1. PRODUCT OVERVIEW
GENERAL DESCRIPTION
The HFDOM40B-xxxSx series 40Pin Flash Disk Module is a flash technology based with True IDE interface flash memory card. It is constructed with flash disk controller chip and NAND-type (Samsung) flash memory device. The HFDOM40B-xxxSx series operates in both 3.3-Volt and 5.0-Volt power supplies. It comes in capacity of 8, 16, 32, 64, 128, 192, 256 MB and up to 512 MB formatted 40Pin type .
By optimizing flash memory management, the life of this HFDOM40B-xxxSx series can be extended to its maximum level. Because the ECC function is included, the correctness of data transfer between the HFDOM40B-xxxSx series and a True IDE compatible interface device can be guaranteed.
The HFDOM40B-xxxSx series is fully compatible with applications such as CPU card / board, set top box, industry / military PC / Notebook, security equipment, measuring instrument and embedded systems.
FEATURES
- True IDE compatible host interface
- Direct plug in for 3.5″ IDE Connectors
- 40 pin 2.54mm IDE Connector
- Very high performance, very low power consumption
- Automatic error correction
- Support 3 power save mode : stop/idle/active
- Support for CIS implemented with 256 bytes of attribute memory
- 3.3V/5.0V operation voltage
- Host data transfer rate : 20MB/s
- Flash data transfer rate : 10MB/s
- Host Interface bus width : 8/16 bit Access
- Flash Interface bus width : 8 bit Access
- Capacity : Min. 8MB ~ Max. 384MB
- MTBF : 1,000,000 hours, minimum 30,000 insertions
- Operating vibration : 15G peak to peak maximum
- Operating shock : 1,000G maximum
PRODUCT SPECIFICATIONS
Capacities :
8, 16, 32, 64, 128, 192, 256 and up to 512 MB (formatted)
Operating Voltage : 3.3V / 5.0V ±10%
Power consumptions :
Read mode 30 mA (typ), 50 Ma (Max)
Write mode 30 mA (typ), 70 Ma (Max)
Stop mode 30 uA (typ)
Environment conditions :
Operating temperature 0°C to + 60°C
Storage temperature - 25°C to + 85°C
Relative humidity 95%(Max)
Mechanical conditions :
Weight : Maximum 9.0g
ELECTRICAL SPECIFICATIONS
Table 1.1 Absolute Maximum Ratings
Symbol Parameter Ratings Unit
V DD Supply voltage - 0.3 to + 7.0 V
V IN Input voltage - 0.3 to + 7.0 V
I IN DC input current - 10 mA
T STG Storage temperature - 20 to + 85 °C
Table 1.2 Recommended Operating Conditions
Symbol Parameter Ratings Unit
5V 4.75 to 5.25 V V DD DC Supply voltage
3.3V 3.0 to 3.6 V
T a Storage temperature - 20 to +70 °C
Table 1.3 DC Characteristics
(Ta=0°C to 70°C, V DD=3.0 to 5.3V)
Symbol Parameter Min. Typ. Max. Unit
I DD Operating Current 30 70 mA
I ds Stop Current 50 150 μA
V DD High Level Output Voltage 2.4 V
V DD Low Level Output Voltage 0.4 V CAPACITY SPECIFICATIONS
Table 1.4 Capacity Specifications
Part Number Capacity (Unformatted)Total Sector Cylinders Heads Sectors
HFDOM40B-016Sx 15,990,784 bytes31,232 61 16 32 HFDOM40B-032Sx 32,243,712 bytes62,976 123 16 32 HFDOM40B-064Sx 65,536,000 bytes128,000 250 16 32 HFDOM40B-128Sx 131,858,432 bytes257,536 503 16 32 HFDOM40B-192Sx 196,608,000 bytes384,000 750 16 32 HFDOM40B-256Sx 265,027,584 bytes517,632 1011 16 32 HFDOM40B-384Sx 395,837,440 bytes773,120 1510 16 32 HFDOM40B-512Sx 531,890,176 bytes1,038,848 2029 16 32
Jumper
PHYSYCAL SPECIFICATIONS
37.0±
55.37±0.1mm
< View from front side >
2.54± ±0.1mm
< View from connector side >
Figure 1.1 40 pin Type Flash Disk Module Dimensions
INSTALLTION GUIDE
1) Setting Method
①Make sure your computer is turned off before you open the case.
②Plug the carefully into the 40pin IDE slot on your computer.
Caution: Make sure to align pin1 on host adapter interface connector with pin 1 on your Flash Disk Module. Pin 1 is indicated by a triangle on the Flash Disk Module connector.
③The Flash Disk Module is used power connector cable of the computer.
Caution: If you need to remove your Flash Disk Module, use both hands to pull it out carefully.
④Check all cable connections and then replace your computer cover.
2) BIOS setting Method
Before you format or partition your new drive, you must configure your computer's BIOS so that the computer can recognize your new drive.
①Turn your computer on. As your computer start up, watch the screen for a message describing how to run the
system setup program on the screen (sometimes called BIOS or CMOS setup). This is usually done by pressing a special key, such as Delete, Esc or F1 during startup. See your computer manual for details. Press the
appropriate key to run the system setup program.
②If your BIOS provides automatic drive detection (an "AUTO" drive type), select this option. ( We
recommend to use Normal / CHS mode to partition your Flash Disk Module to get the maximum formatted capacity. )
This allows your computer to configure itself automatically for your new drive.
If your BIOS dose not provide “AUTO” drive detection, select "User-defined" drive setting and enter the CHS values from the table. BIOS Settings (see specification) Capacity Cylinders Heads Sectors(unformatted)
③Save the settings and exit the System Setup program. ( your computer will automatically reboot ) After you
configure your computer, you can use the standard DOS commands to partition and format your Flash Disk
Module, as described below.
3) Formatting Method
To partition your new Flash Disk Module with Microsoft DOS program :
①Insert a bootable DOS diskette into your diskette drive and restart your computer.
②Insert a DOS program diskette that contains the FDISK.EXE and https://www.wendangku.net/doc/d62814847.html,
programs into your diskette drive. Use the same DOS version that is on your bootable diskette. At the A:\ >
prompt, type “FDISK”and press Enter.
③Select “Create DOS partition or logical DOS drive” by pressing 1. Then press Enter.
④Select “Create primary DOS partition” by pressing 1 again. Then press Enter.
Create your first drive partition. If you are creating a partition that will be used to boot your computer (drive C), make sure that the partition is marked active.
⑤Create an extended partition and additional logical drives as necessary, until all the space on your new hard drive
has been partitioned.
⑥When the partitioning is complete, FDISK reboots your computer.
Caution: Make sure to use the correct drive letters so that you do not format a drive that already contains data.
⑦At the A:\ > prompt, type “format c:/s”, where c is the letter of your first new partition, Repeat the format process
for all the new partitions you have created.
⑧After you format your drive, it is ready to use.
2. PIN INFORMATION
PIN ASSIGNMENTS AND PIN TYPE
Table 2.1 Pin Assignment and Pin type
Pin Signal Pin Type Pin Signal Pin Type
1 /RESET I
2 GND Ground
3 D07 I/O
4 D08 I/O
5 D0
6 I/O 6 D09 I/O
7 D05 I/O 8 D10 I/O
9 D04 I/O 10 D11 I/O
11 D03 I/O 12 D12 I/O
13 D02 I/O 14 D13 I/O
15 D01 I/O 16 D14 I/O
17 D00 I/O 18 D15 I/O
19 GND DC 20 Key Pin --
21 Reserved -- 22 GND Ground
23 /IOW I 24 GND Ground
25 /IOR I 26 GND Ground
27 IORDY O 28 Reserved --
29 Reserved -- 30 GND Ground
31 IRQ O 32 /IOIS16 O
33 A01 I 34 /PDIAG I/O
35 A00 I 36 A02 I
37 /CS0 I 38 /CS1 I
39 /DASP(LED)I/O 40 GND Ground
Signal Descriptions
Table 2.2 Signal Descriptions
Signal Name Dir. Pin Description
A[2:0] I 33,35,36 In True IDE Mode only A[2:0] are used to select the one of eight registers in the Task File, the remaining address lines should be grounded by the host.
-PDIAG I/O34 This input / output is the Pass Diagnostic signal in the Master / Slave handshake protocol.
-DASP(LED) I/O39 This signal used either to drive an LED whenever the Disk Module is being accessed or as indication of a second drive present. This signal is active low when the Disk Module is busy.
-CS0, -CS1 I 37,38 CS0 is the chip select for the task file registers while CS2 is used to select the Alternate Status Register and the Device Control Register.
D[15:00] I/O
3,4,5,6,
7,8,9,10,
11,12,13,
14,15,16,
17,18
All Task File operations occur in byte mode on the low order bus D00-D07
while all data transfers are 16 bit using D00-D15.
GND -- 2,19,22,
24,26,
30,40,
Ground.
-IOR I 25 This is an I/O Read strobe generated by the host.
-IOW I 23 The I/O Write strobe pulse is used to clock I/O data on the Card Data bus into the Storage Card controller registers when the Storage Card is configured to use the I/O interface. The clocking will occur on the negative to positive edge of the signal (trailing edge).
IRQ O 31 In True IDE Mode signal is the active high Interrupt Request to the host. -RESET I 1 This input pin is the active low hardware reset from the host.
IORDY O 27 This output signal may be used as IORDY.
-IOIS16 O 32 This output signal is asserted low when this device is expecting a word data transfer cycle.
BLOCK DIAGRAM
Figure 2.1 Flash Disk Module Block Diagram
CONTROLLER
3. INTERFACE BUS TIMING
ACCESS SPCIFICATIONS
IDE MODE I/O ACCESS SPECIFICATIONS
In this True IDE Mode the Flash Disk Module protocol and configuration are disabled and only I/O operations to the Task File and Data Register are allowed. In this mode no Memory or Attribute Registers are accessible to the host.
Table 3.1IDE Mode I/O Access Mode
Mode -CE2 -CE1 A2-A0 -IORD -IOWR D15 - D8 D7 – D0 Invalid Mode L L x x x High Z High Z
Standby Mode H H x x x High Z High Z
Task File Write H L 1-7h H L Don’t Care Data In
Task File Read H L 1-7h L H High Z Data Out Data Register Write H L 0 H L Odd Byte in Even Byte in Data Register Read H L 0 L H Odd Byte out Even Byte out Control Register Write L H 6h H L Don’t Care Control In All Status Read L H 6h L H High Z Status Out
Table 3.2 IDE Mode I/O Read Timing
Parameter Symbol IEEE Symbol Min. ns Max. ns Data Delay after IORD td (IORD) tlGLQV 100
Data Hold following IORD th (IORD) tlGHQX 0
IORD Width Time tw (IORD) tlGLIGH 165
Address Setup before IORD tsuA (IORD) tAVIGL 70
Address Hold following IORD thA (IORD) tlGHAX 20
CE Setup before IORD tsuCE (IORD) tELIGL 5
CE Hold following IORD thCE (IORD) tlGHEH 20
IOIS16 Delay Falling from Address tdfIOIS16 (ADR) tAVISL 35
IOIS16 Delay Rising from Address tdrIOIS16 (ADR) tAVISH 35
NOTE: The maximum load on -IOIS16 is 1 LSTTL with 50pF total load. All times are in nanoseconds. Minimum time from
–WAIT high to -IORD high is 0nsec, but minimum -IORD width must still be met.
A0-A10
-CE
-IORD
-IOIS16
Dout
Figure 3.1IDE Mode I/O Read Timing Example
Table 3.3IDE Mode I/O Write Timing
Parameter Symbol IEEE Symbol Min. ns Max. ns
Data Setup before IOWR tsu(IOWR) tDVIWH 60
Data Hold following IOWR th(IOWR) tlWHDX 30
IOWR Width Time twI(OWR) tlWLIWH 165
Address Setup before IOWR tsuA(IOWR) tAVIWL 70
Address Hold following IOWR thA(IOWR) tlWHAX 20
CE Setup before IOWR tsuCE(IOWR) tELIWL 5
CE Hold following IOWR thCE(IOWR) tlWHEH 20
IOIS16 Delay Falling from Address tdfIOIS16(ADR) tAVISL 35
IOIS16 Delay Rising from Address tdrIOIS16(ADR) tAVISH 35 NOTE: The maximum load on -IOIS16 is 1 LSTTL with 50pF total load. All times are in nanoseconds. Minimum time from
-WAIT high to -IOWR high is 0nsec, but minimum -IOWR width must still be met.
A0-A10
-CE
-IOWR
-IOIS16
Din
Figure 3.2IDE Mode I/O Write Timing Example Ordering Infomation
NO Parts Size Capacity Media transfer
mode Chip Number
Operation
Mode
1 HFDOM40B-016S1 55.3x29.0x0.8mm 16Mbyte BYTE 1 True IDE
2 HFDOM40B-032S1 55.3x29.0x0.8mm BYTE 1 True IDE
3 HFDOM40B-032S2 55.3x29.0x0.8mm 32Mbyte
BYTE 2 True IDE
4 HFDOM40B-064S1 55.3x29.0x0.8mm BYTE 1 True IDE
5 HFDOM40B-064S2 55.3x29.0x0.8mm 64Mbyte
BYTE 2 True IDE
6 HFDOM40B-128S1 55.3x29.0x0.8mm BYTE 1 True IDE
7 HFDOM40B-128S2 55.3x29.0x0.8mm 128Mbyte
BYTE 2 True IDE
8 HFDOM40B-192S3 55.3x29.0x0.8mm 192Mbyte BYTE 3 True IDE
9 HFDOM40B-256S2 55.3x29.0x0.8mm 256Mbyte BYTE 2 True IDE
10 HFDOM40B-384S3 55.3x29.0x0.8mm 384Mbyte BYTE 3 True IDE
11 HFDOM40B-512S4 55.3x29.0x0.8mm 512Mbyte BYTE 4 True IDE