Samples may or may not be available.

OBSOLETE:TI has discontinued the production of the device.

(2)Eco Plan-The planned eco-friendly classification:Pb-Free(RoHS)or Green(RoHS&no Sb/Br)-please check

https://www.wendangku.net/doc/b316242954.html,/productcontent for the latest availability information and additional product content details.

TBD:The Pb-Free/Green conversion plan has not been defined.

Pb-Free(RoHS):TI's terms"Lead-Free"or"Pb-Free"mean semiconductor products that are compatible with the current RoHS requirements for all6substances,including the requirement that lead not exceed0.1%by weight in homogeneous materials.Where designed to be soldered at high temperatures,TI Pb-Free products are suitable for use in specified lead-free processes.

Green(RoHS&no Sb/Br):TI defines"Green"to mean Pb-Free(RoHS compatible),and free of Bromine(Br)and Antimony(Sb)based flame retardants(Br or Sb do not exceed0.1%by weight in homogeneous material)

(3)MSL,Peak Temp.--The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications,and peak solder temperature.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.TI bases its knowledge and belief on information provided by third parties,and makes no representation or warranty as to the accuracy of such information.Efforts are underway to better integrate information from third parties.TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary,and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s)at issue in this document sold by TI to Customer on an annual basis.

IMPORTANT NOTICE

Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.

TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. T esting and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed.

TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. T o minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards.

TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.

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Products Applications

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