DF68544中文资料
APPLICATIONS
s Snubber Diode For GTO Applications
FEATURES
s Double Side Cooling s High Surge Capability s Low Recovery Charge
VOLTAGE RATINGS
KEY PARAMETERS V RRM 4500V I F(AV)445A I FSM 4500A Q r 650μC t rr 5μs
CURRENT RATINGS
Symbol
Parameter
Conditions
Double Side Cooled I F(AV)Mean forward current I F(RMS)RMS value
I F
Continuous (direct) forward current
Single Side Cooled (Anode side)I F(AV)Mean forward current I F(RMS)RMS value
I F
Continuous (direct) forward current
Units
Max.
Half wave resistive load, T case = 65o C 445A T case = 65o C 700A T case = 65o C
610
A
Half wave resistive load, T case = 65o C 280A T case = 65o C 440A T case = 65o C
365
A 450044004300420041004000DF685 45DF685 44DF685 43DF685 42DF685 41DF685 40Conditions
V RSM = V RRM + 100V
Lower voltage grades available.
Type Number
Repetitive Peak
Reverse Voltage
V RRM V
Outline type code: M779b.
See Package Details for further information.
DF685
Fast Recovery Diode
Replaces March 1998 version, DS4303-1.3
DS4303-2.0 January 2000
SURGE RATINGS
Conditions Max.Units 4.5
kA 101.25x103
A 2s I 2
t for fusing
I 2
t Surge (non-repetitive) forward current I FSM Parameter
Symbol 10ms half sine; with 0% V RRM, T j = 150o
C
3.6
kA 64.8x103
A 2s I 2t for fusing
I 2t Surge (non-repetitive) forward current I FSM 10ms half sine; with 50% V RRM, T j = 150o
C
-kA -A 2s
I 2t for fusing
I 2t
Surge (non-repetitive) forward current I FSM 10ms half sine; with 100% V RRM, T j = 150o C
THERMAL AND MECHANICAL DATA
dc Conditions
Max.Units
o
C/W -
0.086
Anode dc
Clamping force 10kN with mounting compound Thermal resistance - case to heatsink
R th(c-h)
0.01Double side -Single side
Thermal resistance - junction to case
R th(j-c)
Single side cooled
Symbol
Parameter
-0.02o
C/W
o
C/W Cathode dc
-0.095o
C/W Double side cooled
-0.045o
C/W
T stg Storage temperature range -55150o
C
kN
11.0
9.0
Clamping force
-
T vj Virtual junction temperature On-state (conducting)
-150o
C Min.
t rr 80Symbol Typ.Units Parameter
V FM Forward voltage I RRM Peak reverse current Reverse recovery time Q RA1Recovered charge (50% chord)I RM Reverse recovery current K Soft factor V TO Threshold voltage r T Slope resistance V FRM
Forward recovery voltage
di/dt = 1000A/μs, T j = 125o C -220
V
At T vj = 150o C
- 1.76m ?At T vj = 150o C - 2.0V 1.8--270-A -650μC 5-μs
At V RRM , T case = 150o C
-mA
At 1500A peak, T case = 25o C - 4.8V Conditions
Max.I F = 1000A, di RR /dt = 100A/μs T case = 150o C, V R = 100V
CHARACTERISTICS
DEFINITION OF K FACTOR AND Q
RA1
CURVES
Fig. 1 Maximum (limit) forward characteristics
Fig. 3 Transient forward voltage vs rate of rise of forward current
Fig. 5 Typical reverse recovery current vs rate of rise of reverse current
Fig. 6 Maximum (limit) transient thermal impedance - junction to case - (?C/W)
PACKAGE DETAILS
For further package information, please contact your local Customer Service Centre. All dimensions in mm, unless stated otherwise. DO NOT SCALE.
ASSOCIATED PUBLICATIONS
Title Application Note
Number
Calculating the junction temperature or power semiconductors AN4506
Recommendations for clamping power semiconductors AN4839
Thyristor and diode measurement with a multi-meter AN4853
Use of V
TO , r
T
on-state characteristic AN5001
POWER ASSEMBLY CAPABILITY
The Power Assembly group was set up to provide a support service for those customers requiring more than the basic semiconduc-tor, and has developed a flexible range of heatsink / clamping systems in line with advances in device types and the voltage and current capability of our semiconductors.
We offer an extensive range of air and liquid cooled assemblies covering the full range of circuit designs in general use today. The Assembly group continues to offer high quality engineering support dedicated to designing new units to satisfy the growing needs of our customers.
Using the up to date CAD methods our team of design and applications engineers aim to provide the Power Assembly Complete solution (PACs).
DEVICE CLAMPS
Disc devices require the correct clamping force to ensure their safe operation. The PACs range offers a varied selection of pre-loaded clamps to suit all of our manufactured devices. This include cube clamps for single side cooling of ‘T’ 22mm Clamps are available for single or double side cooling, with high insulation versions for high voltage assemblies.Please refer to our application note on device clamping, AN4839
HEATSINKS
Power Assembly has it’s own proprietary range of extruded aluminium heatsinks. They have been designed to optimise the
performance or our semiconductors. Data with respect to air natural, forced air and liquid cooling (with flow rates) is available on request.
For further information on device clamps, heatsinks and assemblies, please contact your nearest Sales Representative or the factory.
CUSTOMER SERVICE CENTRES
France, Benelux, Italy and Spain Tel: +33 (0)1 69 18 90 00. Fax: +33 (0)1 64 46 54 50North America Tel: 011-800-5554-5554. Fax: 011-800-5444-5444
UK, Germany, Scandinavia & Rest Of World Tel: +44 (0)1522 500500. Fax: +44 (0)1522 500020SALES OFFICES
France, Benelux, Italy and Spain Tel: +33 (0)1 69 18 90 00. Fax: +33 (0)1 64 46 54 50Germany Tel: 07351 827723
North America Tel: (613) 723-7035. Fax: (613) 723-1518. Toll Free: 1.888.33.DYNEX (39639) /Tel: (831) 440-1988. Fax: (831) 440-1989 / T el: (949) 733-3005. Fax: (949) 733-2986.
UK, Germany, Scandinavia & Rest Of World Tel: +44 (0)1522 500500. Fax: +44 (0)1522 500020These offices are supported by Representatives and Distributors in many countries world-wide.? Dynex Semiconductor 2000 Publication No. DS4303-2 Issue No. 2.0 January 2000
TECHNICAL DOCUMENTATION – NOT FOR RESALE. PRINTED IN UNITED KINGDOM
HEADQUARTERS OPERATIONS DYNEX SEMICONDUCTOR LTD Doddington Road, Lincoln.
Lincolnshire. LN6 3LF. United Kingdom.Tel: 00-44-(0)1522-500500Fax: 00-44-(0)1522-500550DYNEX POWER INC.Unit 7 - 58 Antares Drive,
Nepean, Ontario, Canada K2E 7W6.Tel: 613.723.7035Fax: 613.723.1518
Toll Free: 1.888.33.DYNEX (39639)
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