July 2009Doc ID 9934 Rev 31/24
VNQ500
Quad channel high-side driver
Features
■CMOS compatible I/O’s ■
Chip Enable
■Junction over temperature protection and diagnostic ■Current limitation ■Shorted load protection ■Undervoltage shutdown
■Protection against loss of ground ■Very low standby current
■
In compliance with the 2002/95/EC european directive
Description
The VNQ500 is a monolithic device designed in STMicroelectronics VIPower M0-3 technology, intended for driving any kind of load with one side connected to ground.
Active current limitation, combined with latched thermal shutdown, protect the device against overload.
In the case of over temperature of one channel the relative I/O pin is pulled down.
The device automatically turns off in the case of ground pin disconnection.
Max supply voltage V CC 41V Operating voltage range V CC 5.5 to 36V Max on-state resistance R ON 500m ΩCurrent limitation (typ)I LIM 0.4A Off-state supply current
I S
25 μA
PowerSSO-12
Table 1.Device summary
Package
Order codes
Tube
Tape and reel PowerSSO-12
VNQ500PEP-E
VNQ500PEPTR-E
https://www.wendangku.net/doc/ea8269274.html,
Contents VNQ500
Contents
1Block diagram and pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2Electrical specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
2.1Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
2.2Thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
2.3Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
2.4Electrical characteristics curves . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
3Application information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
3.1GND protection network against reverse battery . . . . . . . . . . . . . . . . . . . 14
3.1.1Solution 1: a resistor in the ground line (RGND only) . . . . . . . . . . . . . . 14
3.1.2Solution 2: a diode (D GND) in the ground line . . . . . . . . . . . . . . . . . . . . 15
3.2Load dump protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
3.3MCU I/O protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
3.4Maximum demagnetization energy (V CC = 13.5V) . . . . . . . . . . . . . . . . . . 16
4Package and thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
4.1PowerSSO-12 thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
5Package and packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
5.1ECOP ACK? packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
5.2PowerSSO-12 mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
5.3PowerSS0-12 packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 6Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
2/24Doc ID 9934 Rev 3
VNQ500List of tables List of tables
Table 1.Device summary. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Table 2.Pin definitions and functions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Table 3.Absolute maximum ratings. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Table 4.Thermal data. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Table 5.Power . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Table 6.Switching (V CC =13V). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Table 7.Input and CE pin. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Table 8.Protections and diagnostics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Table 9.Truth table. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Table 10.Electrical transient requirements on VCC pin. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Table 11.Thermal parameter. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Table 12.PowerSSO-12 mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 Table 13.Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Doc ID 9934 Rev 33/24
List of figures VNQ500 List of figures
Figure 1.Block diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Figure 2.Configuration diagram (top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Figure 3.Current and voltage conventions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Figure 4.Switching time waveforms: turn-on and turn-off. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Figure 5.Driving circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Figure 6.Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Figure 7.Off-state output current. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Figure 8.High level input current. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Figure 9.Input clamp voltage. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Figure 10.Turn-off voltage slope. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Figure 11.Overvoltage shutdown . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Figure 12.Turn-off voltage slope. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Figure 13.ILIM vs Tcase. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Figure 14.On-state resistance vs VCC. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Figure 15.Input high level . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Figure 16.Input hysteresis voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Figure 17.On-state resistance vs Tcase. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Figure 18.Input low level. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Figure 19.Application schematic. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Figure 20.Maximum turn-off current versus load inductance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Figure 21.PowerSSO-12 PC board. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Figure 22.Rthj-amb Vs PCB copper area in open box free air condition . . . . . . . . . . . . . . . . . . . . . . 17 Figure 23.Thermal impedance junction ambient single pulse. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Figure 24.Thermal fitting model of a quad channel HSD in PowerSSO-12 . . . . . . . . . . . . . . . . . . . . 18 Figure 25.PowerSSO-12 package dimensions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 Figure 26.PowerSSO-12 tube shipment (no suffix) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 Figure 27.PowerSSO-12 tape and reel shipment (suffix “TR”). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 4/24Doc ID 9934 Rev 3
1 Block diagram and pin description
Figure 1.Block diagram
Table 2.Pin definitions and functions
Pin No Symbol Function
TAB V CC Positive power supply voltage
7,12V CC Positive power supply voltage
1GND Logic ground
2CE Chip Enable
3I/O 1Input/output of channel 1
4I/O 2Input/output of channel 2
5I/O 3Input/output of channel 3
6I/O 4Input/output of channel 4
8OUTPUT 4High-side output of channel 4
9OUTPUT 3High-side output of channel 3
10OUTPUT 2High-side output of channel 2
11OUTPUT 1High-side output of channel 1V CC
I/O 1
OUTPUT 1
I/O 2 I/O 3 I/O 4
OUTPUT 2
OUTPUT 3
OUTPUT 4 LOGIC
JUNCTION TEMP.
DETECTION
UNDERVOLTAGE
DETECTION
CLAMP POWER
CURRENT LIMITER
V CC
CLAMP
Same structure for all
channels
GND
CE
OT1
OT2
OT3
OT4
Doc ID 9934 Rev 35/24
6/24Doc ID 9934 Rev 3
VNQ500Electrical specifications
Doc ID 9934 Rev 37/24
2 Electrical specifications
2.1
Absolute maximum ratings
Stressing the device above the rating listed in the “Absolute maximum ratings” table may cause permanent damage to the device. These are stress ratings only and operation of the device at these or any other conditions above those indicated in the Operating sections of this specification is not implied. Exposure to Absolute Maximum Rating conditions for extended periods may affect device reliability. Refer also to the STMicroelectronics SURE Program and other relevant quality document.
2.2 Thermal data
Table 3.
Absolute maximum ratings
Symbol Parameter
Value Unit V CC DC supply voltage 41V -V CC Reverse supply voltage -0.3V - I GND DC ground pin reverse current - 250mA I OUT DC output current
Internally limited
A - I OUT Reverse DC output current -1A I IN DC Input current
+/- 10mA V ESD Electrostatic discharge (R = 1.5K Ω; C = 100pF)- I/On
- OUTn and V CC
40005000V V P tot Power dissipation at T c = 25°C 7.3W T j Junction operating temperature Internally limited °C T stg
Storage temperature
- 55 to 150
°C
Table 4.
Thermal data
Symbol
Parameter
Max. value
Unit R thj-case PowerSSO-12 thermal resistance junction-case 17
°C/W R thj-amb PowerSSO-12 thermal resistance junction-ambient
61(1)
1.When mounted on a standard single-sided FR-4 board with 0.5 cm 2 of Cu (at least 35mm thick) connected
to all V CC pins.50(2)
2.When mounted on a standard single-sided FR-4 board with 8 cm 2 of Cu (at least 35mm thick) connected to
all V CC pins.
°C/W
Electrical specifications VNQ500
8/24Doc ID 9934 Rev 3
2.3 Electrical characteristics
Values specified in this section are for 8V stated.Figure 3. Current and voltage conventions Table 5. Power Symbol Parameter Test conditions Min.Typ.Max.Unit V CC (1)1.Per channel. Operating supply voltage 5.51336V V USD (1)Undervoltage shutdown 34 5.5 V V OV (1)Overvoltage shutdown 36 V R ON On-state resistance I OUTn = 0.25A; T j = 25°C I OUTn = 0.25A 5001000m Ωm ΩI S Supply current Off-state; V CC = 13V; V CE = V I/On = 0V; V CE = V I/On = 0V; V CC = 13V; T case = 25°C On-state (all channels ON); V CC = 13V 25 208μA μA mA I LGND (1) Output current at turn-off V CC = V CE = V I/On = V GND = 13V;V OUTn = 0V 1 mA I L(off1)(1)Off-state output current V I/On = V OUTn = 0V 0 50μA I L(off3)(1)Off-state output current V I/On = V OUTn =0 V , V CC = 13V; T J = 125°C 5μA I L(off4)(1)Off-state output current V I/On = V OUTn = 0V , V CC = 13V; T J = 25°C 3 μA I S I GND OUTPUTn V CC GND I/On I OUTn I INn V INn V CC V OUTn CE I CE V CE VNQ500 Electrical specifications Doc ID 9934 Rev 39/24 Table 6. Switching (V CC =13V) Symbol Parameter Test conditions Min. Typ. Max. Unit t on Turn-on time R L = 52Ω from 80% V OUT (1)1. See Figure 4: Switching time waveforms: turn-on and turn-off . 50μs t off Turn-off time R L = 52Ω to 10% V OUT (1)75μs dV OUT /dt (on)Turn-on voltage slope R L = 52Ω from V OUT = 1.3V to V OUT = 10.4V (1) 0.3V/μs dV OUT /dt (off)Turn-off voltage slope R L = 52Ω from V OUT = 11.7V to V OUT = 1.3V (1) 0.3 V/μs Table 7. Input and CE pin Symbol Parameter Test conditions Min. Typ. Max.Unit V INL I/O low level 1.25 V I INL Low level I/O current V IN = 1.25V 1μA V INH I/O high level 3.25 V I INH High level I/O current V IN = 3.25V 10 μA V I(hyst)I/O hysteresis voltage 0.5V V ICL Input clamp voltage I IN = 1mA I IN = - 1mA 6 6.8- 0.7 8 V V Table 8. Protections and diagnostics (1) 1.To ensure long term reliability under heavy overload or short circuit conditions, protection and related diagnostic signals must be used together with a proper software strategy. If the device is subjected to abnormal conditions, this software must limit the duration and number of activation cycles. Symbol Parameter Test conditions Min. Typ. Max.Unit V OL I/O low level default detection I IN = 1mA, latched thermal shutdown 0.5V T TSD Junction shutdown temperature 150175200°C I lim DC short circuit current V CC = 13V; R LOAD = 10m Ω0.40.60.9A V demag T urn-off output clamp voltage I OUT = 0.25 A; L = 50mH V CC -41 V CC -48 V CC - 55V t reset Thermal latch reset time T j < T TSD (see third figure in Figure 6: Waveforms ) 10 μs Electrical specifications VNQ500 10/24Doc ID 9934 Rev 3 Figure 4. Switching time waveforms: turn-on and turn-off Figure 5.Driving circuit 1.See Figure 19: Application schematic . Table 9. Truth table Conditions MCOUTn CE I/On Output_n Normal operation L H H H L H L H Current limitation L H H H L H L H Over temperature L H H H L L (latched) L L Undervoltage L H H H L H L L Standby X L X L t V OUT 90% 10% dV OUT /dt (off) dV OUT /dt (on) 80% t V IN t on t off t r t f MCU MCOUTn I/On VNQ500PEP Rprot (1)OUTPUTn Rprot (1) CE Rprot (1) Diagnostic feedback 分销商库存信息: STM VNQ500N-E VNQ500NTR-E