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Microstructuring of lithium niobate using differential etch-rate

Microstructuring of lithium niobate using differential etch-rate
Microstructuring of lithium niobate using differential etch-rate

November1998

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Materials Letters371998246–254

Microstructuring of lithium niobate using differential etch-rate between inverted and non-inverted ferroelectric domains

Ian E.Barry a,),Graeme W.Ross a,Peter G.R.Smith a,Robert W.Eason a,

Gary Cook b

a Optoelectronics Research Centre,Uni?ersity of Southampton,Southampton SO171BJ,UK

b Defence E?aluation Research Agency,Mal?ern,WR143PS,UK

Received5January1998;revised30April1998;accepted30April1998

Abstract

Single crystal samples of lithium niobate have been spatially patterned with photoresist,and subsequently domain inverted using electric field poling,to produce a range of two dimensional spatial domain structures.Differential etching has subsequently been carried out using mixtures of hydrofluoric and nitric acids,at a range of temperatures between room temperature and the boiling point.The structures produced show very smooth,well defined,deep features,which have a range of applications in optical ridge waveguides,alignment structures,V-grooves,and micro-tips.Details are given of the fabrication procedures,and examples of structures are shown.q1998Elsevier Science B.V.All rights reserved. Keywords:Lithium niobate;Differential etching;Ferroelectric domains

1.Introduction

Lithium niobate is a material of considerable in-terest to the optical,laser and communications indus-try,due to the large values of nonlinear optical, electro-optic,piezoelectric and acousto-optical coef-

w x ficients and figures of merit that are available1. Current uses span the laser area,where fabrication of periodically poled material has achieved record effi-ciencies in quasi-phased matched nonlinear interac-w x

tions2,to the microwave communications sector for use in surface acoustic wave delay lines and w x

filters3.In the telecommunications field,it is widely used for integrated optical modulators where switching rates of10GHz and above are currently

)Corresponding author.required for wavelength division multiplexed fibre optical networks.Finally,although regarded as a problem in many areas,it continues to maintain interest in the photorefractive community for optical storage,holographic and phase conjugate applica-tions.

A number of techniques have been reported for machining and microstructuring in lithium niobate.

?.w x

These include reactive ion etching RIE4,reactive

?.w x

ion beam etching RIBE5,laser ablation,both

w x

above and below bandgap6,and laser assisted

w x w x chemical etching using chlorine7and KF8.Wet etching has also been used for many years to reveal

w x domain and defect structures in lithium niobate9, but not so far to our knowledge for intentionally producing ordered microstructures subsequent to lithographically defined,spatially patterned,domain inversion.Such microstructuring has obvious appli-

00167-577X r98r$-see front matter q1998Elsevier Science B.V.All rights reserved.

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PII:S0167-577X9800100-1

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I.E.Barry et al.r Materials Letters371998246–254247

cations for the fields of optics and optoelectronics: the ability to spatially define very smooth and pre-

?. cise structures for lateral guidance waveguides,and

?. multiple arrays photonic bandgap devices will have immediate impact.

The most common wet etchant reported has been

?.

a mixture of hydrofluoric HF and nitric acids ?.?. HNO,which attacks the negative z face y z at a 3

rate that is appreciably higher than the positive z ?.

face q z.Additionally,defect sites in the crystal lattice may also experience higher etching rates.This last property has been utilised recently to produce ridge waveguides for improved electrical-to-optical coupling in integrated optical interferometer devices w x

10.Many such techniques require the use of a prior lithographic spatial defining step,which has implica-tions in the ultimate quality of structures obtainable due to mask fabrication limitations.In our technique, although domain inversion still requires a litho-graphic procedure,involving photoresist inhibition of the electric field required for domain inversion,the latter process is inherently a manipulation of the crystal local structure at the atomic,or unit cell level. Subsequent differential etching can therefore pro-duce structures that reflect this level of perfection, and extremely smooth features are therefore generic to this technique.

We report here the combination of spatially selec-tive poling of lithium niobate,and subsequent differ-ential etching,to produce structures up to150m m deep with very smooth walls,as imaged using scan-ning electron microscopy.The results obtained sug-gest that this technique may be very suitable for production of high quality ridge waveguides,V-grooves and other alignment aids,electro-optically active tips for atomic force microscopy applications, and arrays of highly uniform holes,for filtration and sensing purposes,and columns for photonic band gap structures.

2.Materials and methods

The samples of lithium niobate had dimensions of 15mm=15mm and were either300or500m m thick.All material was supplied by Koto Electric ?.

Japan in the form of z cut,76mm diameter wafers,which were cut to size in house.The y z

?

face was marked to show the y direction.Nomenc-lature of the coordinate system is as described in w x.

Ref.11.All samples were subjected to a sequential multiple solvent cleaning process using ultrasonic agitation at508C.The samples were then dried with compressed air.Photoresist was spin coated onto the y z face,producing a1.1m m thick film.The sam-ples were finally baked at908C for30min.

The photoresist was patterned using a Karl Suss MA4mask aligner and chrome on quartz masks.The patterns used to measure the temperature dependant etch rate consisted of gratings with periods between 3and27m m,channels of width between3and14 m m,and arrays of square,triangular and round points with feature sizes of5,10and20m m.The channels and gratings were aligned with their grating vector parallel with the crystallographic x

direction,

?.?.

Fig.1.a Schematic of the poling apparatus used.b Schematic

of domain structure within the LiNbO sample before and after

3

poling.

()I.E.Barry et al.r Materials Letters 371998246–254

248and features parallel with the y direction.Other test patterns used were 200m m diameter circles,ran-domly orientated lines of 100m m width,and grat-ings with periods between 5and 18m m.These latter structures were etched only at room temperature.Once exposed the resist was developed for 50s,washed in de-ionized water for 60s and dried using dry compressed

air.

?.?.Fig.2.a Circular feature patterned on the y z face,after poling and etching.b Complementary structure produced on the opposite face after poling and etching.

()

I.E.Barry et al.r Materials Letters371998246–254249

The samples were poled by applying an external electric field of22.5kV r mm.Fig.1a is a schematic of the apparatus used.Poling current was monitored, and controlled by varying the applied field.The expected displacement current,and hence total charge,was calculated in advance,and the poling process was terminated once the required degree of poling had been achieved.Liquid electrodes were used to ensure good electrical contact with the sam-ple.After poling all samples were again cleaned using acetone and water.

The etchant consisted of HF and HNO acids in a

3

1:2ratio,where the HF was a48%solution and the nitric acid was a78%solution.The etchant was stirred constantly using a magnetic stirrer with an integral hotplate.The temperature of the hotplate was kept constant and the etchant allowed to reach equilibrium temperature before initiating the etch process.The etching time varied between15and17 h for all samples.The etch depth was measured using a Tencor Alphastep profileometer.Addition-ally a JEOL JSM6400Scanning Electron Micro-?.

scope SEM was used for visual inspection of the structures produced.Some samples were also set in low viscosity resin and then cut and polished in a plane normal to the z face to allow measurement of the etch depth from the SEM pictures obtained.

3.Results and discussion

Before poling,the lithium niobate wafers were all oriented single domain samples.After poling,sam-ples had areas of induced domain reversal,as is illustrated schematically in Fig.1b.Examination of the resultant etched structures revealed that opposing crystal z faces displayed quite different topology. The features on the photoresist patterned y z face appear to faithfully replicate the areas of induced domain inversion.The features on the opposing z ?.

face the q z face,however,show some evidence of domain spreading,as revealed by the subsequent etching procedure.The underlying crystal3m sym-metry leads to features with characteristic triangular, and hexagonal shapes,and,as seen in the example of Fig.2,an initially circular photoresist pattern will produce an equivalent circular etched structure

on

?.

Fig.3.Simultaneous view of both faces q z and y z,and different etch results.The edge of the sample appears rough,as this has been snapped prior to SEM viewing.

()

I.E.Barry et al.r Materials Letters371998246–254 250

the y z face,but a hexagonal structure on the etched q z face.

Fig.3also shows such complementary structures, and illustrates the extent to which the etch process can be utilised to construct alignment aids,such as ‘V’-grooves.It should be noted that the exact profile is not that of a‘V’in this case,but rather a tapered ‘V’.The reasons for this exact structure are currently under further investigation,and are being studied as a function of both etchant concentrations and tem-

?perature.Under some conditions,very small;100 .

nm holes appear around features revealed on the y z face.These are illustrated in Fig.4,and are also under active study for possible uses in filtering, sieving,etc.,but with the additional benefit of being in an acti?e optical material.We are currently con-sidering the modifications that can be expected in the nonlinear and electro-optic response of lithium nio-bate,by the inclusion of nanoscale particles of met-als,or dielectrics.As a general observation,all struc-tures produced via etching,and revealed on the y z face display smooth walls,and vertical features. Under SEM examination,the smoothness persists at

?the highest resolution available with our SEM;5

.

nm.The implication here is that crystal planes are being revealed via this technique and we are cur-rently measuring individual facet orientations.Fur-ther studies will involve X-ray diffraction and topog-raphy analysis.

As etching proceeds,the facets produced appear to result in self-termination,or a much reduced rate of etching.This is of most use when alignment grooves are required,and an example of this is shown in Fig.5.The facetting does not occur at the same depth in all cases however,and in Fig.6we show an example of a deep vertical walled ridge, suitable for waveguide applications,in which the etch has proceeded to a depth of;20m m,without any facets appearing.This behaviour is critical to the use of this technique for fabricating high aspect ratio structures.Finally we note the appearance of most of the etched samples so far in the near surface region. It is known that the domain inversion process is influenced by defects,and such structures as sub-surface polishing damage.The first few micrometers of all etched samples shows a‘banded’appearance, the detailed structure of which may vary slightly,but which appears to be common to all etched

samples. Fig.4.Holes produced around edges of etched domain walls.

()

I.E.Barry et al.r Materials Letters371998246–254251

Fig.5.Etched structure showing smooth walls,and V-groove features.

Fig.6.Example of ridge structure suitable for waveguide applications.Note the smooth side-walls produced and clear evidence of surface ‘banded’appearance.

()

I.E.Barry et al.r Materials Letters371998246–254 252

Fig.6shows this particularly clearly.The surface smoothness seems unaffected however,and we are further investigating the origin of the contrast ob-served.A final example of the precision that can be achieved by this method is shown in Fig.7.An isolated tip has been produced which may well prove useful in scanning microscopy applications,such as near field imaging.

Fig.8shows the results of etch rate obtained as a function of etch temperature.The mechanism by which etching proceeds faster at elevated tempera-tures can be considered from two perspectives. Firstly,such etching processes are expected to follow

?

the normal Arrhenius law,rate proportional to w x.

A exp y E r RT,which would yield an exponential

a

increase in etch rate.Secondly,however,there is another factor which might influence temperature dependent etch rates.Poling acts to displace both Li q and Nb q ions relative to the oxygen ions in the lattice.As this displacement is the key indicator of domain polarity,the exact positions of these ions must play an extremely important role in subsequent differential etch rates.Increased temperature will alter the metal ion positions within the lattice,and hence may well influence etch rate.Fig.8shows

an

?

Fig.8.Arrhenius plot showing natural log of etch-rate measured .

in m m per hour,vs.1r absolute temperature.The straight line fit

?.

shows no departure from the normal exp E r RT behaviour.

a

?.

Arrhenius plot of ln etch-rate,measured in m m per hour,vs.1r absolute temperature,from which the linear gradient indicates no obvious departure

from Fig.7.Single crystal tip,for possible scanning microscopy applications.

()

I.E.Barry et al.r Materials Letters371998246–254

253

Fig.9.Deep etching of trenches.The;150m m depth demonstrates independence of facet angle on number of separate etching steps,and feasibility of deep structures.

the expected Arrhenius law.Five temperatures from 21to958C were used,but at the highest value,the etch rate was sufficiently fast to completely etch through the sample,preventing a quantitative deter-mination of etch rate.Fig.8also indicates that at the highest temperature that can be used for boiling HF r HNO,which is1108C,an etch rate of;55 3

m m per hour is predicted.Repeated immersion of the sample did not affect the observed facet angles.The sample seen in Fig.9was immersed twice,and no change in etch behaviour was observed.

In summary therefore,a process consisting of domain patterning by electric field poling followed

by etching in a1:2mixture of HF and HNO acids

3

has revealed a range of micro-and nanoscale struc-tures.The surface quality appears extremely smooth and straight in directions parallel to the mirror planes of the crystal3m symmetry,with surface roughness less than the5nm resolution available to us.The technique has produced ridge waveguides,alignment grooves,sharp tips and regular arrays of similarly shaped and equally sized holes.We are currently evaluating the technique for producing low loss ridge waveguides,and have defined a lower confinement layer using ion-beam implantation.The tip structures are under consideration for electro-optic sampling, near-field imaging microscopy,and other associated techniques.

Acknowledgements

The authors would like to acknowledge the De-fence Evaluation Research Agency,and the Engi-neering and Physical Sciences Research Council for a postgraduate research award for Ian Barry.Thanks also go to Barbara Cressey,at the electron mi-croscopy centre,for SEM facilities,and the micro-electronics group for mask fabrication. References

w x1 A.M.Prokhorov,Yu.S.Kuz’minov,Physics and Chemistry of Crystalline Lithium Niobate’Adam Hilger,Bristol,1990. w x2L.E.Myers,R.C.Eckardt,M.M.Fejer,R.L.Byer,W.R.

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3.4)产品外观:

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