文档库 最新最全的文档下载
当前位置:文档库 › 17-21UYC中文资料

17-21UYC中文资料

17-21UYC中文资料
17-21UYC中文资料

Technical Data Sheet

0805 Package Chip LEDs

17-21UYC/S530-XX/TR8 Features

?Package in 8mm tape on 7〞diameter reel.

?Compatible with automatic placement equipment.

?Compatible with infrared and vapor phase reflow

solder process.

?Mono-color type.

?Pb-free.

?The product itself will remain within ROHS complaint version.

Descriptions

?The 17-21 SMD Taping is much smaller

than lead frame type components, thus

enable smaller board size, higher packing

density, reduced storage space and finally

smaller equipment to be obtained.

?Besides, lightweight makes them ideal for

miniature applications. etc.

Applications

?Automotive: backlighting in dashboard and switch.

?Telecommunication: indicator and backlighting in

telephone and fax.

?Flat backlight for LCD, switch and symbol.

?General use.

Device Selection Guide

Chip

Lens Color Part No.

Color

Material Emitted

17-21UYC/S530-XX/TR8 AlGaInP Brilliant Yellow Water Clear

17-21UYC/S530-XX/TR8 Package Outline Dimensions

Note: The tolerances unless mentioned is ±0.1mm ,Unit = mm

17-21UYC/S530-XX/TR8 Absolute Maximum Ratings (Ta=25℃)

Parameter Symbol Rating Unit

Reverse Voltage V R 5 V

Forward Current I F 25 mA Operating Temperature Topr -40 ~ +85 ℃

Storage Temperature Tstg -40~ +90 ℃

Electrostatic

Discharge(HBM)

ESD 2000 V

Power Dissipation Pd 60 mW

Peak Forward Current

(Duty 1/10 @1KHz)

I FP 60 mA

Soldering Temperature Tsol Reflow Soldering : 260 ℃for 10 sec. Hand Soldering : 350 ℃for 3 sec.

17-21UYC/S530-XX/TR8

Electro-Optical Characteristics (Ta=25℃)

Parameter Symbol

*Chip

Rank

Min. Typ. Max. Unit

Conditio

n

A2 15 38 ----- A3 40 62

----- A4 50 75 -----

A5 60 96

----- A6 85 124 ----- Luminous Intensity

Iv

A7 110 146

----- mcd

Viewing Angle 2θ1/2 ----- ----- 140 ----- deg Peak Wavelength λp ----- ----- 591 ----- nm Dominant Wavelength λd ----- ----- 589 ----- nm Spectrum Radiation

Bandwidth △λ ----- -----

15 -----

nm Forward Voltage V F ----- 1.7 2.0 2.4 V I F =20 mA

Reverse Current

I R

-----

----- ----- 10

μA

V R =5V

*17-21UYC/S530-XX/TR8

Chip Rank

17-21UYC/S530-XX/TR8

Reel Dimensions

Note: The tolerances unless mentioned is ±0.1mm ,Unit = mm

17-21UYC/S530-XX/TR8 Carrier Tape Dimensions: Loaded quantity 3000 PCS per reel

17-21UYC/S530-XX/TR8

Reliability Test Items And Conditions

The reliability of products shall be satisfied with items listed below. Confidence level :90% LTPD :10%

No. Items Test Condition Test Hours/Cycles Sample

Size

Ac/Re

1 Reflow Soldering Temp. : 260℃±5℃

Min. 5sec. 6 Min.

22 PCS.0/1 2 Temperature Cycle H : +100℃ 15min

∫ 5 min

L : -40℃ 15min 300 Cycles 22 PCS.0/1

3 Thermal Shock H : +100℃ 5min

∫ 10 sec

L : -10℃ 5min

300 Cycles 22 PCS.0/1 4

High Temperature

Storage

Temp. : 100℃ 1000 Hrs. 22 PCS.0/1 5

Low Temperature

Storage Temp. : -40℃ 1000 Hrs. 22 PCS.0/1 6 DC Operating Life I F = 20 mA 1000 Hrs. 22 PCS.0/1 7

High Temperature /

High Humidity

85℃/ 85%RH

1000 Hrs.

22 PCS.

0/1

17-21UYC/S530-XX/TR8

Precautions For Use

1. Over-current-proof

Customer must apply resistors for protection , otherwise slight voltage shift will cause big

current change ( Burn out will happen ).

2. Storage

2.1 Do not open moisture proof bag before the products are ready to use.

2.2 Before opening the package, the LEDs should be kept at 30℃or less and 90%RH or less.

2.3 The LEDs should be used within a year.

2.4 After opening the package, the LEDs should be kept at 30℃or less and 60%RH or less.

2.5 The LEDs should be used within 168 hours (7 days) after opening the package.

2.6 If the moisture absorbent material (silica gel) has faded away or the LEDs have exceeded the

storage time, baking treatment should be performed using the following conditions.

Baking treatment : 60±5℃for 24 hours.

3. Soldering Condition

3.1 Pb-free solder temperature profile

3.2 Reflow soldering should not be done more than two times.

3.3 When soldering, do not put stress on the LEDs during heating.

3.4 After soldering, do not warp the circuit board.

17-21UYC/S530-XX/TR8

4.Soldering Iron

Each terminal is to go to the tip of soldering iron temperature less than 350℃ for 3 seconds within once in less than the soldering iron capacity 25W. Leave two seconds and more intervals, and do soldering of each terminal. Be careful because the damage of the product is often started at the time of the hand solder.

5.Repairing

Repair should not be done after the LEDs have been soldered. When repairing is unavoidable, a double-head soldering iron should be used (as below figure). It should be confirmed beforehand whether the characteristics of the LEDs will or will not be damaged by repairing.

相关文档