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74LX1G04STR中文资料

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April 2004s 5V TOLERANT INPUTS

s HIGH SPEED:t PD =4.2ns (MAX.)at V CC =3V s

LOW POWER DISSIPATION:I CC =1μA (MAX.)at T A =25°C

POWER DOWN PROTECTION ON INPUTS AND OUTPUTS

SYMMETRICAL OUTPUT IMPEDANCE:|I OH |=I OL =24mA (MIN)at V CC =3V s

BALANCED PROPAGATION DELAYS:t PLH ?t PHL

OPERATING VOLTAGE RANGE:V CC (OPR)=1.65V to 5.5V (1.2V Data Retention)

IMPROVED LATCH-UP IMMUNITY

DESCRIPTION

The 74LX1G04is a low voltage CMOS SINGLE INVERTER fabricated with sub-micron silicon gate and double-layer metal wiring C 2MOS technology.

It is ideal for 1.65to 5.5V CC operations and low power and low noise applications.The internal circuit is composed of 3stages including buffer output,which provide high noise immunity and stable output.

Power down protection is provided on input and output and 0to 7V can be accepted on inputs with

no regard to the supply voltage.It can be interfaced to 5V signal environment for inputs in mixed 3.3/5V system.

All inputs and outputs are equipped with protection circuits against static discharge.

74LX1G04

LOW VOLTAGE CMOS SINGLE INVERTER

WITH 5V TOLERANT INPUT

PIN CONNECTION AND IEC LOGIC SYMBOLS (top view for SOT,top through view for Flip-Chip)

ORDER CODES

PACKAGE T &R SOT23-5L 74LX1G04STR SOT323-5L 74LX1G04CTR Flip-Chip

74LX1G04BJR

74LX1G04

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INPUT AND OUTPUT EQUIVALENT CIRCUIT

PIN DESCRIPTION

TRUTH TABLE

ABSOLUTE MAXIMUM RATINGS

Absolute Maximum Rating are those value beyond which damage to the device may occur.Functional operation under these condition is not implied

1)I O absolute maximum rating must be observed 2)V O

PIN for SOT

PIN for Flip-Chip

SYMBOL NAME AND FUNCTION

1N.C.Not

connected 211A Data Input 431Y Data Output 32GND Ground (0V)

V CC

Positive Supply Voltage

A Y L H H

Symbol Parameter

Value Unit V CC Supply Voltage -0.5to +7.0V V I DC Input Voltage

-0.5to +7.0V V O DC Output Voltage (V CC =0V)

-0.5to +7.0V V O DC Output Voltage (High or Low State)(note 1)-0.5to V CC +0.5

V I IK DC Input Diode Current

-50mA I OK DC Output Diode Current (note 2)-50mA I O

DC Output Current

±50mA I CC or I GND DC V CC or Ground Current per Supply Pin

±50mA T stg Storage Temperature

-65to +150

°C T L

Lead Temperature (10sec)

260

°C

74LX1G04

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RECOMMENDED OPERATING CONDITIONS

1)Truth Table guaranteed:1.2V to 3.6V 2)V IN from 0.8V to 2V at V CC =3.0V

DC SPECIFICATION

Symbol Parameter

Value Unit V CC Supply Voltage (note 1) 1.65to 5.5V V I Input Voltage

0to 5.5V V O Output Voltage (V CC =0V)0to 5.5V V O Output Voltage (High or Low State)

0to V CC V I OH ,I OL High or Low Level Output Current (V CC =4.5to 5.5V)±32mA I OH ,I OL High or Low Level Output Current (V CC =3.0to 3.6V)±24mA I OH ,I OL High or Low Level Output Current (V CC =2.7to 3.0V)±16mA I OH ,I OL High or Low Level Output Current (V CC =2.3to 2.7V)±8mA I OH ,I OL High or Low Level Output Current (V CC =1.65to 2.3V)±4mA T op Operating Temperature

-55to 125°C dt/dv

Input Rise and Fall Time (note 2)

0to 10

ns/V

Symbol

Parameter

Test Condition

Value

Unit

V CC (V)-40to 85°C -55to 125°C Min.Max.

Min.Max.

V IH

High Level Input Voltage

1.65to 1.950.75V CC 0.75V CC V

2.3to 2.70.7V CC 0.7V CC

3.0to 5.5

0.7V CC

V IL

Low Level Input Voltage

1.65to 1.950.25V CC 0.25V CC V

2.3to 2.70.3V CC 0.3V CC

3.0to 5.5

0.3V CC

V OH

High Level Output Voltage

1.65to 4.5I O =-100μA V CC -0.1V CC -0.1V

1.65I O =-4mA 1.2 1.2

2.3I O =-8mA 1.9 1.9

3.0I O =-16mA 2.4 2.4I O =-24mA 2.2 2.2

4.5

I O =-32mA 3.8

3.8

V OL

Low Level Output Voltage

1.65to 4.5I O =100μA 0.10.1V 1.65I O =4mA 0.450.45

2.3I O =8mA 0.30.3

3.0I O =16mA 0.40.4I O =24mA 0.550.55

4.5

I O =32mA 0.550.55I I Input Leakage Current

1.65to 5.5

V I =0to 5.5V ±10±10μA I off Power Off Leakage Current

0V I or V O =5.5V 1010μA I CC

Quiescent Supply Current

1.65to 5.5

V I =V CC or GND

μA

74LX1G04

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AC ELECTRICAL CHARACTERISTICS

CAPACITANCE CHARACTERISTICS

1)C PD is defined as the value of the IC’s internal equivalent capacitance which is calculated from the operating current consumption without load.(Refer to Test Circuit).Average current can be obtained by the following equation.I CC(opr)=C PD x V CC x f IN +I CC

Symbol

Parameter

Test Condition

Value

Unit

V CC (V)C L (pF)

R L (?)

t s =t r (ns)

-40to 85°C -55to 125°C Min.Max.Min.Max.t PLH t PHL

Propagation Delay Time

1.65to 1.95151M ?

2.0

29.5210.5ns

2.3to 2.72 6.527.6

3.0to 3.61 5.51 6.5

4.5to

5.51 4.11 5.51.65to 1.95301000 2.0210.5211.52.3to 2.730500 2.027.528.52.750500 2.51

6.11

7.13.0to 3.650500 2.51 5.51 6.54.5to 5.5

50500 2.5

4.2

5.2

Symbol

Parameter

Test Condition

Value Unit

V CC (V)T A =25°C Min.

Typ.Max.

C IN Input Capacitance

04pF C PD

Power Dissipation Capacitance (note 1)

1.8f IN =10MHz

36.8pF 2.5373.3

74LX1G04

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TEST CIRCUIT

T OUT TEST CIRCUIT AND WAVEFORM SYMBOL VALUE

WAVEFORM:PROPAGATION DELAY (f=1MHz;50%duty cycle)

Symbol

V CC 1.65to 1.95V

2.3to 2.7V 2.7to 5.5V C L 15pF/30pF 15pF/30pF 15pF/50pF R L 1M ?/1000?

500?500?V IH V CC V CC V CC V M V CC /2V CC /2V CC /2t r =t r

<2.0ns

<2.5ns

74LX1G04

Figure1:RECOMMENDED SOLDERING REFLOW PROFILE FOR LEADFREE FLIP-CHIP MOUNTING ON PCB

For Flip-Chip mounting on the PCB,STMicroelectronics recommends the use of a solder stencil aperture of330x330μm2maximum and a typical stencil thickness of125μm.Flip-Chips are fully compatible with the use of near eutectic95.5Sn4Ag0.5Cu solder paste with no clean flux.ST's recommendations for Flip-Chip board mounting are illustrated on the soldering reflow profile shown in figure1below.

Dwell time in the soldering zone(with temperature higher than220°C)has to be kept as short as possible to prevent component and substrate damages.Peak temperature must not exceed260°C.Controlled atmosphere(N2or N2H2)is recommended during the whole reflow,specially above150°C.

Flip-Chips are able to withstand three times the previous recommended reflow profile in order to be compatible with a double reflow when SMDs are mounted on both sides of the PCB plus one additional repair.A maximum of three soldering reflows are allowed for these leadfree packages(with repair step included).The use of a no clean flux is highly recommended to avoid any cleaning operation.In order to prevent any bump cracks,ultrasonic cleaning methods are not recommended.

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74LX1G04

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74LX1G04 Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.

The ST logo is a registered trademark of STMicroelectronics

All other names are the property of their respective owners

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