可伐合金气密封接的预氧化
可伐合金气密封接的预氧化
作者：冷文波， 沈卓身
作者单位：北京科技大学材料科学与工程学院,北京,100083
刊名：
电子与封装
英文刊名：ELECTRONICS & PACKAGING
年，卷(期)：2004,4(3)
被引用次数：5次
参考文献(27条)
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引证文献(5条)
1.罗大为.沈卓身可伐合金与玻璃封接工艺的优化[期刊论文]-北京科技大学学报 2009(1)
2.徐玉文.张政军玻璃金属封接工艺的金相研究[期刊论文]-电子与封装 2008(1)
3.高琳.沈卓身生坯密度和排蜡温度对玻璃绝缘子致密化影响[期刊论文]-电子元件与材料 2006(3)
4.高琳双层玻璃绝缘子在玻璃-金属封接中应用的研究[学位论文]硕士 2006
5.鲍秀峰军用集成电路典型失效模式分析与改进措施研究[学位论文]硕士 2006
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