SN74AHC74RGYRG4中文资料
PACKAGING INFORMATION
Orderable
Device Status (1)Package Type Package Drawing Pins Package Qty Eco Plan (2)
Lead/Ball Finish
MSL Peak Temp (3)
5962-9686001Q2A ACTIVE LCCC FK 201TBD POST-PLATE N /A for Pkg Type 5962-9686001QCA ACTIVE CDIP J 141TBD A42SNPB N /A for Pkg Type 5962-9686001QDA ACTIVE CFP W 141TBD A42N /A for Pkg Type SN74AHC74D ACTIVE SOIC D 1450
Green (RoHS &no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM SN74AHC74DBLE OBSOLETE SSOP DB 14TBD
Call TI Call TI
SN74AHC74DBR ACTIVE SSOP DB 142000Green (RoHS &
no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AHC74DBRE4ACTIVE SSOP DB 142000Green (RoHS &
no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AHC74DBRG4ACTIVE SSOP DB 142000Green (RoHS &
no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AHC74DE4ACTIVE SOIC D 1450
Green (RoHS &no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM SN74AHC74DGVR ACTIVE TVSOP DGV 142000Green (RoHS &
no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AHC74DGVRE4ACTIVE TVSOP DGV 142000Green (RoHS &
no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AHC74DGVRG4ACTIVE TVSOP DGV 142000Green (RoHS &
no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AHC74DR ACTIVE SOIC D 142500Green (RoHS &
no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AHC74DRE4ACTIVE SOIC D 142500Green (RoHS &
no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AHC74N ACTIVE PDIP N 1425Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type SN74AHC74NE4ACTIVE PDIP N 1425
Pb-Free (RoHS)
CU NIPDAU N /A for Pkg Type SN74AHC74NSR ACTIVE SO NS 142000Green (RoHS &
no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AHC74NSRE4ACTIVE SO NS 142000Green (RoHS &
no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AHC74PW ACTIVE TSSOP PW 1490Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AHC74PWE4ACTIVE TSSOP PW 1490Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AHC74PWG4ACTIVE TSSOP PW 1490
Green (RoHS &no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM SN74AHC74PWLE OBSOLETE TSSOP PW 14TBD
Call TI Call TI
SN74AHC74PWR ACTIVE TSSOP PW 142000Green (RoHS &
no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AHC74PWRE4ACTIVE TSSOP PW 142000Green (RoHS &
no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AHC74PWRG4ACTIVE TSSOP PW 142000Green (RoHS &
no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AHC74RGYR ACTIVE QFN RGY 141000Green (RoHS &
no Sb/Br)CU NIPDAU Level-2-260C-1YEAR SN74AHC74RGYRG4
ACTIVE
QFN
RGY
14
1000Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1YEAR
https://www.wendangku.net/doc/cf18575593.html,
18-Jul-2006
Orderable Device Status (1)Package Type Package Drawing Pins Package Qty Eco Plan (2)
Lead/Ball Finish
MSL Peak Temp (3)
SNJ54AHC74FK ACTIVE LCCC FK 201TBD POST-PLATE N /A for Pkg Type SNJ54AHC74J ACTIVE CDIP J 141TBD A42SNPB N /A for Pkg Type SNJ54AHC74W
ACTIVE
CFP
W
14
1
TBD
A42
N /A for Pkg Type
(1)
The marketing status values are defined as follows:ACTIVE:Product device recommended for new designs.
LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect.
NRND:Not recommended for new designs.Device is in production to support existing customers,but TI does not recommend using this part in a new design.
PREVIEW:Device has been announced but is not in production.Samples may or may not be available.OBSOLETE:TI has discontinued the production of the device.
(2)
Eco Plan -The planned eco-friendly classification:Pb-Free (RoHS),Pb-Free (RoHS Exempt),or Green (RoHS &no Sb/Br)-please check https://www.wendangku.net/doc/cf18575593.html,/productcontent for the latest availability information and additional product content details.TBD:The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS):TI's terms "Lead-Free"or "Pb-Free"mean semiconductor products that are compatible with the current RoHS requirements for all 6substances,including the requirement that lead not exceed 0.1%by weight in homogeneous materials.Where designed to be soldered at high temperatures,TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt):This component has a RoHS exemption for either 1)lead-based flip-chip solder bumps used between the die and package,or 2)lead-based die adhesive used between the die and leadframe.The component is otherwise considered Pb-Free (RoHS compatible)as defined above.
Green (RoHS &no Sb/Br):TI defines "Green"to mean Pb-Free (RoHS compatible),and free of Bromine (Br)and Antimony (Sb)based flame retardants (Br or Sb do not exceed 0.1%by weight in homogeneous material)
(3)
MSL,Peak Temp.--The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications,and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.TI bases its knowledge and belief on information provided by third parties,and makes no representation or warranty as to the accuracy of such information.Efforts are underway to better integrate
information from third parties.TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary,and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s)at issue in this document sold by TI to Customer on an annual basis.
https://www.wendangku.net/doc/cf18575593.html,
18-Jul-2006