Value
Unit 48A
BSC090N03MS G
Maximum ratings, at T j=25 °C, unless otherwise specified
Parameter Symbol Conditions Unit Power dissipation P tot T C=25 °C32W
T A=25 °C,
R thJA=50 K/W2)
2.5
Operating and storage temperature T j, T stg-55 ... 150°C IEC climatic category; DIN IEC 68-155/150/56
Parameter Symbol Conditions Unit
min.typ.max. Thermal characteristics
Thermal resistance, junction - case R thJC-- 3.9K/W Device on PCB R thJA 6 cm2 cooling area2)--50 Electrical characteristics, at T j=25 °C, unless otherwise specified
Static characteristics
Drain-source breakdown voltage V(BR)DSS V GS=0 V, I D=1 mA30--V Gate threshold voltage V GS(th)V DS=V GS, I D=250 μA1-2
Zero gate voltage drain current I DSS V DS=30 V, V GS=0 V,
T j=25 °C
-0.11μA
V DS=30 V, V GS=0 V,
T j=125 °C
-10100
Gate-source leakage current I GSS V GS=16 V, V DS=0 V-10100nA Drain-source on-state resistance R DS(on)V GS=4.5 V, I D=30 A-9.011.2m?
V GS=10 V, I D=30 A-7.59.0
Gate resistance R G0.51 1.8?
Transconductance g fs |V DS|>2|I D|R DS(on)max,
I D=30 A
2855-S
3)
Value Values
2) Device on 40 mm x 40 mm x 1.5 mm epoxy PCB FR4 with 6 cm2 (one layer, 70 μm thick) copper area for drain connection. PCB is vertical in still air.
BSC090N03MS G
Parameter Symbol Conditions Unit
min.typ.max. Dynamic characteristics
Input capacitance C iss-14001900pF Output capacitance C oss-470630 Reverse transfer capacitance C rss-29-
Turn-on delay time t d(on)-9.0-ns Rise time t r- 5.0-
Turn-off delay time t d(off)-8.8-
Fall time t f- 5.4-
Gate Charge Characteristics5)
Gate to source charge Q gs- 4.6 6.1nC Gate charge at threshold Q g(th)- 2.3 3.0
Gate to drain charge Q gd- 2.1 3.5 Switching charge Q sw- 4.4 6.5
Gate charge total Q g-8.912
Gate plateau voltage V plateau- 3.2-V
Gate charge total Q g V DD=15 V, I D=30 A,
V GS=0 to 10 V
-1824
Gate charge total, sync. FET Q g(sync)V DS=0.1 V,
V GS=0 to 4.5 V
-7.710nC
Output charge Q oss V DD=15 V, V GS=0 V-1216 Reverse Diode
Diode continuous forward current I S--29A Diode pulse current I S,pulse--192
Diode forward voltage V SD V GS=0 V, I F=30 A,
T j=25 °C
-0.9 1.1V
Reverse recovery charge Q rr V R=15 V, I F=I S,
d i F/d t=400 A/μs
--10nC T C=25 °C
Values
V GS=0 V, V DS=15 V,
f=1 MHz
V DD=15 V, V GS=4.5 V,
I D=30 A, R G=1.6 ?
V DD=15 V, I D=30 A,
V GS=0 to 4.5 V
BSC090N03MS G Package Outline PG-TDSON-8
Footprint
BSC090N03MS G Package Outline
PG-TDSON-8: Tape
BSC090N03MS G
Published by
Infineon Technologies AG
81726 München, Germany
? Infineon Technologies AG 2006.
All Rights Reserved.
Attention please!
The information given in this data sheet shall in no event be regarded as a guarantee of conditions or
characteristics (“Beschaffenheitsgarantie”). With respect to any examples or hints given herein, any typical
values stated herein and/or any information regarding the application of the device, Infineon Technologies
hereby disclaims any and all warranties and liabilities of any kind, including without limitation warranties of
non-infringement of intellectual property rights of any third party.
Information
For further information on technology, delivery terms and conditions and prices please contact your nearest
Infineon Technologies Office (https://www.wendangku.net/doc/c83522083.html,).
Warnings
Due to technical requirements components may contain dangerous substances. For information on the types
in question please contact your nearest Infineon Technologies Office.
Infineon Technologies Components may only be used in life-support devices or systems with the express
written approval of Infineon Technologies, if a failure of such components can reasonably be expected to
cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or
system. Life support devices or systems are intended to be implanted in the human body, or to support and/or
maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the
user or other persons may be endangered.