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SFI0805ML080C-LF-H

SFI0805ML080C-LF-H
SFI0805ML080C-LF-H

Customer Information

Customer :

Part Name : Part No. : Model No. :

COMPANY PURCHASE R&D

APPROVAL SHEET

Vendor Information

Name: SFI ELECTRONICS TECHNOLOGY CORP . INC. Part Name Chip TVS

Part No. SFI0805ML080C-LF

Lot No.

SFI ELECTRONICS TECHNOLOGY INC.

ADDRESS :No.6, Lane 340, Shan-Ying Road , Guishan,Tao Yuan Taiwan TEL: 886-3-3506998 FAX: 886-3-3507689 E-mail: sfi@https://www.wendangku.net/doc/d1114586.html, Quality Control

Document Control

Business Issue

REV :H

Prepared Check

ISO 9001:2000 ISO 14001:2004

PART NO. SFI0805ML080C-LF

1.1 Technology Data Symbol Value Unit

V

Maximum allowable continuous AC voltage at 50-60 Hz V RMS 4

Maximum allowable continuous DC voltage V DC 5.5 V

Varistor voltage measured Vv 7.5~10.5 V

Maximum clamping voltage V CLAMP< 20 V

Maximum Peak Current I Peak> 80 A

1.2 Reference Data

Maximum Energy Absorption*4 E > 0.1 J

Typical capacitance value measured at 1K Hz C 1400 pF

Response time T rise< 1 ns

Leakage current at Vv × 80% I v v< 50 uA

Leakage current at Vv ×80% (After realityTest) I v v A< 200 uA

Operation ambient temperature -50~ +85 ℃

Storage temperature -50~+125 ℃

1.3 Other Data

ZnO Body

End termination Ag/Ni/Sn

Packaging

Reel Complies with Standard IEC61000-4-5

Lead Content <1000 ppm

Marking None

Notes:

* 1 The varistor voltage was measured at 1 mA current,

* 2 The Clamping voltage was measured at 8*20 us standard current.

* 3 The Leakage current was measured working voltage.

* 4 The Energy only for customer reference.

* 5 The components shall be employed within 1 year, in the nitrogen condition.

3. Surge Wave Form

IEC61000-4-5 Standards

SEVERITY LEVEL T1 T2

1 8 μs 20 μs

2 10 μs1000 μs

4. Environment Reliability Test

Characteristic Test method and description

High Temperature

Storage

The specimen shall be subjected to 125 ± 2℃for 1000 ± 12 hours in a thermostatic

bath without load and then stored at room temperature and normal humidity for 1 to

2 hours. The change of varistor voltage shall be within 10 ﹪.

Step Temperature Period

1 -40±3℃ 30Min±3

2 Room

Temperature 1

hour

3 125±3℃ 30Min±3

Temperature Cycle

The temperature cycle of specified

temperature shall be repeated five times

and then stored at room temperature and

normal humidity for one or two hours. The

change of varistor voltage shall be within 10

﹪and mechanical damage shall be

examined. 4 Room

Temperature 1

hour

High Temperature

Load

After being continuously applied the maximum allowable voltage at 85 ± 2℃ for

1000± 2 hours, the specimen shall be stored at room temperature and normal

humidity for one or two hours, the change of varistor voltage shall be within 10﹪.

Damp Heat Load/

Humidity Load

The specimen should be subjected to 40 ± 2℃, 90 to 95 ﹪RH environment, and the

maximum allowable voltage applied for 1000 hours, then stored at room temperature

and normal humidity for one or two hours. The change of varistor voltage shall be

within 10﹪

Low Temperature

Storage

The specimen should be subjected to -40 ± 2℃, without load for 500 hours and then

stored at room temperature for one or two hours. The change of varistor voltage shall

be within 10 ﹪

8/20μs waveform current(A)

2.S ize

1.20 max 1.50 max 1.50 max

3

Model0402(1005) 0603(1608)0805(2012)1206(3216)1210(3225)1812(4532)2220(5750)

Length(L) 1.00 ±0.10 1.60±0.15 2.00±0.20 3.20±0.20 3.20±0.20 4.50±0.20 5.70±0.20

Width(W)0.50 ±0.100.80±0.10 1.25±0.15 1.60±0.15 2.50±0.20 3.20±0.20 5.00±0.20

Thickness(T)0.60 max0.90 max 2.00 max 2.50 max

Termination(a) 0.25±0.1 0.3±0.1 0.3±0.1 0.5±0.2

.Surge Wave Form

0.5±0.2 0.5+0.3/-0.1 0.5+0.3/-0.1

5. Soldering Recommendations 5.1 Recommended solder pad layout

(Unit :mm )

A

B

C

D

0402 0.4~0.6 1.4~1.8 0.5~0.6 0.6~1.20603 0.9~1.2 2.7~3.2 0.7~1.0 0.9~1.2

0805 1.0~1.5 2.6~3.2 1.2~1.5 1.1~1.81206 1.8~2.5 4.2~5.2 1.2~1.8 1.2~1.81210 1.8~2.5 4.2~5.2 2.2~3.0 1.3~2.0

1812 2.5~3.3 5.5~6.7 2.8~3.6 1.3~2.2

2220 3.8~4.6 6.6~7.8 4.8~5.5 1.3~2.2

5.2 The SIR test of the solder paste shall be done (Based on JIS-Z-3284) 5.3 Steel plate and foot distance printing Foot distance printing (mm)

Steel Plate thickness (mm)

> 0.65mm

0.18mm

0.65mm~0.5mm 0.15mm

☆ IR reflow Pb Free Process suggestion profile

(1) The solder recommend is Sn96.5/Ag 3.5 of 120 to 150μm

(2) Ramp-up rate (217℃ to Peak) + 3℃/second max (3) Temp. maintain at 175 +/-25℃ 180 seconds max (4) Temp. maintain above 217 ℃ 60-150 seconds 0.50mm~0.40mm 0.12mm >=0.40 mm

0.10mm

5.4The IR reflow and temperature of Soldering for Pb Free

SMD Transient Voltage Suppressors

(5) Peak temperature range 245℃ +20℃/ -10 ℃ time within 5 ℃ of actually peak temperature (tp) 10~20 seconds

(6) Ramp down rate +6 ℃/second max.

5.5 Resistance to soldering heat-High Temperature Resistance:260℃,10sec-3times.

5.6 Hand Soldering

In hand soldering of the Varistors. Large temperature gradient between preheated the Varistors and the tip of soldering iron may cause electrical failures and mechanical damages such as

crackings or breakings of the devices. The soldering shall be carefully controlled and carried out so that the temperature gradient is kept minimum with following recommended conditions for hand soldering.

5.6.1 Recommended Soldering Condition 1

(1) Solder :

0.12~0.18mm Thread solder (Sn96.5:Ag3.5) with soldering flux in the core. Rosin-based and non-activated flux is recommended. (2) Preheating

The Varistors shall be preheated so that Temperature Gradient between the devices and the tip of soldering iron is 150℃ or below. (3)Soldering Iron

Rated Power of 20w max with 3mm soldering tip in diameter.

Temperature of soldering iron tip 380℃max,3-5sec ( The required amount of solder shall be melted in advance on the soldering tip.) (4)Cooling

After soldering. The Varistors shall be cooled gradually at room ambient temperature.

5.6.2 Recommended Soldering Condition 2(Without preheating )

(1)Solder iron tip shall not directly touch to ceramic dielectrics.

(2)Solder iron tip shall be fully preheated before soldering while soldering iron tip to the external electrode of Varistors.

5.7 Post Soldering Cleaning

5.7.1 Residues of corrosive soldering fluxes on the PC board after cleaning may greatly have

influences on the electrical characteristic and the reliability (such as humidity resistance)of the Varistors which have been mounted on the board. It shall be confirmed that the characteristic and the reliability of the devices are not affected by the applied cleaning conditions.

5.7.2. When an ultrasonic cleaning is applied to the mounted Varistors on PC Boards. Following

conditions are recommended for preventing failures or damages of the devices due to the large vibration energy and the resonance caused by the ultrasonic waves. (1)Frequency 29MHz max

(2)Radiated Power 20w/lithr max (3)Period 5minuets max

Perform adequate test in advance as the reflow temperature profile will vary according to the conditions of the manufacturing process, and the specification of the reflow furnace.

6. Packaging Specification

6.1 Carrier tape and transparent cover tape should be heat-sealed to carry the products, and the reel should be

7.Reel Dimension

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