当前位置：文档库 › ISO150AU中文资料

ISO150AU中文资料

FEATURES

DESCRIPTION

APPLICATIONS

DUAL,ISOLATED,BIDIRECTIONAL DIGITAL COUPLER

?Replaces High-Performance Optocouplers ?Data Rate:80M Baud,Typ

The ISO150is a 2-channel,galvanically-isolated data coupler capable of data rates of 80M Baud,typical.?Low Power Consumption:25mW Per Channel,Each channel can be individually programmed to Max

transmit data in either direction.

?Two Channels,Each Bidirectional,Data is transmitted across the isolation barrier by Programmable by User

coupling complementary pulses through high voltage ?Partial Discharge Tested:2400Vrms 0.4pF capacitors.Receiver circuitry restores the ?Creepage Distance of 7,2mm pulses to standard logic levels.Differential signal transmission rejects isolation-mode voltage transients ?Low Cost Per Channel up to 1.6kV/μs

?Available in SO Package The ISO150avoids problems commonly associated ?

UL 1577Certified

with optocouplers.Optically isolated couplers require high current pulses and allowance must be made for LED aging.The ISO150's Bi-CMOS circuitry operates ?Digital Isolation for A/D,D/A Conversion at 25mW per channel.

?Isolated RS-485Interface

The ISO150is available in an SO-28and is specified ?Multiplexed Data Transmission for operation from –40°C to 85°C.

?Isolated Parallel to Serial Interface ?Test Equipment

?Microprocessor System Interface ?Isolated Line Receiver ?

Ground Loop Elimination

Please be aware that an important notice concerning availability,standard warranty,and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

ABSOLUTE MAXIMUM RATINGS

REGULATORY INFORMATION

ISO150

SBOS032D–SEPTEMBER 2000–REVISED AUGUST https://www.wendangku.net/doc/d211924187.html,

This integrated circuit can be damaged by ESD.Texas Instruments recommends that all integrated circuits be handled with appropriate precautions.Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure.Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

ORDERING INFORMATION (1)

SPECIFIED TRANSPORT PACKAGE PACKAGE PACKAGE ORDERING PRODUCT

TEMPERATURE

MEDIA,LEAD DESIGNATOR

MARKING NUMBER RANGE QUANTITY ISO150AU Rails,28ISO150AU SO-28

DVB

–40°C to 85°C

ISO150AU

ISO150AU/1K

Tape and Reel,1000

(1)

For the most current package and ordering information,see the Package Option Addendum at the end of this document,or see the TI website at https://www.wendangku.net/doc/d211924187.html, .

over operating free-air temperature range (unless otherwise noted)(1)

(2)

UNIT Storage temperature

–40°C to 125°C V S Supply voltage

–0.5V to 6V V I Transmitter input voltage –0.5V to V S +0.5V V O Receiver output voltage –0.5V to V S +0.5V R/T x inputs

–0.5V to V S +0.5V

V ISO Isolation voltage dV/dt 500kV/μs D x Short to ground Continuous T J

Junction temperature

125°C Lead temperature (soldering,10s)

260°C

(1)Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device.These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied.Exposure to absolute maximum rated conditions for extended periods may affect device reliability.

(2)

This isolator is suitable for basic insulation applications within the safety limiting data.Maintenance of the safety data must be ensured by means of protective circuitry.

Recognized under 1577Component Recognition Program (1)File Number:E181974(1)

Production tested at 2400VRMS for 1second in accordance with UL 1577.

ELECTRICAL CHARACTERISTICS ISO150

https://www.wendangku.net/doc/d211924187.html,..........................................................................................................................................SBOS032D–SEPTEMBER2000–REVISED AUGUST2008

At T A=25°C and V S=5V(unless otherwise noted)

ISO150AU

PARAMETER TEST CONDITIONS UNIT

MIN TYP MAX ISOLATION PARAMETERS

Rated Voltage,Continuous60Hz1500Vrms Partial Discharge,100%Test(1)1s,5pC2400Vrms Creepage distance(external)SO-U Package7.2mm Internal isolation distance0.10mm Isolation voltage transient immunity(2) 1.6kV/μs Barrier impedance>1014||7?||pF Leakage current240Vrms,50Hz0.6μArms DC PARAMETERS

HIGH,V OH I OH=6mA V S–1V S

Logic output voltage V

LOW,V OL I OL=6mA00.4

Logic output short-circuit current Source or sink30mA

HIGH(3)2V S

Logic input voltage V

LOW(3)00.8

Logic input capacitance5pF Logic input current<1nA Power-supply voltage range(3)35 5.5V

DC0.001100μA

Transmit mode

50M Baud14mA Power-supply current(4)

DC7.210

Receive mode mA

50M Baud16

AC PARAMETERS

Maximum(5)C L=50pF5080

Data rate M Baud

Minimum DC

Propagation time(6)C L=50pF2740ns Propagation delay skew(7)C L=50pF0.52ns Pulse width distortion(8)C L=50pF 1.56ns Output rise-and-fall time,10%to90%C L=50pF914ns

Receive to Transmit13ns Mode switch time

Transmit to receive(9)75ns TEMPERATURE RANGE

Operating range–4085°C Storage–40125°C Thermal resistance,θJA75°C/W

(1)All devices receive a1s test.Failure criterion is≥5PULSES OF≥5Pc.

(2)The voltage rate-of-change across the isolation barrier that can be sustained without data errors.

(3)Logic inputs are HCT-type and thresholds are a function of power-supply voltage with approximately0.4V hysteresis–see text.

(4)Supply current measured with both transceivers set for the indicated mode.Supply current varies with data rate–see typical

characteristics.

(5)Calculated from the maximum pulse width distortion(PWD),where Data Rate=0.3/PWD.

(6)Propagation time measured from V IN=1.5V to V O=2.5V.

(7)The difference in propagation time of channel A and channel B in any combination of transmission directions.

(8)The difference between propagation time of a rising edge and a falling edge.

(9)When the device is powered up or direction is changed,the transceiver output is indeterminate(either high or low)and cannot be known

until an input signal is applied.The output begins to track the input as soon as the input receives a change in logic state,either low to high or high to low.

PIN CONFIGURATION

282726

171615

123

121314

D 1A R/T 1A V SA

G B R/T 1B D 1B

V SB R/T 2B D 2B

D 2A R/T 2A G A

Top View

TERMINAL FUNCTIONS

ISO150

SBOS032D–SEPTEMBER 2000–REVISED AUGUST https://www.wendangku.net/doc/d211924187.html,

TERMINAL DESCRIPTION

NAME NO.D 1A 1Data in or data out for transceiver 1A,R/T 1A held low makes D 1A and input pin.

R/T 1A 2Receive/transmit switch controlling transceiver 1A.

V SA 3+5V supply pin for side A,which powers transceivers 1A and 2A.G B 12Ground pin for transceivers 1B and 2B.

R/T 1B 13Receive/transmit switch controlling transceiver 1B.

D 1B 14Data in or data out for transceiver 1B.R/T 1B held LOW makes D 1B an input pin.D 2B 15Data in or data out for transceiver 2B.R/T 2B held LOW makes D 2B an input pin.R/T 2B 16Receive/transmit switch controlling D 2B .

V SB 17+5V supply pin for side B,which powers transceivers 1B and 2B.G A 26Ground pin for transceivers 1A and 2A.

R/T 2A 27Receive/transmit switch controlling transceiver 2A.

D 2A

Data in or data out for transceiver 2A,R/T 21A held low makes D 2A an input pin.

TYPICAL CHARACTERISTICS

Frequency (Hz)

P o w e r (m W )

12345

Supply Voltage, V S (V)

S u p p l y C u r r e n t (m A )

Temperature (5C)

Capacitive Load (pF)

t r , t f (n s )

Temperature (5C)

Supply Voltage, V S (V)

P r o p a g a t i o n D e l a y (n s )

ISO150

https://www.wendangku.net/doc/d211924187.html, ..........................................................................................................................................SBOS032D–SEPTEMBER 2000–REVISED AUGUST 2008

At T A =25°C and V S =5V,unless otherwise noted.

Figure 1.

Figure 2.

TYPICAL RISE AND FALL TIMES vs CAPACITIVE LOAD vs

Figure 3.

Figure 4.

Figure 5.Figure 6.

Temperature (5C)

P r o p a g a t i o n D e l a y , t P D

(n s )

0P u l s e W i d t h D i s t o r t i o n , P W D (n s )

Temperature (5C)

V IN (V)

V O U T (V )

Supply Voltage, V SS

(V)V I N (V )

Frequency (Hz)

P e a k I s o l a t i o n V o l t a g e (V )

Frequency (Hz)

L e a k a g e C u r r e n t (A r m s )

ISO150

SBOS032D–SEPTEMBER 2000–REVISED AUGUST https://www.wendangku.net/doc/d211924187.html,

TYPICAL CHARACTERISTICS (continued)

At T A =25°C and V S =5V,unless otherwise noted.

Figure 7.

Figure 8.

LOGIC INPUT THRESHOLD VOLTAGE vs SUPPLY

OUTPUT VOLTAGE VOLTAGE

Figure 9.

Figure 10.

ISOLATION LEAKAGE CURRENT

Figure 11.Figure 12.

?I s o l a t i o n R e s i s t a n c e ( )

1016101510141013101210111010

100

120

140

160

180

Temperature (5C)

ISOLATION BARRIER

ISO150

https://www.wendangku.net/doc/d211924187.html, ..........................................................................................................................................SBOS032D–SEPTEMBER 2000–REVISED AUGUST 2008

TYPICAL CHARACTERISTICS (continued)

At T A =25°C and V S =5V,unless otherwise noted.

TYPICAL INSULATION RESISTANCE

vs TEMPERATURE

Figure 13.

produced by localized ionization within the barrier;this is the most sensitive and reliable indicator of barrier integrity and longevity,and does not damage Data is transmitted by coupling complementary logic

the barrier.A device fails the test if five or more pulses to the receiver through two 0.4pF capacitors.current pulses of 5pC or greater are detected.These capacitors are built into the ISO150package Conventional isolation barrier testing applies test with Faraday shielding to guard against false voltage far in excess of the rated voltage to triggering by external electrostatic fields.

catastrophically break down a marginal device.A The integrity of the isolation barrier of the ISO150is device that passes the test may be weakened,and verified by partial discharge testing:2400Vrms,60lead to premature failure.

Hz,is applied across the barrier for one second while measuring any tiny discharge currents that might flow through the barrier.These current pulses are

APPLICATION INFORMATION

(1)

Data Out

Channel 2Data In

Channel 1

F in parallel with 1nF.

Data DE/RE

(+5V)

A B

ISO150

SBOS032D–SEPTEMBER 2000–REVISED AUGUST https://www.wendangku.net/doc/d211924187.html,

shown.The transmission direction can be controlled Figure 14shows the ISO150connected for basic by logic signals applied to the pins.Channel 1Channel 1is configured to transmit data and 2can be independently controlled for the desired from side B to A,whereas Channel 2is set for transmission direction.See Figure 15and Figure 16transmission from side A to B.The pins for each for application examples of the four transceivers are shown connected to the required logic level for the transmission direction

Figure 14.Basic Operation Diagram

Figure 15.Isolated RS-485Interface

LOGIC LEVELS

PROPAGATION DELAY AND SKEW

POWER SUPPLY

MODE CHANGES

STANDBY MODE

POWER-UP STATE

CIRCUIT LAYOUT

SIGNAL LOSS ISO150

Still,some applications with large,noisy isolation-

mode voltage can produce data errors by causing the

receiver output to change states.After a data error, A single pin serves as a data input or output,

subsequent changes in input data will produce correct depending on the mode selected.Logic inputs are

output data.

CMOS with thresholds set for TTL compatibility.The

logic threshold is approximately 1.3V with5V

supplies with approximately400mV of hysteresis.

Input logic thresholds vary with the power-supply

Logic transitions are delayed approximately27ns voltage.Drive the logic inputs with signals that swing

through the ISO150.Some applications are sensitive the full logic voltage swing,note that the ISO150will

to data skew—the difference in propagation delay use somewhat greater quiescent current if logic

between channel1and channel2.Skew is less than inputs do not swing within0.5V of the power-supply

2ns between channel1and channel2.Applications rails.

using more than one ISO150must allow for In receive mode,the data output can drive15somewhat greater skew from device to device.As all standard LS-TTL loads.It will also drive CMOS loads.devices are tested for delay times of20ns min to The output drive circuits are CMOS.40ns max,20ns is the largest device-to-device data

skew.

Separate,isolated power supplies must be connected

to side A and side B to provide galvanic isolation.The transmission direction of a channel can be Nominal rated supply voltage is5V.Operation changed on the fly by reversing the logic levels at the extends from3V to5.5V.Power supplies should be channel's R/T pin.Note that when channel direction is bypassed close to the device pins on both sides of changed,the output state of the channel is the isolation barrier.indeterminate(either high or low)and cannot be

known until an input signal is applied.The output The V S pin for each side powers the transceivers for begins to track the input as soon as the input both channel1and2.The specified supply current is receives a change in logic state,either low to high or the total of both transceivers on one side,both high to low.

operating in the indicated mode.Supply current for

one transceiver in transmit mode and one in receive

mode can be estimated by averaging the

specifications for transmit and receive operation.Quiescent current of each transceiver circuit is very Supply current varies with the data transmission rate low in transmit mode when input data is not changing —see the typical characteristics.(1nA typical).To conserve power when data

transmission is not required,program both side A and

B transceivers for transmit mode.Input data applied

to either transceiver is ignored by the other side. When the device is powered up or direction is High-speed data applied to either transceiver will changed,the transceiver output is indeterminate increase quiescent current.

(either high or low)and cannot be known until an

input signal is applied.The output begins to track the

input as soon as the input receives a change in logic

state,either low to high or high to low.The high speed of the ISO150and its isolation barrier

require careful circuit https://www.wendangku.net/doc/d211924187.html,e good high speed

logic layout techniques for the input and output data

lines.Power supplies should be bypassed close to The ISO150's differential-mode signal transmission the device pins on both sides of the isolation barrier. and careful receiver design make it highly immune to Use low inductance connections.Ground planes are voltage across the isolation barrier(isolation-mode recommended.

voltage).Rapidly changing isolation-mode voltage

can cause data errors.As the rate of change of Maintain spacing between side1and side2circuitry isolation voltage is increased,there is a very sudden equal or greater than the spacing between the increase in data errors.Approximately50%of all missing pins of the ISO150(approximately7mm). ISO150s will begin to produce data errors with

isolation-mode transients of1.6kV/μs.This may occur

as low as500V/μs in some devices.In comparison,

a1000Vrms,60Hz isolation-mode voltage has a

rate of change of approximately0.5V/μs.

V I V +5V ISO150

SBOS032D–SEPTEMBER 2000–REVISED AUGUST https://www.wendangku.net/doc/d211924187.html,

Figure 16.The ISO150and the ADS7807are Used to Reduce Circuit Noise in a Mixed-Signal Application

ISO150 https://www.wendangku.net/doc/d211924187.html,..........................................................................................................................................SBOS032D–SEPTEMBER2000–REVISED AUGUST2008

Revision History

Changes from Original(August1994)to Revision A Page

?Changed Features Bullet-From:Plastic DIP and SOIC Packages To:Available in SO Package (1)

?Changed From:ISO150is available in a24-pin DIP package To:The ISO150is available in an SO-28 (1)

?Changed From Burr-Brown To:Burr-Brown Products from Texas Instruments(New layout) (1)

?Deleted the DIP Package from the Ordering Information Table (2)

?Deleted DIP-P Package from Creepage distance(external)in the Electrical Characteristics Table (3)

?Deleted DIP-P Package illustration from the Pin Configuration (4)

?Changed Pin Configuration From:SOIC Package To:SO Package (4)

Changes from Revision A(February2003)to Revision B Page

?Changed Format and layout (1)

?Added Note9to the Electrical Characteristics Table (3)

Changes from Revision B(February2005)to Revision C Page ?Added Feature:UL1577Certified (1)

Changes from Revision C(October2007)to Revision D Page

PACKAGING INFORMATION

Orderable Device

Status (1)Package Type Package Drawing Pins Package Qty Eco Plan (2)

Lead/Ball Finish

MSL Peak Temp (3)ISO150AP OBSOLETE PDIP NVG 12TBD Call TI Call TI

ISO150AU ACTIVE SOP DVB 1228

Green (RoHS &no Sb/Br)

CU NIPDAU Level-3-260C-168HR ISO150AU-1OBSOLETE SO DVA 8TBD

Call TI Call TI

ISO150AU/1K ACTIVE SOP DVB 121000Green (RoHS &

no Sb/Br)CU NIPDAU Level-3-260C-168HR ISO150AU/1KG4ACTIVE SOP DVB 121000Green (RoHS &

no Sb/Br)CU NIPDAU Level-3-260C-168HR ISO150AUE4ACTIVE SOP DVB 1228Green (RoHS &no Sb/Br)CU NIPDAU Level-3-260C-168HR ISO150AUG4

ACTIVE

SOP

DVB

Green (RoHS &no Sb/Br)

CU NIPDAU

Level-3-260C-168HR

(1)

The marketing status values are defined as follows:ACTIVE:Product device recommended for new designs.

LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect.

NRND:Not recommended for new designs.Device is in production to support existing customers,but TI does not recommend using this part in a new design.

PREVIEW:Device has been announced but is not in production.Samples may or may not be available.OBSOLETE:TI has discontinued the production of the device.

(2)

Eco Plan -The planned eco-friendly classification:Pb-Free (RoHS),Pb-Free (RoHS Exempt),or Green (RoHS &no Sb/Br)-please check https://www.wendangku.net/doc/d211924187.html,/productcontent for the latest availability information and additional product content details.TBD:The Pb-Free/Green conversion plan has not been defined.

Pb-Free (RoHS):TI's terms "Lead-Free"or "Pb-Free"mean semiconductor products that are compatible with the current RoHS requirements for all 6substances,including the requirement that lead not exceed 0.1%by weight in homogeneous materials.Where designed to be soldered at high temperatures,TI Pb-Free products are suitable for use in specified lead-free processes.

Pb-Free (RoHS Exempt):This component has a RoHS exemption for either 1)lead-based flip-chip solder bumps used between the die and package,or 2)lead-based die adhesive used between the die and leadframe.The component is otherwise considered Pb-Free (RoHS compatible)as defined above.

Green (RoHS &no Sb/Br):TI defines "Green"to mean Pb-Free (RoHS compatible),and free of Bromine (Br)and

Antimony (Sb)based flame retardants (Br or Sb do not exceed 0.1%by weight in homogeneous material)

(3)

MSL,Peak Temp.--The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications,and peak solder temperature.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.TI bases its knowledge and belief on information provided by third parties,and makes no representation or warranty as to the accuracy of such information.Efforts are underway to better integrate information from third parties.TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary,and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s)at issue in this document sold by TI to Customer on an annual basis.

PACKAGE OPTION ADDENDUM

https://www.wendangku.net/doc/d211924187.html,

14-Oct-2008

TAPE AND REEL INFORMATION

*All dimensions are nominal

Device

Package Type Package Drawing Pins SPQ

Reel Diameter (mm)Reel Width W1(mm)A0(mm)B0(mm)K0(mm)

P1(mm)W (mm)Pin1Quadrant ISO150AU/1K SOP

DVB

1000330.0

24.4

10.918.3 3.2

12.0

24.0

*All dimensions are nominal

Device Package Type Package Drawing Pins SPQ Length(mm)Width(mm)Height(mm) ISO150AU/1K SOP DVB121000346.0346.041.0

IMPORTANT NOTICE

Texas Instruments Incorporated and its subsidiaries(TI)reserve the right to make corrections,modifications,enhancements,improvements, and other changes to its products and services at any time and to discontinue any product or service without notice.Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.

TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty.Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty.Except where mandated by government requirements,testing of all parameters of each product is not necessarily performed.

TI assumes no liability for applications assistance or customer product design.Customers are responsible for their products and applications using TI components.To minimize the risks associated with customer products and applications,customers should provide adequate design and operating safeguards.

TI does not warrant or represent that any license,either express or implied,is granted under any TI patent right,copyright,mask work right, or other TI intellectual property right relating to any combination,machine,or process in which TI products or services are https://www.wendangku.net/doc/d211924187.html,rmation published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement https://www.wendangku.net/doc/d211924187.html,e of such information may require a license from a third party under the patents or other intellectual property of the third party,or a license from TI under the patents or other intellectual property of TI.

Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties,conditions,limitations,and notices.Reproduction of this information with alteration is an unfair and deceptive business practice.TI is not responsible or liable for such altered https://www.wendangku.net/doc/d211924187.html,rmation of third parties may be subject to additional restrictions.

Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice.TI is not responsible or liable for any such statements.

TI products are not authorized for use in safety-critical applications(such as life support)where a failure of the TI product would reasonably be expected to cause severe personal injury or death,unless officers of the parties have executed an agreement specifically governing such use.Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications,and acknowledge and agree that they are solely responsible for all legal,regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications,notwithstanding any applications-related information or support that may be provided by TI.Further,Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications.

TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or"enhanced plastic."Only products designated by TI as military-grade meet military specifications.Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk,and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS16949requirements.Buyers acknowledge and agree that,if they use any non-designated products in automotive applications,TI will not be responsible for any failure to meet such requirements.

Following are URLs where you can obtain information on other Texas Instruments products and application solutions:

Products Applications

Amplifiers

Audio

Data Converters Automotive

DSP Broadband

Clocks and Timers Digital Control

Interface Medical

Logic Military

Power Mgmt Optical Networking

Microcontrollers Security

RFID Telephony

RF/IF and ZigBee?Solutions Video&Imaging

Wireless

Mailing Address:Texas Instruments,Post Office Box655303,Dallas,Texas75265

元器件交易网https://www.wendangku.net/doc/d211924187.html,