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ICN2516_英文规格书_en2011

ICN2516_英文规格书_en2011
ICN2516_英文规格书_en2011

ICN2516 HIGH POWER FACTOR 4-CH HVLDO

GENERAL DESCRIPTION

The IC is capable of driving multiple series connected LEDs. The IC sense rectified AC input source voltage to modulate LED current which can in phase input voltage to implement high power factor and high efficiency. The IC is a high voltage process chip with internal regulator to generate bios voltage which supports IC internal circuit. The IC also has internal power switch to minimize external components.

The package of the IC is TSSOP-16. Which suitable for LED lighting like MR-16, E-17, E27…and so on applications.FEATURES

z Low Quiescent Current

z No Inductor Component Required

z Internal 500V NMOS Switch

z High Power Factor Application

z High Efficiency (up to 85%)

z Programmable LED Current

z Over

Temperature

Protection

RoHS Compliant and 100% Lead (Pb)-Free and Green (Halogen Free with Commercial Standard

SIMPLIFIED APPLICATION CIRCUIT

ABSOLUTE MAXIMUM RATINGS

Parameter Symbol Ratings Units

High Voltage Input and LED String Switch

V IN / V SW0/V SW1/ V SW2/ V SW3

500 V

IC Regulation Voltage input V CC 36 V

Switch Current Rating I SW 0.1 A

Other I/O Pin Voltage V IO 7 V Junction Temperature

T J +150 °C

Power Dissipation

TSSOP-16

P D 2000 mW Operating Ambient Temperature

T OPR -40 ~ +125 °C Storage Temperature

T STG -55 ~ +150 °C Lead Temperature (soldering, 10sec)

+260

°C

Note :

* The power dissipation values are based on the condition that junction temperature T J and ambient temperature T A difference is 100°C.

* Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and function operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum -rated conditions for extended periods may affect device reliability.

*Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the recommended operating conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability.

ELECTRICAL CHARACTERISTICS

Symbol Parameter Test Conditions Min

Typ Max Unit

V IN High voltage input Vin rising

500 V

V CC

Internal regulation voltage

Vin rising measure V CC 9 V

I SET0 First step current SW1 turn on; VS1 < 0.51V 1580/Rset mA I SET1 First step current SW1 turn on; VS1 > 0.51V;

VS2<1.02V

1580/Rset

mA I SET2 Second step current SW2 turn on; VS1 > 1.02V and

VS2<1.02V

2080/Rset mA I SET3 Third step current SW2 turn on; VS1 > 1.02V and

VS2>1.02V

2580/Rset

mA

T TST Thermal Shutdown Temperature 150

°C T TSH

Thermal Shutdown Hysteresis

40

°C

FUNCTION BLOCK DIAGRAM

PIN DESCRIPTION

Symbol

1 VS1

2 VS2

3 4,7/EP GND 5 8

PACKAGE OUTLINE A) TSSOP-16

REFLOW CONDITION (IR/Convection or VPR Reflow)

CLASSIFICATION REFLOW PROFILES

Profile Feature

Pb-Free / Green Assembly

Average ramp-up rate (T L to T P )

3°C/second max Preheat

- Temperature Min (Tsmin) - Temperature Max (Tsmax) - Time (min to max) (ts) 150°C 200°C

60-180 seconds Time maintained above: - Temperature (T L ) - Time (t L )

217°C

60-150 seconds Peak/Classification Temperature (Tp) See table 1 Time within 5°C of actual Peak Temperature (tp)

20-40 seconds Ramp-down Rate

6°C/second max Time 25°C to Peak Temperature

8 minutes max

Notes :

1) All temperatures refer to topside of the package. 2) Measured on the body surface.

CLASSIFICATION REFLOW PROFILES (CONTINUED) Table 1. Pb-free / Green Process – Package Classification Reflow Temperatures

Package Thickness Volume mm3

<350

Volume mm3

350~2000

Volume mm3

2000

<2.5 mm260 +0°C* 260 +0°C* 260 +0°C*

1.6-

2.5 mm260 +0°C*250 +0°C*245 +0°C*

≧2.5 mm250 +0°C* 245 +0°C* 245 +0°C* Notes:

* Tolerance: The device manufacturer/supplier shall assure process compatibility up to and including the stated classification temperature (this means Peak reflow temperature +0°C. For example 260°C+0°C) at the rated MSL level.

IMPORTANT NOTICE

Chipone Technology (Beijing) Co., Ltd. (Chipone) reserves the right to make changes to their products or to discontinue any product or service without notice, and advise customers to obtain the latest version of relevant information to verify, before placing orders, that information being relied on is current and complete. All products are sold subject to the terms and conditions of sale supplied at the time of order acknowledgement, including those pertaining to warranty, patent infringement, and limitation of liability.

Chipone warrants performance of its semiconductor products to the specifications applicable at the time of sale in accordance with Chipone’s standard warranty. Testing and other quality control techniques are utilized to the extent Chipone deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarily performed, except those mandated by government requirements.

CERTAIN APPLICATIONS USING SEMICONDUCTOR PRODUCTS MAY INVOLVE POTENTIAL RISKS OF DEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICAL APPLICATIONS”). CHIPONE SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, OR WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHER CRITICAL APPLICATIONS. INCLUSION OF CHIPONE PRODUCTS IN SUCH APPLICATIONS IS UNDERSTOOD TO BE FULLY AT THE CUSTOMER’S RISK.

In order to minimize risks associated with the customer’s applications, adequate design and operating safeguards must be provided by the customer to minimize inherent or procedural hazards.Chipone assumes no liability for applications assistance or customer product design. Chipone does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right of Chipone covering or relating to any combination, machine, or process in which such semiconductor products or services might be.

or are used. Chipone’s publication of information regarding any third party’s products or services does not constitute Chipone’s approval, warranty or endorsement thereof.

◎Chipone Technology (Beijing) Co., Ltd.

Copyright 2011,

电器产品规格书格式

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产品规格书 BL-4C-英文

ShenZhen CHY Battery Technology Co.,LTD Page Number:1st of 15 Core Model:TMB433450AR Specifications of Product Specifications of Product Customer Name SHANGHAI HUAQIN TELECOM TECHNOLOGY CO.,LTD. Product Name Cell Phone Lithium-ion Battery Product Model (Customer): ZL20A57 Product Model CHY-ZL20A57 (Manufacturer): Product Size 433450AR/800mAh Material Number(Manufacturer) Material Number(Customer) Prepared Checked approved Customer Confirmation Contents Decision Outcome Signature Date Appearance Structure Electrical Property Company address: Buillding A3, Jindida T echnological Park, Langkou Village, Longhua T own, Shenzhen Tel:(86-0755)61564565/66/67/69 Fax:(86-0755)61564568

ShenZhen CHY Battery Technology Co.,LTD Page Number: 2nd of 15 Core Model:TMB433450AR Specification of Product Content Historical Recording of Date of Change Eidtion The Content Being Modification Edition Modification 00/01 2011-1-1 A0 New Edition Released 00/02 2011-6-21 A1 New Edition Released 1. Applicable Scope 2. Reference S tandard 3. T echnical Parameters 4. Batteries Work Principle Diagram 5. Material List 6. Reliability T est Specifications 7. T ransportation 8. S torage 9. Instructions and Safety Procedures 10. Packages and Marking 11. Warranty 12. Interpretation of Product Change Appendix : 1.PCM Work Principle Diagram 2.BOM of PCM 3.PCB Layout Diagram 4.Dimension Diagram 5.Label Diagram

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产品研发项目功能规格书模板V10(DOC)

产品研发项目功能规格书 Prepared by 拟制Date 日期 Reviewed by 评审人Date 日期 Approved by 批准Date 日期

Revision Record 修订记录

目录 1.简介 (4) 1.1.目的 (4) 1.2.适用范围 (4) 2.功能概览 (4) 3.功能性需求部分 (5) 3.1.功能1 (5) 3.1.1.功能1.1 (5) 3.2.功能2 (8) 3.3.功能3 (8) 4.非功能性需求部分 (8) 4.1.性能要求 (8) 4.1.1.系统响应时间要求 (8) 4.1.2.数据存放时间 (9) 4.2.安全要求 (9) 4.2.1.业务安全要求 (9) 4.2.2.技术安全要求 (9) 4.3.扩展性要求(横向、纵向) (9) 4.4.易开发能力要求 (9) 4.5.可客户化要求 (9) 4.6.易部署能力要求(如不停机在线部署,远程发布能力等) (9) 4.7.稳定性能要求 (9) 4.8.易监控能力要求 (10) 4.9.兼容性要求 (10)

1. 简介 1.1. 目的 本文档目的是理清楚产品的需求,作为和需求相关人员进行产品功能范围沟通以及后续的产品设计、开发和测试等工作服务。 1.2. 适用范围 <描述本文档使用范围和预期读者,需要从以下两个方面进行描述: 适用范围是何种类型项目; 预期读者是那些部门或那种角色。> 2. 功能概览 <用层级菜单的方式勾栏本系统的所有功能。对小系统可以直接在此处贴图,对于功能比较多的系统,采用在此处插入对象方式。> 如: 请点击《功能点列表WBS模板.mpp》查看,XXX产品总体功能概要。 或者: XXX产品总体功能概要如下:

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常用技术要求 before the feeding control and the wind meets the tube welding, to the good center, in the hole guaranteed that ¢204 the pipeline can pass through. the 进料接管和出风接管焊前对好中心,内孔保证¢204管道能穿过。 welding uses the manual arc welding, welding rod trademark J420G. before the 焊接采用手工电弧焊,焊条牌号J420G。 painting, must carry on the superficial stain removal, the elimination welding residual and so on, its quality scale sees JB/T5000.12 the stipulation; Prime, in Huang He the blue color (according to color model) the polyurethane finishes two. Besides various laps spread the yellow paint, other spread the blue color. In the paint does not allow to contain the lead. Does not allow to have leaks flaws and so on paint, wrinkle paint. 涂装前要进行表面除锈、清除焊接残渣等,其质量等级见JB/T5000.12的规定;涂底漆一层、中黄和中蓝色(按颜色样板)聚氨酯面漆二层。除各盖板涂中黄漆外,其余均涂蓝色。漆中不允许含铅。不允许有漏漆、皱漆等缺陷。 sealants and so on lap like seal lax available CH107, JLC-1 spread in the slit main point. on 盖板如密封不严可用CH107,JLC-1等密封胶涂在缝隙大处。

物资采购技术规格书模板

XX事业部XX项目 XX设备采购 技术规格书 编制: 审核: 审批: 编制时间:

目录 1、总则 2、设计条件 3、产品标准 4、供货范围 5、技术要求 6、质量性能保证 7、包装运输 8、检验验收 9、技术服务 10、技术资料 11、其他

1、总则 1.1 本技术规格书针对公司XX事业部XX项目XX装置(设备)的采购,提出了相关产品的功能设计制造、供货范围、质量保证、检验验收、包装运输、技术资料及服务等方面的基本要求。 1.2 本技术规格书提出的为最低限度的技术要求,并未对一切技术细节做出规定,也未充分引述有关标准和规范的条文,卖方应提供符合本技术规格书和现行工业标准的成熟、可靠、全新的产品及服务。 1.3卖方对所提供的设备、附件和附属设备的制造质量、供货、技术规格、文件图纸资料、技术服务、工程服务、包装运输、开箱检验、安装指导、现场测试、设备运行等各个环节负有完全责任。卖方对其技术文件的所有内容负完全责任,买方在技术文件上的签字并不意味对卖方责任的解脱。 1.4卖方提供的产品及配套产品必须在中国境内有技术服务和维护能力的服务网点。 1.5本技术规格书未明确事宜,卖方应在设计过程中充分尊重买方意见,在现有国内技术水平能够达到情况下,不得以任何理由拒绝。 1.6本技术规格书中标注“*”和“△”的为重要技术条款,其中标注“*”的为否决条款,标注“△”的视偏离程度进行评分或否决。卖方对重要技术条款必须逐条响应,并给出相关技术指标;如有与

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Ordering Information Type Number QX7137 Package Marking 7137X Lot Number Pin Assignments SOT23-5 7137X GND CS VDD DRV EN 1325 4

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Page 1 Of 12 ShenZhen C&D Electronics CO.Ltd. Add: Building 2, X iayousong Mountaintop Industrial District,Yousong Village,LongHua T own, Baoan District ShenZhen China Zip 518109 Tel: 86-755- 28142422 Fax: 86-755-28142699 E-mail: export@https://www.wendangku.net/doc/dd5198548.html, Remote control specification (Rev. A0) Seller Customer Part Name :Remote control Part No. : Part Name : Part No. : Seller approval Customer approval Prepared By: Date:Received by: Date: Checked By: Date: Checked by: Date: Approved By: Date:Approved by: Date: company chop:company chop: Change history Version Date Description Author Page 2 Of 12 2、目录Index

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