J-STD-033C操作.包装.出货及湿敏表面安装设备的使用
JOINT INDUSTRY STANDARD
Handling,Packing, Shipping and Use of
Moisture/Re?ow
Sensitive Surface
Mount Devices IPC/JEDEC J-STD-033C February2012 Supersedes IPC/JEDEC J-STD-033B Includes Amemdment1
October2005
Notice JEDEC and IPC Standards and Publications are designed to serve the public
interest through eliminating misunderstandings between manufacturers and
purchasers,facilitating interchangeability and improvement of products,
and assisting the purchaser in selecting and obtaining with minimum delay
the proper product for his particular need.Existence of such Standards and
Publications shall not in any respect preclude any member or nonmember
of JEDEC or IPC from manufacturing or selling products not conforming
to such Standards and Publications,nor shall the existence of such Standards
and Publications preclude their voluntary use by those other than JEDEC
and IPC members,whether the standard is to be used either domestically
or internationally.
Recommended Standards and Publications are adopted by JEDEC and
IPC without regard to whether their adoption may involve patents on articles,
materials,or processes.By such action,JEDEC and IPC do not assume any
liability to any patent owner,nor do they assume any obligation whatever
to parties adopting the Recommended Standard or https://www.wendangku.net/doc/db976449.html,ers are also
wholly responsible for protecting themselves against all claims of liabilities
for patent infringement.
The material in this joint standard was developed by the JEDEC JC-14.1
Committee on Reliability Test Methods for Packaged Devices and the IPC
Plastic Chip Carrier Cracking Task Group(B-10a)
For Technical Information Contact:
JEDEC
Solid State Technology Association 3103North10th Street,Suite240-S Arlington,V A22201-2107
Tel703907.0026
Fax703907.7501IPC
3000Lakeside Drive,Suite309S Bannockburn,Illinois
60015-1249
Tel847615.7100
Fax847615.7105
Please use the Standard Improvement Form shown at the end of this
document.
?Copyright2012.JEDEC Solid State Technology Association,Arlington,Virginia,and IPC,Bannockburn,Illinois,USA.All rights reserved under both international and Pan-American copyright conventions.Any copying,scanning or other reproduction of these materials without the prior written consent of the copyright holder is strictly prohibited and constitutes infringement under the Copyright Law of the United States.
IPC/JEDEC J-STD-033C
Handling,Packing, Shipping and Use of Moisture/Reflow Sensitive Surface
Mount Devices
A joint standard developed by the JEDEC JC-14.1Committee on Reliability Test Methods for Packaged Devices and the B-10a Plastic Chip Carrier Cracking Task Group of IPC
Users of this standard are encouraged to participate in the development of future revisions.
Contact:
JEDEC
Solid State Technology Association 3103North10th Street,Suite240-S Arlington,V A22201-2107
Tel703907.0026
Fax703907.7501IPC
3000Lakeside Drive,Suite309S Bannockburn,Illinois
60015-1249
Tel847615.7100
Fax847615.7105
Supersedes:
IPC/JEDEC J-STD-033B.1 includes Amendment1-January2007
IPC/JEDEC J-STD-033B-October2005
IPC/JEDEC J-STD-033A-July2002
IPC/JEDEC J-STD-033-
April1999
JEDEC JEP124
IPC-SM-786A-January1995 IPC-SM-786-December1990
?
This Page Intentionally Left Blank
Acknowledgment
Members of the Joint IPC/JEDEC Moisture Classi?cation Task Group have worked to develop this document.We would like to thank them for their dedication to this effort.Any standard involving a complex technology draws material from a vast number of sources.While the principal members of the Joint Moisture Classi?cation Working Group are shown below, it is not possible to include all of those who assisted in the evolution of this Standard.To each of them,the members of the JEDEC and IPC extend their gratitude.
IPC Plastic Chip Carrier Cracking Task Group,B-10a Chairman
Steven Martell
Sonoscan,Inc.JEDEC JC14.1
Committee
Chairman
Jack McCullen
Intel Corporation
JEDEC JC14
Chairman
Nick Lycoudes
Freescale Semiconductor
Joint Working Group Members
Doug Derry,AccuAssembly
Ranjit Gannamani,Advanced Micro Devices
Joseph Smetana,Alcatel-Lucent Russell Nowland,Alcatel-Lucent Bradley Smith,Allegro MicroSystems Inc.
Maurice Brodeur,Analog Devices Inc.
Bill Strachan,ASTA-Portsmouth University
Lyle Burhenn,BAE Systems Platform Solutions
Mary Bellon,Boeing Research& Development
Tim Chaudhry,Broadcom Corporation
Glenn Koscal,Carsem
Kevin Weston,Celestica
Jasbir Bath,Christopher Associates Inc.
Francois Monette,Cogiscan Inc. Erich Goertler,Continental Automotive GmbH
Michael Blazier,Delphi Electronics and Safety
Michael Pepples,Delphi Electronics and Safety
Stuart Longgood,Delphi Electronics and Safety
David Gaydos,DLG Technical Engineering
Joanne Shipe,DSM Engineering Plastics
Ralph Justus,EIA-Electronic Industries Alliance
Glenn Dearing,Endicott Interconnect Technologies Inc Dongkai Shangguan,Flextronics
International
Nicholas Lycoudes,Freescale
Semiconductor
Deepak Pai,General Dynamics Info.
Sys.,Inc
Gergely Csohany,Harman/Becker
Automotive Systems Kft.
Srinivas Chada,Henkel Corporation
Keith Newman,Hewlett-Packard
Company
Jennie Hwang,H-Technologies
Group
Charles Reynolds,IBM Corporation
Mario Interrante,IBM Corporation
Paul Krystek,IBM Corporation
Curtis Grosskopf,IBM Corporation
James Maguire,Intel Corporation
Jack McCullen,Intel Corporation
Mark Kwoka,Intersil Corporation
Kerry Oren,ITT
Quyen Chu,Jabil Circuit,Inc.
Marty Rodriguez,Jabil Circuit,Inc.
(HQ)
Girish Wable,Jabil Circuit,Inc.(HQ)
Julie Carlson,JEDEC
Ken McGhee,JEDEC
Akikazu Shibata,JPCA-Japan
Electronics Packaging and Circuits
Association
Leland Woodall,Keihin Carolina
System Technology
Leo Feinstein,Leo Feinstein
Associates
James Mark Bird,MBird and
Associates
Kurk Kan,Murata Power Solutions,
Inc.
Paul Melville,NXP Semiconductors
John Burke,Optichron Inc.
Heidi Reynolds,Oracle America,Inc.
Mumtaz Bora,Peregrine
Semiconductor
Arnold Offner,Phoenix Contact
Timothy Pitsch,Plexus Corporation
Elvira Preecha,Qualcomm Inc.
Richard Iodice,Raytheon Company
James Robbins,Raytheon Company
Jeff Shubrooks,Raytheon Company
Christian Klein,Robert Bosch GmbH
Scott Anson,Rochester Institute of
Technology
Michelle Ogihara,Seika Machinery
Inc.
Francis Classe,Spansion
Brent Beamer,Static Control
Components,Inc.
Raymond Cirimele,STI Electronics,
Inc.
Christine Blair,STMicroelectronics
Inc.
Amol Kirtikar,Sud-Chemie Inc.
Performance Packaging
Michelle Martin,Sud-Chemie
Performance Package
Robert DiMaggio,Sud-Chemie
Performance Package
Larry Nye,Texas Instruments Inc.
Joseph Thomas,ZN Technologies
James Whitehouse
February2012IPC/JEDEC J-STD-033C
iii
IPC/JEDEC J-STD-033C February2012
This Page Intentionally Left Blank
iv
Table of Contents
1FOREWORD (1)
1.1Purpose (1)
1.2Scope (1)
1.3Assembly Processes (1)
1.3.1Mass Re?ow (1)
1.3.2Localized Heating (1)
1.3.3Socketed Components (1)
1.3.4Point-to-Point Soldering (1)
1.3.5Aqueous Cleaning (1)
1.4Reliability (2)
1.5Terms and De?nitions (2)
1.5.1Active Desiccant (2)
1.5.2Bar Code Label (2)
1.5.3Bulk Re?ow (2)
1.5.4Carrier (2)
1.5.5Desiccant (2)
1.5.6Floor Life (2)
1.5.7Humidity Indicator Card(HIC) (2)
1.5.8Manufacturer’s Exposure Time(MET) (2)
1.5.9Moisture-Barrier Bag(MBB) (2)
1.5.10Moisture-Sensitive Identi?cation(MSID) (2)
1.5.11Rework (2)
1.5.12Shelf Life (2)
1.5.13SMD (2)
1.5.14Solder Re?ow (2)
1.5.15Water Vapor Transmission Rate(WVTR) (3)
2APPLICABLE DOCUMENTS(Normative) (3)
2.1American Society for Testing and Materials
(ASTM) (3)
2.2Electronic Industries Alliance(EIA,JEDEC) (3)
2.3IPC Standards (3)
2.4Joint Industry Standards (3)
2.5Department of Defense (3)
3DRY PACKING (3)
3.1Requirements (3)
3.2Drying of SMD Packages and Carrier
Materials Before Being Sealed in MBBs (3)
3.2.1Drying Requirements-Levels2a-5a (3)
3.2.2Drying Requirements for Carrier Materials (4)
3.2.3Drying Requirements (4)
3.2.4Excess Time Between Bake and Bag (4)
3.3Dry Pack (4)
3.3.1Description...........................................................43.3.2Materials (4)
3.3.3Labels (6)
3.3.4Moisture Barrier Bag Sealing (6)
3.3.5Dry-Pack Precautions (6)
3.3.6Shelf Life (7)
4DRYING (7)
4.1Post Exposure to Factory Ambient (7)
4.1.1Any Duration Exposure (7)
4.1.2Short Duration Exposure (10)
4.2General Considerations for Baking (10)
4.2.1High Temperature Carriers (10)
4.2.2Low Temperature Carriers (10)
4.2.3Paper and Plastic Container Items (10)
4.2.4Bakeout Times (10)
4.2.5ESD Protection (10)
4.2.6Reuse of Carriers (10)
4.2.7Solderability Limitations (10)
5USE (11)
5.1Incoming Bag Inspection (11)
5.1.1Upon Receipt (11)
5.1.2Component Inspection (11)
5.2Floor Life (11)
5.3Safe Storage (11)
5.3.1Dry Pack (11)
5.3.2Shelf Life (11)
5.3.3Dry Atmosphere Cabinet (11)
5.4Re?ow (12)
5.4.1Opened MBB (12)
5.4.2Re?ow Temperature Extremes (12)
5.4.3Additional Thermal Pro?le Parameters (12)
5.4.4Multiple Re?ow Passes (12)
5.4.5Maximum Re?ow Passes (12)
5.5Drying Indicators (12)
5.5.1Excess Humidity in the Dry Pack (12)
5.5.2Floor Life or Ambient Temperature/
Humidity Exceeded (13)
5.5.3Level6SMD Packages (13)
6BOARD REWORK (13)
6.1Component Removal,Rework,and Remount..13 6.1.1Removal for Failure Analysis (13)
6.1.2Removal and Remount (13)
6.2Baking of Populated Boards (13)
February2012IPC/JEDEC J-STD-033C
v
7DERATING DUE TO FACTORY
ENVIRONMENTAL CONDITIONS (13)
APPENDIX A Test Method for Humidity
Indicator Card used with
Electronic Component
Packaging (15)
APPENDIX B Derivation of Bake Tables (16)
APPENDIX C Changes in J-STD-033C (17)
Figures
Figure3-1Typical Dry-Pack Con?guration for Moisture-
Sensitive SMD Packages in Shipping Tubes (4)
Figure3-2Humidity Indicator Card(HIC)(Example) (5)
Figure3-3Moisture-Sensitive Identi?cation Label
(Example) (6)
Figure3-4Moisture-Sensitive Caution Label(Example) (6)
Figure3-5MBB with No Evacuation(Example) (7)
Figure3-6MBB with Recommended Light Air
Evacuation(Example).........................................7Figure3-7MBB with Too Much(Full)Evacuation
(Example) (7)
Figure A-1Photo of Testing Apparatus (15)
Tables
Table3-1Dry Packing Requirements (4)
Table3-2Typical HIC Spot Compliance (6)
Table4-1Reference Conditions for Drying Mounted
or Unmounted SMD Packages(User
Bake:Floor life begins counting at
time=0after bake) (8)
Table4-2Default Baking Times Used Prior to Dry-
Pack that were Exposed to Conditions
≤60%RH(MET=24h) (9)
Table4-3Resetting or Pausing the‘‘Floor Life’’
Clock at User Site (9)
Table5-1Moisture Classi?cation Level and Floor Life (11)
Table7-1Recommended Equivalent Total Floor Life
(days)@20°C,25°C&30°C,35°C
For ICs with Novolac,Biphenyl and
Multifunctional Epoxies(Re?ow at same
temperature at which the component
was classi?ed)Maximum Percent
Relative Humidity (14)
IPC/JEDEC J-STD-033C February2012 vi
February2012IPC/JEDEC J-STD-033C Handling,Packing,Shipping,and Use of Moisture/ Reflow and/or Process Sensitive Components
1FOREWORD
The advent of surface mount devices(SMDs)introduced a new class of quality and reliability concerns regarding damage from the solder re?ow process,such as cracks and delamination.This document describes the standardized levels of?oor-life exposure for moisture/re?ow sensitive SMDs along with the handling,packing,and shipping requirements necessary to avoid moisture/re?ow related https://www.wendangku.net/doc/db976449.html,panion documents J-STD-020and J-STD-075de?ne the classi?cation procedure and JEP113de?nes the labeling requirements.
For moisture sensitivity,moisture from atmospheric humidity enters permeable packaging materials by diffusion.Assembly processes used to solder SMDs to printed circuit boards(PCBs)expose the entire package body to temperatures higher than 200°C.During solder re?ow,the combination of rapid moisture expansion,materials mismatch,and material interface deg-radation can result in cracking and/or delamination of critical interfaces within the device.
Typical solder re?ow processes of concern for all devices are infrared(IR),convection/IR,convection,vapor phase re?ow (VPR),hot air rework tools,and wave solder,including full immersion.
Non-semiconductor devices may exhibit additional process sensitivities beyond moisture sensitivity such as thermal sensi-tivity,?ux sensitivity,or cleaning process sensitivity.
1.1Purpose The purpose of this document is to provide manufacturers and users with standardized methods for handling, packing,shipping,and use of moisture/re?ow and process sensitive devices that have been classi?ed to the levels de?ned in J-STD-020or J-STD-075.These methods are provided to avoid damage from moisture absorption and exposure to sol-der re?ow temperatures that can result in yield and reliability degradation.By using these procedures,safe and damage-free re?ow can be achieved.The dry-packing process de?ned herein provides a minimum shelf life of12months from the seal date.
1.2Scope This standard applies to all devices subjected to bulk solder re?ow processes during PCB assembly,including plastic encapsulated packages,process sensitive devices,and other moisture sensitive devices made with moisture-permeable materials(epoxies,silicones,etc.)that are exposed to the ambient air.
1.3Assembly Processes
1.3.1Mass Reflow This standard applies to bulk solder re?ow assembly by infrared(IR),convection/IR,convection,and vapor phase re?ow(VPR)processes.It does not apply to bulk solder re?ow processes that immerse the component bodies in molten solder(e.g.,wave soldering bottom mounted components).Such processes are not allowed for many SMDs and are not covered by the component quali?cations standards used as a basis for this document.
1.3.2Localized Heating This standard also applies to moisture/re?ow sensitive SMD packages that are removed or attached singly by local ambient heating,i.e.,hot air rework.(Refer to Clause6.)
1.3.3Socketed Components This standard does not apply to SMD packages that are socketed and not exposed to solder re?ow temperatures during either bulk re?ow or rework of adjacent devices.Such SMD packages are not at risk and do not require moisture precautionary handling.
1.3.4Point-to-Point Soldering This standard does not apply to SMD packages in which only the leads are heated to re?ow the solder(e.g.,hand-soldering,hot bar attach of gull wing leads,and through hole by wave soldering).The heat absorbed by the package body from such operations is typically much lower than for bulk surface mount re?ow or hot air rework and moisture precautionary measures are typically not needed.
1.3.5Aqueous Cleaning For non-cavity SMDs,typical short term aqueous cleaning processes will not impact the?oor life(internal moisture content).Special consideration should be given to non-hermetic cavity packages.
1
IPC/JEDEC J-STD-033C February2012 1.4Reliability The methods set forth in this speci?cation ensure that an adequate SMD package reliability can be achieved during and after the PCB assembly operation,when the SMD packages are evaluated and veri?ed by J-STD-020,J-STD-075,and/or by JESD22-A113plus environmental reliability testing.
Note:This speci?cation does not address or ensure solder joint reliability of external interconnects for attached components.
1.5Terms and Definitions
1.5.1Active Desiccant Desiccant that is either fresh(new)or has been baked according to the manufacturer’s recommen-dations to renew it to original speci?cations.
1.5.2Bar Code Label A manufacturer’s label that includes information in a code consisting of parallel bars and spaces or a2-D matrix format.
Note:For the purpose of this standard,the bar code label is on the lowest level shipping container and includes informa-tion that describes the product(e.g.,part number,quantity,lot information,supplier identi?cation,and moisture-sensitivity level).
1.5.3Bulk Reflow Re?ow of multiple components with simultaneous attachment by an infrared(IR),convection/IR,con-vection,or vapor phase re?ow(VPR)process.
1.5.4Carrier A pocket tape,tray,tube,or other?xture used to store and transport devices and components.
1.5.5Desiccant An absorbent material used to maintain a low relative humidity.
1.5.6Floor Life The allowable time period between removal of moisture-sensitive devices from a moisture-barrier bag, dry storage,or dry bake and the solder process.
1.5.7Humidity Indicator Card(HIC)A card on which a moisture-sensitive chemical is applied such that it will make a signi?cant,perceptible change in color(hue),typically from blue(dry)to pink(wet)when the indicated relative humidity is exceeded.
Note:The HIC is packed inside the moisture-barrier bag,along with a desiccant,to aid in determining the level of mois-ture to which the moisture-sensitive devices have been subjected.
1.5.8Manufacturer’s Exposure Time(MET)The maximum cumulative time after bake that components may be exposed to ambient conditions prior to shipment to end user.
1.5.9Moisture-Barrier Bag(MBB)A bag designed to restrict the transmission of water vapor and used to pack moisture-sensitive devices.
1.5.10Moisture-Sensitive Identification(MSID)A symbol indicating that the contents are moisture sensitive.
1.5.11Rework The removal of a component for scrap,reuse,or failure analysis;the replacement of an attached compo-nent;or the heating and repositioning of a previously attached component.
1.5.12Shelf Life The minimum time that a dry-packed,moisture-sensitive device can be stored in an unopened moisture barrier bag(MBB)such that a speci?ed interior bag ambient humidity is not exceeded.
1.5.13SMD Surface mount device.
Note:For the purpose of this standard,SMD is restricted to include only plastic-encapsulated SMDs and other packages made with moisture-permeable materials.
1.5.14Solder Reflow A solder attachment process in which previously applied solder or solder paste is melted to attach
a component to a printed circuit board.
2
February2012IPC/JEDEC J-STD-033C 1.5.15Water Vapor Transmission Rate(WVTR)A measure of the permeability of plastic?lm or metallized plastic?lm material to moisture.
2APPLICABLE DOCUMENTS(Normative)
2.1American Society for Testing and Materials(ASTM)1
ASTM F1249Standard Test Method for Water Vapor Transmission Rate Through Plastic Film and Sheeting Using a Modu-lated Infrared Sensor.
ASTM F392Standard Test Method for Flex Durability of Flexible Barrier Materials
2.2Electronic Industries Alliance(EIA,JEDEC)2
EIA-541Packaging Material Standards for ESD Sensitive Items
JESD625Requirements for Handling Electrostatic Discharge Sensitive Devices(ESDS)
JEP113Symbol and Labels for Moisture Sensitive Devices
JESD22-A113Preconditioning of Non-hermetic Surface Mount Components Prior to Reliability Testing
JESD22-A120Test Method for the Measurement of Moisture Diffusivity and Water Solubility in Organic Materials Used in Integrated Circuits
2.3IPC Standards3
IPC-7711Rework of Electronic Assemblies
IPC-7721Repair and Modi?cation of Printed Boards and Electronic Assemblies
2.4Joint Industry Standards4
J-STD-020Moisture/Re?ow Sensitivity Classi?cation for Non-hermetic Solid State Surface Mount Devices
J-STD-075Classi?cation of Non-IC Electronic Components for Assembly Processes
2.5Department of Defense5
MIL-PRF-81705Type I-Barrier Materials Flexible,Electrostatic-free,Heat Sealable
MIL-D-3464Type II-Desiccant,Activated,Bagged,Packaging Use and Static Dehumidi?cation
3DRY PACKING
3.1Requirements Dry-packing requirements for the various moisture sensitivity levels are shown in Table3-1.The lev-els are determined per J-STD-020,J-STD-075,and/or per JESD22-A113plus environmental reliability testing.As a mini-mum,all materials used in dry packing should conform to EIA-541.
3.2Drying of SMD Packages and Carrier Materials Before Being Sealed in MBBs
3.2.1Drying Requirements-Levels2a-5a SMD packages classi?ed at Levels2a through5a must be dried(see Clause
4)prior to being sealed in MBBs.The period between drying and sealing must not exceed the MET less the time allowed for distributors to open the bags and repack parts.If the supplier’s actual MET is more than the default24hours,then the
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3
actual MET must be used.If the distributor practice is to repack the MBBs with active desiccant,then this time does not need to be subtracted from the MET.
3.2.2Drying Requirements for Carrier Materials Carrier materials,such as trays,tubes,reels,etc.,that are placed in the
MBB can affect the moisture level within the MBB.Therefore,the effect of these materials must be compensated for by baking or,if required,adding additional desiccant in the MBB to ensure the shelf life of the SMD packages.
3.2.3Drying Requirements Suppliers may use the drying effect of normal in-line processes such as post mold cure,
marking cure,and burn-in to reduce the bake time.An equivalency evaluation is recommended to ensure that high tem-perature processing maintains moisture weight gain to an acceptable level.The total weight gain for the SMD package at the time it is sealed in the MBB must not exceed the moisture gain of that package starting dry and then being exposed to 30°C/60%RH for MET hours (less the time for distributors).
3.2.4Excess Time Between Bake and Bag
If the allowable time between bake and bag is exceeded,the SMD packages
must be dried again per Clause 4.
3.3Dry Pack
3.3.1Description Dry pack
and a humidity indicator card packages inside a moisture barrier tive dry-pack con?guration is shown 3.3.2Materials
3.3.2.1Moisture Barrier Bag bag shall meet MIL-PRF-81705,for ?exibility,ESD protection,ture resistance.The bags shall be Vapor Transmission Rate (WVTR)(0.002g/100in 2)in 24hrs at 40°C dition ‘‘E’’ASTM F 392.The ASTM F 1249.
3.3.2.2Desiccant The desiccant D-3464,Type II.Desiccant shall be and absorbent to amounts speci?ed in the standard.Desiccant has a very limited ?oor life and should be stored and handled per the manufacturer’s recommendation prior to insertion in
the MBB.The desiccant material shall be packaged in moisture permeable bags or pouches.The amount of desiccant used,per moisture barrier bag,shall be based on the bag surface area and WVTR in order to limit the interior relative humidity in the MBB,at the end of the calculated shelf life,to less than 10%at 25°C.
For comparison between various desiccant types,military speci?cations adopted the UNIT as the basic unit of measure of quantity for desiccant material.A UNIT of desiccant is de?ned as the amount that will absorb a minimum of 2.85g of water vapor at 20%RH and 25°C.
Table 3-1Dry Packing Requirements
Level
Dry Before Bag
MBB With HIC
Desiccant
MSID Label
Caution Label
1Optional Optional Optional Not Required Not Required if classi?ed at 220-225°C [428-437°F]Required*if classi?ed at
other than 220-225°C [428-437°F]
2Optional Required Required Required Required 2a-5a Required Required Required Required Required 6
Optional
Optional
Optional
Required
Required
*A ‘‘Caution’’label is not required if level and re?ow temperature are given,in human readable form,on the barcode label attached to the lowest level shipping container.
Figure 3-1Typical Dry-Pack Con?guration for Moisture--Sensitive SMD Packages in Shipping Tubes IPC/JEDEC J-STD-033C
February 2012
4
3.3.2.2.1Desiccant Quantity Calculation When the desiccant capacity at 10%RH and 25°C is known,the following
equation should be used:
U =(0.304*M *WVTR *A)/D
Where:
U =Amount of desiccant in UNITS
M =Shelf life desired in months (see Clause 3.3.6for shelf life)WVTR =Water vapor transmission rate in grams/m 2in 24hrs.A =Total exposed surface area of the MBB in square decimeters
D =The amount of water in grams,that a UNIT of desiccant will absorb at 10%RH and 25°C
When the desiccant capacity at 10%RH and 25°C is not known a conservative value of D =1.40can be used.
Note 1:If it is desired to minimize the amount of desiccant used for dry-packing level 2components,a value of D based on the amount of water in grams,that a UNIT of desiccant will absorb at 60%RH and 25°C must be used in the formula.This value should to be obtained from the desiccant manufacturer.When this option is used,it must be veri?ed that when the component was classi?ed per J-STD-020it must have achieved full saturation during moisture soak.
Note 2:No moisture-absorbing material (e.g.,trays,tubes,reels,foam end caps)should be placed in the dry bag without baking.Any such material that is included increases the amount of desiccant needed to meet the calculated shelf life (see Clause 5.3.1)by an amount based on the moisture content of the material.This can be determined by weighing a represen-tative quantity of material known to be at equilibrium with the manufacturing environment,baking to a new constant weight,and subtracting the ?nal from the initial weight.
Additional UNIT(s)of desiccant,based on 10%RH at 25°C,must be added to absorb the amount of water,in grams,egressed from the packing materials (dunnage)after baking.
3.3.2.2.2Desiccant Handling and Storage Desiccant capacity decreases rapidly when exposed to 30°C/60%RH.There-
fore the desiccant should remain in the manufacturer’s container or stored in a dry cabinet at <5%RH until use.When dry packing,the desiccant shall be removed from the storage container just prior to placing it into the MBB and sealing the MBB.
3.3.2.3Humidity Indicator Card (HIC)At minimum,the HIC shall have
three (3)color spots with sensitivity values of 5%,10%,and 60%RH.An example HIC is shown in Figure 3-2.The spots shall indicate the humidity with a signi?cant,perceptible change in color (hue)as indicated in Table 3-2.Hue shall be tested using the test method in Appendix A.The colors shall be described in writing on the card.The 5%and 10%HIC spots shall be reversible to allow reuse.HIC reuse is not allowed if the 60%spot has changed color.Reuse is not allowed,due to loss of accuracy of the 5%and 10%spot chemistry,if the 60%spot has changed color.It is not required to reuse the same HIC from the MBB if the MBB is to be resealed;a fresh HIC may be used.At a 30°C/60%RH environment the 5%spot shall begin to change from dry indication in a maximum of 4minutes and complete change (to wet indication)in 7minutes and the 10%spot shall begin to change from dry indication in a maximum of 6minutes and complete change (to wet indi-cation)within 10minutes when removed from manufacturer’s original con-tainer.
3.3.2.3.1HIC Paper White blotting paper made from ?brous,cellulosic
material,with a minimum basis weight of,255g/m 2(equivalent to a nomi-nal 170pounds basis weight)shall be used for HICs.
3.3.2.3.2Visual Defects
HICs shall be free from defects including missing spots,tears,improperly located spots,and
indicating color overrunning the black circles.
3.3.2.3.3Preservation HICs should be stored per the manufacturer’s recommendation prior to insertion in the MBB.At
a minimum,the 10%spot shall indicate dry when the cards are removed from the original container.
HUMIDITY INDICATOR
Complies with IPC/JEDEC J-STD-033
LEVEL 2 PARTS LEVEL 2A-5A PARTS Bake parts if 60% is NOT blue Bake parts if 10% is NOT blue and 5%is pink
Do not put this
card into a bag if 60% is pink
M a n u f a c t u r e r I d e n t i f i c a t i o n L o t N u m b e r
60%
10%
5%
IPC-033c-3-2
Figure 3-2Humidity Indicator Card (HIC)
(Example)
February 2012IPC/JEDEC J-STD-033C
5
3.3.3Labels
3.3.3.1Labels -Moisture Sensitive Identification
Labels relevant to the dry-pack process
are the moisture-sensitive identi?cation’’(MSID)label and the caution label as speci?ed in JEDEC JEP113(see Figures 3-3and 3-4).The MSID label shall be affixed to the lowest-level shipping container that contains the MBB.The caution label shall be affixed to the outside surface of the MBB.The caution label includes ?elds for the moisture classi?cation level per J-STD-020or process classi?cation level per J-STD-075;the peak package body temperature allowed during re?ow soldering (the classi?cation temperature);the ?oor life;and the bag seal date.If the calculated shelf life is greater than 12months,item #1of the caution label should be changed accordingly.
3.3.3.2Labels -Level 6Requirements Level 6parts not shipped in MBBs shall have both
an MSID
affixed to 3.3.3.3parts maximum moisture other than re?ow the caution or to the tion label includes re?ow form.
3.3.4shall be 3.3.53.3.5.1anywhere under a Table 3-2
Typical HIC Spot Compliance
Indication at 2%RH Environment
Indication at 5%RH Environment
Indication at 10%RH Environment
Indication at 55%RH Environment
Indication at 60%RH Environment
Indication at 65%RH Environment
5%Spot Blue (dry)Lavender (spot value)change ≥7%hue
Pink (wet)
Pink (wet)Pink (wet)Pink (wet)10%Spot Blue (dry)Blue (dry)Lavender (spot value)change ≥10%hue
Pink (wet)Pink (wet)
Pink (wet)60%Spot
Blue (dry)
Blue (dry)
Blue (dry)
Blue (dry)
Lavender (spot value)change ≥10%hue
Pink (wet)
Note:Other color schemes may be used.
Figure 3-3Moisture--Sensitive Identi?cation Label (Example)
Figure 3-4Moisture-Sensitive Caution Label (Example)
IPC/JEDEC J-STD-033C
February 2012
6
3.3.5.2HIC Reuse
3.3.5.2.1HIC with10%RH Indicated HIC cards where the10%spot indicates wet shall not be used/reused if the bag will be opened and the HIC card inspected within48hours.
3.3.5.2.2HIC with60%RH Indicated HIC shall be discarded if the60%spot has indicated wet.HICs that have been exposed to60%or greater RH will no longer be accurate.
3.3.5.3Moisture Barrier Bag Sealing In actual practice air evacuation is not required(Figure3-5).Light air evacuation may be used to reduce the packaging bulk and enhance carton packing(Figure3-6).Full evacuation shall not be used as it will impede desiccant and HIC performance and possibly lead to MBB puncture(Figure3-7).
3.3.6Shelf Life The calculated shelf life for dry-packed SMD packages shall be a minimum of12months from the bag seal date,when stored in a non-condensing atmospheric environment of<40°C/90%RH.If the calculated shelf life is greater than12months,item#1of the caution label should be changed accordingly(see Figure3-4).
Figure3-5MBB with No Evacuation(Example)
IPC-033c-3-6
with Recommended Light Air Evacuation
February2012IPC/JEDEC J-STD-033C
Table4-1Reference Conditions for Drying Mounted or Unmounted SMD Packages(User Bake:Floor life begins counting at time=0after bake)
Package Body Level
Bake@125°C+10/-0°C
Bake@90°C+8/-0°C
≤5%RH
Bake@40°C+5/-0°C
≤5%RH Exceeding
Floor Life
by>72h
Exceeding
Floor Life
by≤72h
Exceeding
Floor Life
by>72h
Exceeding
Floor Life
by≤72h
Exceeding
Floor Life
by>72h
Exceeding
Floor Life
by≤72h
Thickness ≤1.4mm
25hours3hours17hours11hours8days5days 2a7hours5hours23hours13hours9days7days 39hours7hours33hours23hours13days9days 411hours7hours37hours23hours15days9days 512hours7hours41hours24hours17days10days 5a16hours10hours54hours24hours22days10days
Thickness >1.4mm ≤2.0mm
218hours15hours63hours2days25days20days 2a21hours16hours3days2days29days22days 327hours17hours4days2days37days23days 434hours20hours5days3days47days28days 540hours25hours6days4days57days35days 5a48hours40hours8days6days79days56days
Thickness >2.0mm ≤4.5mm
248hours48hours10days7days79days67days 2a48hours48hours10days7days79days67days 348hours48hours10days8days79days67days 448hours48hours10days10days79days67days 548hours48hours10days10days79days67days 5a48hours48hours10days10days79days67days
BGA package >17mm x17mm or any stacked
die package 2-5a96hours
(See Note2)
As above
per package
thickness and
moisture level
Not applicable As above
per package
thickness and
moisture level
Not applicable As above
per package
thickness and
moisture level
Note1:Table4-1is based on worst-case molded lead frame SMD https://www.wendangku.net/doc/db976449.html,ers may reduce the actual bake time if technically justi?ed(e.g.,absorption/ desorption data,etc.).In most cases it is applicable to other nonhermetic surface mount SMD packages.If parts have been exposed to>60%RH it may be necessary to increase the bake time by tracking desorption data to ensure parts are dry.
Note2:For BGA packages>17mm x17mm,that do not have internal planes that block the moisture diffusion path in the substrate,may use bake times based on the thickness/moisture level portion of the table.
Note3:If baking of packages>4.5mm thick is required see appendix B.
IPC/JEDEC J-STD-033C February2012 8
Table4-2Default Baking Times Used Prior to Dry-Pack
that were Exposed to Conditions≤60%RH(MET=24h)
Package Body Thickness Level Bake@125°C+10/-0°C Bake@150°C+10/-0°C
≤1.4mm
2
2a
3
4
5
5a
7hours
8hours
16hours
21hours
24hours
28hours
3hours
4hours
8hours
10hours
12hours
14hours
>1.4mm ≤2.0mm
2
2a
3
4
5
5a
18hours
23hours
43hours
48hours
48hours
48hours
9hours
11hours
21hours
24hours
24hours
24hours
>2.0mm ≤4.5mm
2
2a
3
4
5
5a
48hours
48hours
48hours
48hours
48hours
48hours
24hours
24hours
24hours
24hours
24hours
24hours
Note1:If baking of packages>4.5mm thick is required see appendix B.
Note2:The bake times speci?ed are conservative for packages without blocking planes or stacked die.For a stacked die or BGA package with internal planes that impede moisture diffusion the actual bake time may be longer than that required in Table4-2if packages have had extended exposure to factory ambient before bake.Also the actual bake time may be reduced if technically justi?ed.The increase or decrease in bake time shall be determined using the procedure in JEDEC JESD22-A120(i.e.,<0.002%weight loss between successive readouts)or per critical interface concentration calculations.
Table4-3Resetting or Pausing the‘‘Floor Life’’Clock at User Site
Moisture Sensitivity
Level Exposure Time@
Temp/Humidity Floor Life
Desiccator Time@
Relative Humidity Bake Reset Shelf Life
2,2a,3,4,5,5a
Anytime
≤40°C/85%RH reset NA Table4.1
Dry Pack
after Bake
2,2a,3,4,5,5a
>?oor life
≤30°C/60%RH reset NA Table4.1
Dry Pack
after Bake
2,3,3
>12hrs
≤30°C/60%RH reset NA Table4.1
Dry Pack
after Bake
2,2a,3
≤12hrs
≤30°C/60%RH reset
5X exposure time
≤10%RH NA NA
4,5,5a
>8hrs
≤30°C/60%RH reset NA Table4.1
Dry Pack
after Bake
4,5,5a
≤8hrs
≤30°C/60%RH reset
10X exposure time
≤5%RH NA NA
2,2a,3Cumulative time
≤30°C/60%RH
pause
Anytime
≤10%RH NA NA
February2012IPC/JEDEC J-STD-033C
9
IPC/JEDEC J-STD-033C February2012 4.1.2Short Duration Exposure Previously dry SMD packages,which have been exposed only to ambient conditions not exceeding30°C/60%RH may be adequately dried by room temperature desiccation using dry pack or a dry cabinet.
4.1.2.1Moisture Sensitivity Levels2-3For moisture sensitivity Levels2,2a,3with?oor-life exposure not greater than 12hours,a minimum desiccating period of5X the exposure time is required to dry the SMD packages enough to reset the ?oor-life clock(see Table4-3).This can be accomplished by dry pack according to Clause3.3or a dry cabinet that is capable of maintaining not greater than10%RH.
For components exposed anytime less than their stated?oor life,dry packing or placing the components in a dry cabinet maintaining not greater than10%RH,will stop/pause the?oor-life clock as long as the cumulative?oor life meets the con-ditions in Table5-1and/or Table7-1.
4.1.2.2Moisture Sensitivity Levels4,5,5a For moisture sensitivity Levels4,5,5a with?oor-life exposure not greater than8hours,a minimum desiccating period of10X the exposure time is required to dry the SMD packages enough to reset the?oor-life clock(see Table4-3).This can be accomplished by a dry cabinet that is capable of maintaining not greater than5%RH.
Once the?oor-life clock has been reset,refer to Clause5.3for safe storage conditions.
4.2General Considerations for Baking The oven used for baking shall be vented and capable of maintaining the required temperatures at less than5%RH.
4.2.1High Temperature Carriers Unless otherwise indicated by the manufacturer,SMD packages shipped in high tem-perature carriers can be baked in the carriers at125°C.
4.2.2Low Temperature Carriers SMD packages shipped in low temperature carriers may not be baked in the carriers at any temperature higher than40°C.If a higher bake temperature is required,SMD packages must be removed from the low temperature carriers to thermally safe carriers,baked,and returned to the low temperature carriers.
Note1:Manual handling may increase the risk of mechanical and/or ESD damage.
Note2:If SMD packages are placed in dry bags with unbaked carriers,refer to Clause3.3.2.2.
4.2.3Paper and Plastic Container Items Paper and plastic container items such as cardboard boxes,bubble pack,plas-tic wrap,etc.,shall be removed from around the carriers prior to baking.Rubber bands around tubes and plastic tray ties must also be removed prior to high temperature(125°C)bake.
4.2.4Bakeout Times Bakeout times start when all SMD packages reach the speci?ed temperature.
4.2.5ESD Protection Proper ESD handling precautions shall be observed,per JESD62
5.This is particularly critical if SMD packages are handled under low humidity conditions(e.g.,in a dry environment,after baking,etc.).
4.2.6Reuse of Carriers The appropriate materials speci?cation should be consulted before reusing carriers.
4.2.7Solderability Limitations
4.2.7.1Oxidation Risk Baking SMD packages may cause oxidation and/or intermetallic growth of the terminations,which if excessive can result in solderability problems during board assembly.The temperature and time for baking SMD pack-ages are therefore limited by solderability considerations.Unless otherwise indicated by the supplier,the cumulative bake time at a temperature greater than90°C and up to125°C should not exceed96hours.If the bake temperature is not greater than90°C,there is no practical limit on bake time.Bake temperatures higher than125°C are not allowed without consult-ing the supplier.
4.2.7.2Carrier Out-gassing Risk Care should be taken to ensure that out-gassing of materials from the component carri-ers does not occur to any signi?cant extent,such that solderability might be affected.
10
February2012IPC/JEDEC J-STD-033C
5USE
Upon opening the MBB,the?oor-life clock starts.If an MBB is opened and the ambient conditions are other than 30°C/60%RH,the procedures in Clause7should be followed.
5.1Incoming Bag Inspection
5.1.1Upon Receipt Dry-packed SMD packages should be inspected for a bag seal date located on the caution or bar code label to determine remaining shelf life.The bags should be inspected to verify there are no holes,gouges,tears,punctures, or openings of any kind that would expose either the contents or an inner layer of a multilayer bag.If openings are found and the humidity indicator card(HIC)indicates maximum humidity has been exceeded,then the parts should be baked for 48hours at125°C or using the saturated bake times of Table4-1.This will reset the?oor life if the parts to be used and shelf life if the parts are to be dry packed.
5.1.2Component Inspection Intact bags may be opened for component inspection by cutting at the top of the bag near the seal.If the bags are opened under factory ambient conditions,see Clause4.1.2.
5.2Floor Life The?oor life of SMDs per Table5-1will be modi?ed by environmental conditions other than 30°C/60%RH.Refer to Clause7to determine maximum allowable time before rebake would be necessary.If partial lots are used,the remaining SMD packages must be resealed or placed in safe storage within one hour of bag opening(see Clause5.3).If one hour exposure is exceeded,refer to Clause4.1.
Table5-1Moisture Classi?cation Level and Floor Life
Moisture Sensitivity Level Floor Life(out of bag)at factory ambient≤30°C/60%RH or as stated 1Unlimited at≤30°C/85%RH
21year
2a4weeks
3168hours
472hours
548hours
5a24hours
6Mandatory bake before use.After bake,must be re?owed within the time limit speci?ed on the label.
5.3Safe Storage Safe storage means dry SMD packages held in a controlled humidity condition such that the?oor-life clock remains at zero.Acceptable safe storage conditions for SMD packages classi?ed as Level2through5a are listed below.
5.3.1Dry Pack Dry-packed SMD packages in intact MBBs,stored per Clause3.3,shall have a calculated shelf life of at least12months from the bag seal date shown on the caution or bar code label.
5.3.2Shelf Life The minimum calculated shelf life is12months from bag seal date.If the actual shelf life has exceeded 12months,but less than2years,from the bag seal date and the humidity indicator card(HIC)(see Clause5.5.1)indicates that baking is not required,then it is safe to re?ow the components per the original MSL rating.Although unanticipated, factors other than moisture sensitivity could affect the total shelf life of components.
Note:An HIC that has been continuously sealed in the MBB is typically accurate for at least2years.
5.3.3Dry Atmosphere Cabinet A storage cabinet which maintains low humidity by purging with dry air or nitrogen at 25±5°C.The cabinet must be capable of recovering to its stated humidity rating within one hour from routine excursions such as door opening/closing.
5.3.3.1Dry Cabinet at10%RH SMD packages not sealed in a MBB may be placed in a dry atmosphere cabinet,main-tained at not greater than10%RH.A dry cabinet should not be considered a MBB.Storage of SMD packages in a dry cabi-net should be limited to a maximum time per Table7-1.If the time limit is exceeded the packages should be baked accord-ing to Table4-2to restore the?oor life.
11
IPC/JEDEC J-STD-033C February2012 5.3.3.2Dry Cabinet at5%RH SMD packages not sealed in a MBB may be placed in a dry atmosphere cabinet,main-tained at not greater than5%RH.Storage in a dry cabinet may be considered equivalent to storage in a dry pack with unlimited shelf life.
5.4Reflow Re?ow includes single and multi-pass assembly re?ow and single component attach/removal for rework.
5.4.1Opened MBB After a dry pack(MBB)has been opened,all SMD packages within that bag must complete all sol-der re?ow processing,including rework,prior to the stated?oor life,resealed in the MBB,or stored in a dry atmosphere cabinet per Clause4.1.If the?oor life or factory ambient conditions are exceeded,refer to Clause5.5.2.
5.4.2Reflow Temperature Extremes During re?ow the component body temperature must not exceed the rated value stated on the caution label.The body temperature during re?ow directly in?uences component reliability.
Note1:The component body temperature may be very different from the lead or solder ball temperature,particularly in IR and IR/convection processes,and should be checked separately.
Note2:Some hot air attach processes may require heating the component body to temperatures hotter than225°C.If that temperature exceeds the classi?cation temperature,moisture precautions and/or time-temperature limitations beyond the scope of this speci?cation may be required.The supplier should be consulted.
5.4.3Additional Thermal Profile Parameters During re?ow,the additional thermal pro?le parameters stated in JESD22-A113should not be exceeded.Although the body temperature during re?ow is the most critical parameter,other pro?le parameters such as the total exposure time to hot temperatures and the heating rates may also in?uence component reliability.
5.4.4Multiple Reflow Passes If more than one re?ow pass is used,care must be taken to ensure that no moisture sensi-tive SMD packages,mounted or unmounted,have exceeded their?oor life prior to the?nal pass.If any component on the board has exceeded its?oor life,the board needs to be baked prior to the next re?ow.Refer to Clause6for the baking of populated boards.
Note1:The?oor-life clock is NOT reset by any re?ow or rework process.
Note2:Water clean processes after the?rst re?ow can be an additional source of moisture for cavity packages in which water may be entrapped.This may present an additional risk,which should be evaluated.
5.4.5Maximum Reflow Passes A maximum of three re?ow passes is allowed per component.If more than three are required for any reason,the supplier should be consulted(reference J-STD-020).
5.5Drying Indicators Events and conditions that require component drying prior to re?ow or continued safe storage.
5.5.1Excess Humidity in the Dry Pack Excess humidity in the dry pack is noted by the humidity indicator card(HIC). It can occur due to misprocessing(e.g.,missing or inadequate desiccant),mishandling(e.g.,tears or rips in the MBB),or improper storage.The HIC should be read immediately upon removal from the MBB.For best accuracy,the HIC should be read at23±5°C.The following conditions apply regardless of the storage time(i.e.,whether or not the shelf life has been exceeded).
Note:Witness cards may be available from the HIC manufacturer if needed to con?rm the wet/dry colors.
5.5.1.1HIC Indication1If the5%,10%,and60%RH spots indicate dry,then Levels2,2a,3,4,5,and5a parts are still adequately dry.If the bag is to be resealed refer to Clause4.1.
5.5.1.2HIC Indication2If the5%RH spot indicates wet and the10%RH spot does not indicate dry,and the60%spot indicates dry,the Levels2a,3,4,5,and5a parts have been exposed to an excessive level of moisture,and drying shall be done per Clause4.Level2parts are still adequately dry.
5.5.1.3HIC Indication3If the5%,10%,and60%RH spots indicate wet,Level2parts have been exposed to an exces-sive level of moisture,and drying shall be done per Clause4.
Note:Discard HICs where the60%spot indicates wet.
12
设备安装检查记录
设备安装检查记录 通风机安装检查记录 工程名称东博煤矿通风机安装工程建设单位东博煤矿 内蒙古煤炭建设工程集团总公司技术监理施工部位 1#通风机安装监理单位部 执行标准 MT 5010-95 检查日期 2010年8月16日序检查项目允许偏差检查结果号 0.1 0.1 0.1 0.1 0 0 0 0 1 主轴及传动轴的水平度 0.1/1000 0.1 0.2 0.1 0.1 0.1 0 0.1 0.1 2 机体纵横向水平度 0.2/1000 1 2 1 0 -1 -1 1 0 3 轴流式通风机叶轮与机壳间隙 ?2mm 符合要求 4 通风机转子安装后检查 5 联轴器安装符合要求 6 轴流式通风机风叶角度符合要求 7 滑动轴承装配符合要求 检查结论: 符合标准规定 施工单位 监理单位: 吧验质检员: 项目技术负责人: 专业负责人: 收 意见 年月日年月日年月日 风门提升装置龙门架制作、安装检查记录 工程名称通风机安装工程建设单位东博煤矿
内蒙古煤炭建设工程集团总公司施工部位提升装置监理单位技术监理部执行标准 MT 5010-95 检查日期 2010年8月22日序号检查项目允许偏差检查 结果 1 原材料进场符合设计、有出厂合格证 2 焊条、焊剂 E43型，符合设计要求 3 焊工证书施焊人员有焊工证、均在施焊范围内 4 钢材切割无裂纹、夹层 5 焊材匹配点焊与焊接材料相同 6 焊缝外观无裂纹、气孔、夹渣 7 构件长、宽度 ?4 -1 2 8 表面平度 3/1000 2 3 9 焊缝宽窄差 1 0 1 10 焊缝高低差 3.5 2 2 11 错边 1.0 0 0 12 安装水平度 15/1000 2 13 安装位置 5 2 检查结论: 符合标准规定 监理单位: 施工单位 验 收质检员: 项目技术负责人: 专业负责人: 意见 年月日年月日年月日 绞车安装检查记录 工程名称通风机安装工程建设单位东博煤矿 内蒙古煤炭建设工程集团总公司施工部位提升绞车监理单位技术监理部执行标准 MT 5010-95 检查日期 2010年8月24日序号检查项目允许偏差检查 结果 1 垫铁、基础螺栓符合要求 2 主轴安装符合要求 3 滚筒组装符合要求 4 传动系统安装符合要求 5 制动系统安装符合要求 6 辅助装置安装符合要求 7 试运转合格 8 9 10 11 12 13 检查结论: 符合标准规定 监理单位: 施工单位
湿敏元器件管控规范
湿敏元器件管控规范 1目的 明确所有湿度敏感元件〈MSD〉的管控 2适用范围 适用于深圳合信达控制系统有限公司 3参考文件 无 4定义 湿敏元件（MSD）：指供应商来料时，使用防潮包装，且包装袋上有如下图1标记 或有特别注明为湿敏元器件。 元件的湿度敏感等级(MSL)：IPC将其分为1、2、2a、3、4、5、5a、6共8个等 级，其湿度敏感级别逐级递增. 防潮包装袋(MBB)：一种为了阻止水蒸气进入而设计用来包装湿敏元件的袋子。 干燥剂（Desiccant）：一种能够维持较低的相对湿度的吸附性材料。 湿度指示卡（HIC）：一张印有对湿度敏感的化学材料的卡片，当环境湿度发生变化 时，印在卡片上的化学材料的颜色也相应的改变〔一般由蓝色 （干燥时）变为粉红色（潮湿时）〕，用于对湿度监控。 暴露时间(Floor Life): 元件从拆除真空包装到焊接之前的时间，元件须暴露在不超 过30°C和60% RH的环境中。 保存限期(Shelf Life): 湿敏元件在真空且未开封的防潮包装袋的环境中可维持的有效时间。 5职责
5.1研发部负责制定或项目部负责接收和跟催相关单位（供应商、研发部）提供湿敏元 件清单. 5.2IQC验收供应商来料和对仓库储存的湿敏元件进行检验,确保状态良好。 5.3IPQC对生产线的湿敏元件的使用、贮存、烘烤进行实时稽查。 5.4仓库负责湿敏元件的接收,贮存和发放的控制。 5.5生产线人员在生产过程中对湿敏元件实施管控。 5.6工程部负责对湿敏元件清单的审核和转化为内部格式发行，负责对湿敏元件的管控 提供技术支持。 6内容 6.1湿敏元件识别： 6.1.1检查元件外包装的标签, 如果在外包装标签上有如图1的雨滴状标识，可认 定为湿敏元件。 图1 6.1.2湿度指示卡的识别与说明 6.1.2.1第一种湿度指示卡上有一“三角形箭头”（如下图2）,其对应所指向的 圆圈里化学物质若改变为粉红色则表示元件已受潮，需要烘烤。
整体包装项目解决方案操作流程图
整体包装解决方案（CPS）操作流程 随着国际产业分工的明细化，综合采购已成为顺应全球商贸发展的一种趋势。为帮助大中型制造业降低材料直接成本和管理成本，提高采购工作效率，我们建立了一套“综合包装服务”。本文的主要目的是介绍该系统的涵义，容，益处及合作指南。有关实施参阅具体流程和手册 I.综合包装服务供应体系 综合包装服务供应商是一个包装材料与服务供应的集成商，它对公司部和具有互补性的服务供应商所拥有的不同资源、能力和技术进行整合和管理，提供一整套包装服务解决方案。包括： A.参与客户包装设计 专业的技能和经验为客户提供最合适的方案；为客户在第一时间，在根源上降低成本。设计是制造业的灵魂。虽然设计与研发在整个成本构成中占的比例很小，但对产品成本影响很大, 如图1所示 提高客户响应市场的速度 B.为客户提供整套包装材料 享受规模效应带来的利益; 比如, 由于采购量较大, 在与供应商谈判中具有优势, 可 以得到较低的价格; 由于我们同时给多家公司提供服务, 可以降低其它管理成本。
C.供应网络体系优化 可以根据具体情况为客户提供合理仓储，运输等服务。 D.供应商管理库存 是一种通过合适的通讯方式持续补充关键产品库存管理方式。能够快速响应储藏位置，较高的库存周转，及合适的库存量等。 E.包装运作服务 根据不同的合作协议，可以为客户提供物理包装运作服务。 F.包装咨询服务 公司的设计人员，运作和客户服务的人员的专业技能随时可为客户提供各类咨询服务和现场指导参与设计。 G.废旧包装服务回收（绿色供应） 提供闭环供应服务，解决客户的费旧物料管理问题。 H.服务水平指标 客户仅通过服务水平指标就可以衡量成本，质量和交货期等方面的问题。 II.企业选择综合包装服务供应商的原因 企业考虑把包装材料设计与采购业务运作外包给综合包装服务供应商主要有两大驱动 力。第一，要把资源集中在企业的核心竞争能力上，以便获取最大的投资回报。那些不属于核心能力的功能应被弱化或者外包。而包装服务通常不被大多数的制造企业和分销企业视为他们的核心能力。第二，事实证明，企业单靠自己的力量降低包装材料费用存在很大的困难。主要是由于技术和管理方便能力不足。而我们公司的综合包装服务供应体系就能满足以上两个方面。 其具体特点如下： A.降低采购成本和采购管理成本 由于我们公司是专门的包装材料制造和采购服务商，可以使我们的客户享受到规模经营的利益，可以得到较低的价格。只与一家供应商联系而不象以前那样与多家联系. B.管理供应商，用专业的眼光管理供应商 C.降低最小起定量 由于我们的客户群体庞大，加上许多包装产品有一定的行业共性（如以下表格所示），当Lucent购置30PCS纸托盘时，无须考虑最低起定量，因为同样的产品NEC和IBM也在使用，资源得到最合理配置，减少一些物品所必须的最低定量。针对一些物品必须有的最低起定量， D. 仓储成本的改善与降低 你不必为你的仓库大小而犯愁，通常我们都在离客户10至50公里设置仓库服务，根据客户的计划和供货日期提供最便捷的服务。我们帮助你们解决库存场地，降低仓储成本。我们的供货是按生产线的需求供货，减少生产线以外的库存。24小时全天侯供货服务。 E.改善财政状况
在线设备安装调试报告
惠东县无害化垃圾处理场渗滤液处理中心 在线监控系统建设安装调试报告 按照国家环保要求以及《在线监测系统的安装调试规范（试行） 》， 我公司在建厂后就在总排口安装在线监测系统一套。 一、安装系统包括： COD在线分析仪 氨氮在线分析仪 总磷在线分析仪 超声波明渠流量计 PH计 污染源在线监控数据采集传输仪 二、设备的安装： 1. COD S备的安装 A. 拆箱检查所有备品备件齐全； B. 配制重铬酸钾-硫酸汞溶液、硫酸银溶液、邻苯标液、空白溶液、蒸馏水 等，并将试剂装入制定容器中待用。 C. 安装加热装置器件、检查设备内部线路完好加入蒸馏水等。
排口内，距监测房20m内；安装好取水管路系统，并由COD装置自动输出信号控制潜水泵自动取水；通电检查取水流量适中、压力满足在线取水要求。 E. 设备以数字信号传输方式通过以太网数据采集传输平台与在线监控 平台联网。 2. 氨氮设备的安装 A. 拆箱检查所有备品备件齐全； B. 配制纳氏显色剂溶液、酒石酸钾纳掩蔽剂溶液、硫代硫酸钠清洗剂试 剂、标液、蒸馏水，并将试剂装入制定容器中待用。 C. 取水系统的安装：设备采用370W潜水泵，取样位置设立于外排废水 总排口内，距监测房20m内；安装好取水管路系统，并由氨氮预处理装置自动输出信号控制潜水泵自动取水；通电检查取水流量适中、压力满足在线取水要求。 D. 设备以数字信号传输方式通过以太网数据采集传输平台与在线监控平台联网。 3. 总磷设备的安装 A. 拆箱检查所有备品备件齐全； B. 配制钼酸盐溶液、过硫酸钾溶液、抗坏血酸溶液、标液，并将试剂装入制定容器中待用。 C. 安装加热装置器件、检查设备内部线路完好加入蒸馏水等。
湿敏元器件管控要求规范
1目的 明确所有湿度敏感元件〈MSD〉的管控 2适用范围 适用于科盟（福州）电子科技有限公司 3参考文件 无 4定义 湿敏元件（MSD）：指供应商来料时，使用防潮包装，且包装袋上有如下图1标记或有特别注明为湿 敏元器件。 元件的湿度敏感等级(MSL)：IPC将其分为1、2、2a、3、4、5、5a、6共8个等级，其湿度敏感级别逐 级递增. 防潮包装袋(MBB)：一种为了阻止水蒸气进入而设计用来包装湿敏元件的袋子。 干燥剂（Desiccant）：一种能够维持较低的相对湿度的吸附性材料。 湿度指示卡（HIC）：一张印有对湿度敏感的化学材料的卡片，当环境湿度发生变化时，印在卡片上 的化学材料的颜色也相应的改变〔一般由蓝色（干燥时）变为粉红色（潮湿时）〕， 用于对湿度监控。 暴露时间(Floor Life): 元件从拆除真空包装到焊接之前的时间，元件须暴露在不超过30°C和60% RH的环境中。 保存限期(Shelf Life): 湿敏元件在真空且未开封的防潮包装袋的环境中可维持的有效时间。 5职责 5.1研发部负责制定或项目部负责接收和跟催相关单位（供应商、研发部）提供湿敏元件清单. 5.2IQC验收供应商来料和对仓库储存的湿敏元件进行检验,确保状态良好。 5.3IPQC对生产线的湿敏元件的使用、贮存、烘烤进行实时稽查。 5.4仓库负责湿敏元件的接收,贮存和发放的控制。 5.5生产线人员在生产过程中对湿敏元件实施管控。 5.6工程部负责对湿敏元件清单的审核和转化为内部格式发行，负责对湿敏元件的管控提供技术支持。6内容 6.1湿敏元件识别：
6.1.1 检查元件外包装的标签, 如果在外包装标签上有如图1的雨滴状标识，可认定为湿敏元件。 6.1.2 湿度指示卡的识别与说明 6.1.2.1 第一种湿度指示卡上有一“三角形箭头”（如下图2 ）,其对应所指向的圆圈里化学 物质若改变为粉红色则表示元件已受潮，需要烘烤。 6.1.2.2 第二种湿度指示卡只有三个湿度等级的圆圈组成（如下图3），其使用说明如下表 6.1.3 湿敏元件标志 湿敏元件的等级 保存期限
湿敏元件控制程序
湿敏元件控制程序 1目的 为潮湿敏感元件的包装、处理、搬运、储存提供指引。 2范围 适用于潮湿敏感元件的包装、处理、搬运、储存的整个过程。 3定义 车间寿命(Floor life) ——潮湿敏感元器件从防潮包装里取出后到进行干燥处理或生产流程的时间段 货架期(Shelf life) ——存储在未开封的防潮包装中的潮湿敏感元器件可以在内部湿度不超标的条件下保存的最小期限 MSL —— Moisture Sensitive Level 潮湿敏感等级 4职责、权限 PIE——提供、维护湿敏元件清单，维护保养干燥柜及湿敏元件烘烤炉。 QA——定期巡检湿敏元件控制情况，检查干燥柜及湿敏元件的校准、维护是否按要求实施，是否在有效期内 IQC——确保所有湿敏元件均按相应要求包装，确保所有湿敏元件的货架期在本文件所规定的有效期内 PD——按本控制方法操作、处理、使用湿敏元件。
5程序 5.1设备 干燥柜：柜内温度能控制在25+/-5o C之间，开柜后柜内温度能在1个 小时内恢复控制水平；柜对相对湿度≤10%。 烘烤柜：柜内相对湿度<5%，具通风/换气功能。 抽真空机 5.2来料检验/发放 5.2.1 在对湿敏元件进行来料检验时需要检查其包装是否符合湿敏 元件封装要求（表1），如果不符合此包装要求的元件应拒收。 表1、潮湿敏感元件包装要求 5.2.2 检查湿敏元件的货架期是否在自包装日起的6个月内，如果 超过此期限应当拒收。 5.2.3 原则上湿敏元件不能开封检查，如因特殊要求需要开封检查 时，检查环境必须控制在<30o C/60%RH以下，暴露时间不超过 30分钟。检查完成后仍然使用原包装材料如防潮剂等重新进
设备安装调试流程及规范
设备安装调试程序1.开箱验收 新设备到货后，由设备科，会同厂方进行开箱验收，检查设备在运输过程中有无损坏、丢失，附件、随机备件。专用工具、技术资料等是否与合同装箱单相符，并填写设备开箱验收单，存入设备档案，若有缺损及不合格现象应立即厂方代表交涉处理，索取或索赔。 2.设备安装施工 设备科会同设备使用科室及厂方，对设备的安装进行定位。对设备定位要考虑以下因素。 (1)应适应工艺流程的需要 (2)应便于使用者的医疗操作 (3)设备及其附属装置的外尺寸、运动部件的极限位置及安全距离 (4)应保证设备安装、维修、操作安全的要求 安装前要进行技术交底，组织施工人员认真学习设备的有关技术资料，了解设备性能及施工中应事项。 安装过程中，对基础的制作，装配链接、电气线路等项目的施工，要严格按照施工规范执行。整个安装过程设备科应派技术人员跟进，做好厂方和使用科室的沟通桥梁。
3.设备试运行 安装结束后，设备使用科室应与设备科及厂方一起对设备进行试运行，试运行前应充分检查电源和设备的接地是否良好。试运行时，对设备的各功能进行核准，发现问题及时解决。 4.设备安装工程的验收与移交使用。 (1)设备基础的施工验收由设备科，使用科室，厂方三方共同验收，填写施工验收单。 (2)设备安装工程的最后验收，在设备调试合格后进行。在安装、检查、安全、使用等各方面有关人员共同参加下进行验收，做出鉴定，填写试车运转记录等凭证和验收移交单由参加验收的各方人员签字方可竣工。 (3)设备验收合格后办理移交手续 设备开箱验收（或设备安装移交验收单）、设备运转试验记录单由参加验收的各方人员签字后及随设备带来的技术文件，由设备管理部门纳入设备档案管理；随设备的配件、备品，应填写备件入库单，送交设备仓库入库保管。
湿敏元件控制程序
目录 1目的 (3) 2范围 (3) 3定义 (3) 4职责、权限 (3) 5程序 (3) 6参考文件 (9) 7记录 (9) 8附件 (9)
1 目的 为潮湿敏感元件的包装、处理、搬运、储存提供指引。 2 范围 适用于潮湿敏感元件的包装、处理、搬运、储存的整个过程。 3 定义 车间寿命(Floor life) ——潮湿敏感元器件从防潮包装里取出后到进行干燥处理或生产流程的时间段 货架期(Shelf life) ——存储在未开封的防潮包装中的潮湿敏感元器件可以在内部湿度不超标的条件下保存的最小期限 MSL —— Moisture Sensitive Level 潮湿敏感等级 4 职责、权限 PIE——提供、维护湿敏元件清单，维护保养干燥柜及湿敏元件烘烤炉。 QA——定期巡检湿敏元件控制情况，检查干燥柜及湿敏元件的校准、维护是否按要求实施，是否在有效期内 IQC——确保所有湿敏元件均按相应要求包装，确保所有湿敏元件的货架期在本文件所规定的有效期内 PD——按本控制方法操作、处理、使用湿敏元件。 5 程序 5.1 设备 干燥柜：柜内温度能控制在25+/-5o C之间，开柜后柜内温度能在1个小时内恢复控 制水平；柜对相对湿度≤10%。 烘烤柜：柜内相对湿度<5%，具通风/换气功能。 抽真空机 5.2 来料检验/发放 5.2.1 在对湿敏元件进行来料检验时需要检查其包装是否符合湿敏元件封装要 求（表1），如果不符合此包装要求的元件应拒收。 应当拒收。 5.2.3 原则上湿敏元件不能开封检查，如因特殊要求需要开封检查时，检查环
境必须控制在
<30o C/60%RH以下，暴露时间不超过30分钟。检查完成后仍然使用原包 装材料如防潮剂等重新进行真空包装并填写《湿敏元件时间控制卡》（附 件1）。 5.2.4 在进行物料发放时如果需要将湿敏元件拆开包装后分发，需要在满足 5.2.3所要求环境中拆分并填写《湿敏元件时间控制卡》并分别按表1 的要求进行真空包装。 5.2.5 如果在检查湿敏元件时发现包装破损、漏气等应拒收此物料。 5.3 5.3.1 开始使用湿敏元件之前需要检查元件的真空包装是否完好，有没有漏气 的情况。开封后检查湿度指示卡（图1）的读数，并根据表3或湿度指示 卡上的说明进行判定。如果指示卡显示物料受潮则需要进行烘烤或干燥 柜常温去湿。 图1 典型湿度指示卡 用完毕后的剩余物料在退仓或退线时必须重新进行真空包装并需要按表
包装作业指导书
包装作业指导书 1
1. 目的 规范包装工序包材制作作业人员的工作流程，明确作业要求，使作业人员操作有据可依，减少和避免人为操作不当导致的质量问题。 2. 适用范围 适用于生产加工中心包装工序的包材制作。 3．作业流程及要求 作业流程图示品质控制要点设备/工 装 1、对照任务单确认产品型号规格，查找需包装型号规格产品的“包装图”，依照“包装图”上产品包装纸箱的尺寸进行核算，开领料票据领取相对应的纸箱、纸皮，然后使用卷尺对纸皮进行测量并划线。1、“包装图”与实物 型号相符； 2、尺寸测量正确无 误； 3、纸箱底箱尺寸可比 实物长和宽各加5cm， 高加 1.5cm，纸箱盖比 底长和宽各加2cm。 卷尺 螺丝刀 木板条 2、使用手板锯沿所划线对纸皮进行裁切，切好后对照纸箱高度尺寸周圈用螺丝刀划线、开豁、对折。 标准产品用外购成品箱包装。 成品纸箱使用订箱机进行订箱。1、严格按照所划线进 行裁切，无倾斜，边缘 整齐无毛边、无开裂； 2、裁切后尺寸正确； 3、试装合格。 手板锯 订箱机 卷尺 螺丝刀 3、依据“包装图”要求裁切所需珍珠棉、泡沫板。1、尺寸正确； 2、边缘整齐无毛边、 无开裂。 卷尺 刀片 木板条 泡沫裁 切机 4、将制作好的纸箱、珍珠棉及泡沫 板转入下道工序。 应做好产品标识。/
1. 目的 规范包装工序五金件配制作业人员的工作流程，明确作业要求，使作业人员操作有据可依，减少和避免人为操作不当导致的质量问题。 2. 适用范围 适用于生产加工中心包装工序的配五金件。 3．作业流程及要求 作业流程图示品质控制要点设备/工 装 1、对照任务单确认产品型号规格，查找需包装型号规格产品的“安装图”，依照“安装图”上所列配件清单逐一进行配制。1、“安装图”与实物 型号相符； 2、在配件前应与试装 组人员进行核对，实际 与“安装图”配件清单 不相符的应通知设计部 更改“安装图”后再进 行配制； 3、配件数量正确，应 与“安装图”相符； 4、易损坏之配件可多 配1~2个。 / 2、将配制好的五金件装入配件袋并 封好，在配件袋外面绑上红丝带。 应按要求系上红丝带。/ 3、将检验合格的腿子装入裁好的热塑膜内使用热风枪加热进行吸塑。1、吸塑良好，热塑膜 应完好无破损； 2、注意轻拿轻放，防 止碰伤； 3、要求配五金件的应 按要求放置。 热风枪 脚踏式 加热裁 切机 4确认无误后将装好的配件袋及吸 塑好的腿子转入下道工序。 应做好产品标识。/
插件贴片湿敏元器件管理与储存程序
插件贴片湿敏元器件管理与储存程序 1 目的 为规范对湿度有特殊要求或包装上有湿敏组件标记的组件进行有效的管理；以提供物料储存及制造环境的温湿度管制范围，以确保温湿度敏感元器件性能的可靠性。 2 范围 适用于所有对湿敏组件的储存；适用于PCB及IC(BGA、QFP)等温湿度敏感组件储存环境的管制。 3 定义 湿敏组件是指对湿度有特殊要求的组件； 湿敏识别标签=MSD； SMT工厂确认防潮区域的温湿度计显示环境温度不能超过20℃～27℃，防潮箱相对湿度不能超过15%。(PCB专用防潮箱相对湿度>30%)； MBB：Moisure Barrier Bag即防潮真空包装袋，该袋同时要考虑ESD保护功能；HIC：Humidity Indicator Card，即湿度显示适配器。作用为显示包装内的潮湿程度，一般有若干圆圈分别代表相对湿度10%，20%，30%等。各圆圈内原色为蓝色，当某圆圈内由蓝色变为紫红色时，则表明袋内已达到该圆圈对应的相对湿度；当某圆圈内再由紫红色完全变为粉红色时，则表明袋内已超过该圆圈对应的相对湿度。若湿度显示超过20%，即20%的圆圈同HIC卡颜色完全成了淡红色，表明生产前需要进行烘烤警告标签；
MSL：Moisure Sensitive Level，即湿度敏感等级，在防潮包装袋外的标签上有说明，分为：1、2、2a、3、4、5、5a、6 八个等级； 4 职责 4.1仓库----仓库区域环境温湿度的管制，和防潮箱的环境温湿度管制，温湿度敏感组件的管制。 4.2 IQC---- IQC验货区域的环境温湿度的管制，温湿度敏感组件的管制。 4.3制造部----生产区域、物料暂存区域温湿度敏感组件的管制。 4.4其他部门----维修及有涉及到温湿度组件的部门要做好温湿度敏感组件的管制。 4.5 IPQC----稽核各单位对环境温湿度的管制情况；稽核《湿敏组件控制卷标》的规范使用，对IC/PCB等湿敏组件的开封、使用过程、烘烤作业、贮存规范进行确认。 5 湿敏组件的识别 5.1湿敏组件列表中的所有组件类别； 5.2组件不在湿敏组件列表中，但外包装有湿敏组件标志的组件也视为湿敏组件。 5.3客户有要求的湿敏组件。 6 湿敏组件来料检查
湿敏元件管理规范01
. Q/HX XXXX-XX/XX-XXXX Q/HX- 湿敏元件管理规范A本：版 受控状态：
月XX年2014XX日发布年2014XX月XX日实施 . . 目录 .................................................................................................................................... II 言前.................................................................................................................................... 3 1目的.................................................................................................................................... 32 范围.................................................................................................................................... 3 定义3，即湿敏元件，指对湿度敏感的元件。：................ 3 3.1MSD.Moisture Sensitive Device：，即湿敏等级，分为：、、、、、、、八6 252a3.25a3MSL4Moisure Sensitive Level1个等级。................................................................................................................................ 3. ：车间寿命，指湿敏元件拆封后暴露在车间环境条件下允许的时间。 ......... 3Floor life3.3，即防潮包装袋。：........................................................... 3Moisure Barrier BagMBB3.4 ，即湿度显示卡。：....................................................... 3HIC3.5 Humidity Indicator Card.................................................................................................................................... 3 4职责仓储部........................................................................................................................ 3.4.1 全面质量管理部外检组................................................................................................ 34.2制造中心 ..................................................................................................................... 34.3其它部 门 ..................................................................................................................... 34.4全面质量管理部巡检组................................................................................................ 34.5............................................................................................................................ 3.5工作程序 湿敏元件识别.............................................................................................................. 3 5.1湿敏元件包装要求...................................................................................................... 4 5.2.湿敏元件标示.............................................................................................................. 45.3 ...................................................................... 45.3.2从湿敏警告标签上可以得到以下信息： 来料检验管控.............................................................................................................. 55.4 仓库管控 ..................................................................................................................... 55.5制程管控 ..................................................................................................................... 55.6湿敏元件的烘烤处理 ................................................................................................... 65.7鉴于客供物料的特殊性，对湿敏元件： ...................................................................... 75.8湿敏元件等级一览 表 ................................................................................................... 75.9元件储存控制卡》样卡：《 ...............................................................................
湿敏元件管理规范
湿敏元件管理规范 1.0目的 为规范对湿度有特殊要求或包装上有湿敏元件标记的元件进行有效的管理,以提供物料储存及制造环境的温湿度管制范围，以确保温湿度敏感元器件性能的可靠性。 2.0范围 本规范适用于各类潮湿敏感元器件（以下简称MSD）来料验收、储存、 配送、组装等过程中的管理。 3.0定义 湿敏元件是指对湿度有特殊要求的元件；湿敏识别卷标=MSD； SMT工厂确认防潮区域的温湿度计显示环境温度不能超过20℃～27℃、环境湿度控制在45%---60%RH，防潮箱相对湿度不能超过10%。(PCB专用防潮箱相对湿度>15%)； MBB：Moisure Barrier Bag即防潮真空包装袋，该袋同时要考虑ESD保护功能； HIC：Humidity Indicator Card，即湿度显示卡。作用为显示包装内的潮湿程度，一般有若干圆圈分别代表相对湿度10%，20%，30%等。各圆圈内原色为蓝色，当某圆圈内由蓝色变为紫红色时，则表明袋内已达到该圆圈对应的相对湿度；若湿度显示超过20%，即20%的圆圈同HIC卡颜色完全成了淡红色，表明生产前需要进行烘烤警告标签；
MSL：Moisure Sensitive Level，即湿度敏感等级，在防潮包装袋外的标签上有说明，分为：1、2、2a、3、4、5、5a、6 八个等级； 4.0职责 4.1 仓库 ---- 仓库区域环境温湿度的管制，和防潮箱的环境温湿度管制， 温湿度敏感组件的管制。负责对潮湿敏感器件在接收、入库、储存、发料和配送等物流过程中按照物料防潮等级的要求进行操作。 4.2 品质 ----负责潮湿敏感器件的入库检验和在物流过程中潮湿敏感器件 防潮等级是否正确实施的判定与裁决，IQC验货区域的环境温湿度的管制，温湿度敏感组件的管制。IPQC稽核各单位对环境温湿度的管制情况；稽核《湿敏元件控制标签》的规范使用，对IC/PCB等湿敏元件的开封、使用过程、烘烤作业、贮存规范进行确认。 4.3 生产部 ---- 生产区域、物料暂存区域温湿度敏感组件的管制。负责对 潮湿敏感器件在生产过程中按照物料防潮等级的实行以及在线潮湿敏感器件库存的处理工作。 4.4 其它部门 ---- 维修及有涉及到温湿度组件的部门要做好温湿度敏感组件的管制。 5.0 工作程序： 5.1 潮湿敏感器件的信息维护
仪器期间核查记录1
分光光度计期间核查记录 分光光度计型号： 分光光度计编号： 放置地点： 仪器负责人： 作业指导书分光度计的性能指标（灵敏度、比色皿误差）每季度用下列方法校验一次，并将校验结果记录在附表中。1、灵敏度校验：配制0.001%重铬酸钾溶液，用1cm 比色皿，以蒸馏水为参比，于波长440nm 处测吸光度，吸光度应大于0.010，小于这一数值时，应检查或更换光电池（管）。2、比色皿校验：将比色皿洗净，分别加入蒸馏水，取其中一只，在波长575nm ，将透光率调节到100%，吸光度调节到零，用其余各比色皿与之进行比较，吸光度之差大于0.003者，一律不能 使用。、管路敷设技术通过管线敷设技术，不仅可以解决吊顶层配置不规范问题，而且可保障各类管路习题到位。在管路敷设过程中，要加强看护关于管路高中资料试卷连接管口处理高中资料试卷弯扁度固定盒位置保护层防腐跨接地线弯曲半径标高等，要求技术交底。管线敷设技术中包含线槽、管架等多项方式，为解决高中语文电气课件中管壁薄、接口不严等问题，合理利用管线敷设技术。线缆敷设原则：在分线盒处，当不同电压回路交叉时，应采用金属隔板进行隔开处理；同一线槽内，强电回路须同时切断习题电源，线缆敷设完毕，要进行检查和检测处理。、电气课件中调试对全部高中资料试卷电气设备，在安装过程中以及安装结束后进行高中资料试卷调整试验；通电检查所有设备高中资料试卷相互作用与相互关系，根据生产工艺高中资料试卷要求，对电气设备进行空载与带负荷下高中资料试卷调控试验；对设备进行调整使其在正常工况下与过度工作下都可以正常工作；对于继电保护进行整核对定值，审核与校对图纸，编写复杂设备与装置高中资料试卷调试方案，编写重要设备高中资料试卷试验方案以及系统启动方案；对整套启动过程中高中资料试卷电气设备进行调试工作并且进行过关运行高中资料试卷技术指导。对于调试过程中高中资料试卷技术问题，作为调试人员，需要在事前掌握图纸资料、设备制造厂家出具高中资料试卷试验报告与相关技术资料，并且了解现场设备高中资料试卷布置情况与有关高中资料试卷电气系统接线等情况，然后根据规范与规程规定，制定设备调试高中资料试卷方案。、电气设备调试高中资料试卷技术电力保护装置调试技术，电力保护高中资料试卷配置技术是指机组在进行继电保护高中资料试卷总体配置时，需要在最大限度内来确保机组高中资料试卷安全，并且尽可能地缩小故障高中资料试卷破坏范围，或者对某些异常高中资料试卷工况进行自动处理，尤其要避免错误高中资料试卷保护装置动作，并且拒绝动作，来避免不必要高中资料试卷突然停机。因此，电力高中资料试卷保护装置调试技术，要求电力保护装置做到准确灵活。对于差动保护装置高中资料试卷调试技术是指发电机一变压器组在发生内部故障时，需要进行外部电源高中资料试卷切除从而采用高中资料试卷主要保护装置。
MSD(湿敏器件防护)控制技术规范
1、简介： SMD器件的出现直接带来了新的挑战，而这些挑战的重心又在于包装的品质和可靠性，周围环境中的湿气会通过包装材料渗透到包装内部，并在不同材料的表面聚结。在组装工艺中，SMD元件贴装在PCB 上时会经历超过200℃，在焊接时，湿气的膨胀会造成一系列的品质问题。 本规范遵照IPC/JEDEC有关的潮敏标准拟制，主要体现潮湿敏感器件在公司控制处理各环节的规范性要求。本规范由塑封器件潮湿敏感定义、潮湿敏感器件分级要求、潮湿敏感器件包装要求、潮湿敏感器件干燥要求、潮湿敏感器件使用及注意事项等内容组成。 2、目的： 为改进MSD控制水平，有效提高产品质量和可靠性，同时提高技术人员对潮敏器件的认识水平，规范 研发、市场和生产阶段对易潮敏器件的正确处理。 3、范围： 本规范规定了潮湿敏感器件等级要求、包装要求、操作及处理方法等方面的技术指标和控制措施。 本规范适用于步步高教育电子有限公司各类潮湿敏感器件（以下简称MSD）验收、储存、配送、组装等过程中的管理。供应商和外协厂商均可以参照本规范执行。 4、职责： 4.1 供应资源开发部负责湿度敏感器件的采购。 4.2 材料技术部负责提供湿度敏感器件的规格书。 4.3 工艺工程部负责湿度敏感器件的管控方案制定和外协生产MSD使用指导。 4.4 物流管理部仓储科负责对湿度敏感器件的储存（原包装密封储存、再次真空包装储存、干燥短期储存）。 4.5 品质部负责湿度敏感器件的来料检验和现场使用监督以及使用异常的反馈。 4.6 生管部（含SMT外协厂商）负责湿度敏感器件的使用以及车间使用寿命的控制。 5、关键词： 潮湿敏感、MSD、MSL、温度、相对湿度、干燥、烘烤、MBB 6、规范引用的文件： 7、术语和定义： PSMD（Plastic Surface Mount Device）：塑料封装表面安装器件。 MSD（Moisture Sensitive Device）：潮湿敏感器件。指非气密性封装的表面安装器件。 MSL（Moisture Sensitive Level）：潮湿敏感等级。指MSD对潮湿环境的敏感程度。 MBB（Moisture Barrier Bag）：防潮包装袋。MBB要求满足相应指标的抑制潮气渗透能力。 仓储寿命（Shelf Life）：指干燥包装的潮湿敏感器件能够储存在没有打开的内部环境湿度符合要求的湿气屏蔽包装袋中的最短时间。 车间寿命（Floor Life）：指湿度敏感器件从湿度屏蔽包装袋中取出或干燥储存或干燥烘烤后到过回流焊接前的时间。 制造商曝露时间（MET）：制造商烘烤完成至烤箱取出，到器件到达回流焊之前可能暴露到大气环
湿敏元件管控
1. 目的 规范对湿度有特殊要求或包装上有湿敏元件标记的元件进行有效的管理；以提供物料储存及制造环境的温湿度管制范围，以确保温湿度敏感元器件性能的可靠性2.适用范围 适用于所有对湿敏元件的储存；适用于PCB及IC（BGA、QFP）等温湿度敏感组件储存环境的管制 3. 职责 仓库－－－－仓库区域环境温湿度的管制，和防潮箱的环境温湿度管制，温湿度敏感组件的管制。 IQC －－－－IQC验货区域的环境温湿度的管制，温湿度敏感组件的管制。生产部－－－－生产区域、物料暂存区域温湿度敏感组件的管制。 其它部门－－－－维修及有涉及到温湿度组件的部门要做好温湿度敏感组件的管制。 IPQC －－－－稽核各单位对环境温湿度的管制情况；稽核《湿敏元件控制标签》的规范使用，对IC/PCB等湿敏元件的开封、使用过程、烘烤作业、贮存规范进行确认。4.湿敏元件是指对湿度有特殊要求的元件；湿敏识别卷标 =MSD； SMT工厂确认防潮区域的温湿度计显示环境温度不能超过20℃～27℃，防潮箱相对湿度不能超过15%。（PCB专用防潮箱相对湿度>30%）；MBB：Moisure Barrier Bag即防潮真空包装袋，该袋同时要考虑ESD保护功能； 注意事项A在生产过程中出现生产中断停产时间在5小时以上，湿度敏感元件必须回库进行干燥存放，若元件拆封在常温下10小时未使用完时，需进行干燥RH10%存放12H后方可再次使用或进行120度2H60度4H的烘烤。 5湿敏元件的识别 湿敏元件清单中的所有元件类别； 元件不在湿敏元件清单中，但外包装有湿敏元件标志的元件也视为湿敏元件。客户有要求的湿敏元件。6湿敏元件来料检查 质量部检验员在来料进行检验时，对湿敏元件的包装要作为一项主要内容检验；IQC必须检查来料真空包装有无漏气，有无破损，有无警示标贴，里面有无放干燥剂，材料真空包装有无超过标贴上规定的有效期限。当发现湿敏元件与以上不符时，应及时通知客户或供应商。 正常状况下所有真空包装材料均不需要拆开包装检查里面的元件。对于指定需要拆开包装检查的元件，IQC需要及时检查完毕，做真空包装，填写并贴上防潮元件拆封时间跟踪卡；仓库应先发此包装已拆封料给产线。 在没有特别指定湿度敏感元件时，IQC根据来料本身的包装形式和警告标签内容判断是否为湿度敏感元件；当来料本身为真空包装或已标注有湿度敏感等级时，该元件则必须视为湿度敏感元件执行相应控制要求。 7 仓库对湿度敏感元件的控制： 收货中心正常状况下所有真空包装材料均不需要拆开包装清点里面的元件。不得拆除原真空包装外面硬纸盒，以防真空包漏气。 当来料为散数，或其它有必要拆包清点时，收货中心应在清点立即对该料进行真空包装，并加贴跟踪卡，生产时优先使用。 对待定的湿敏物料,收货中心应及时通知采购、客户尽快处理,对不能及时处理的待定料应承转移至有湿度受控区域存贮。
包装作业指导书
拟制审核批准 工序名称：包材制作 1. 目的 规范包装工序包材制作作业人员的工作流程，明确作业要求，使作业人员操作有据可依，减少和避免人为操作不当导致的质量问题。 2. 适用范围 适用于生产加工中心包装工序的包材制作。 3．作业流程及要求 作业流程图示品质控制要点设备/工 装 1、对照任务单确认产品型号规格，查找需包装型号规格产品的“包装图”，依照“包装图”上产品包装纸箱的尺寸进行核算，开领料票据领取相对应的纸箱、纸皮，然后使用卷尺对纸皮进行测量并划线。1、“包装图”与实物型 号相符； 2、尺寸测量正确无误； 3、纸箱底箱尺寸可比实 物长和宽各加5cm，高 加1.5cm，纸箱盖比底长 和宽各加2cm。 卷尺 螺丝刀 木板条 2、使用手板锯沿所划线对纸皮进行裁切，切好后对照纸箱高度尺寸周圈用螺丝刀划线、开豁、对折。 标准产品用外购成品箱包装。 成品纸箱使用订箱机进行订箱。1、严格按照所划线进行 裁切，无倾斜，边缘整 齐无毛边、无开裂； 2、裁切后尺寸正确； 3、试装合格。 手板锯 订箱机 卷尺 螺丝刀 3、依据“包装图”要求裁切所需珍珠棉、泡沫板。1、尺寸正确； 2、边缘整齐无毛边、无 开裂。 卷尺 刀片 木板条 泡沫裁 切机 4、将制作好的纸箱、珍珠棉及泡沫 板转入下道工序。 应做好产品标识。/
拟制审核批准 工序名称：配五金件 1. 目的 规范包装工序五金件配制作业人员的工作流程，明确作业要求，使作业人员操作有据可依，减少和避免人为操作不当导致的质量问题。 2. 适用范围 适用于生产加工中心包装工序的配五金件。 3．作业流程及要求 作业流程图示品质控制要点设备/工 装 1、对照任务单确认产品型号规格，查找需包装型号规格产品的“安装图”，依照“安装图”上所列配件清单逐一进行配制。1、“安装图”与实物型 号相符； 2、在配件前应与试装组 人员进行核对，实际与 “安装图”配件清单不 相符的应通知设计部更 改“安装图”后再进行 配制； 3、配件数量正确，应与 “安装图”相符； 4、易损坏之配件可多配 1~2个。 / 2、将配制好的五金件装入配件袋并 封好，在配件袋外面绑上红丝带。 应按要求系上红丝带。/ 3、将检验合格的腿子装入裁好的热塑膜内使用热风枪加热进行吸塑。1、吸塑良好，热塑膜应 完好无破损； 2、注意轻拿轻放，防止 碰伤； 3、要求配五金件的应按 要求放置。 热风枪 脚踏式 加热裁 切机 4确认无误后将装好的配件袋及吸 塑好的腿子转入下道工序。 应做好产品标识。/