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BSS123W-7-F中文资料

N E W P R O D U C T

Features

? Low Gate Threshold Voltage ? Low Input Capacitance ? Fast Switching Speed

? Low Input/Output Leakage

? High Drain-Source Voltage Rating ? Lead Free/RoHS Compliant (Note 2)

? Qualified to AEC-Q101 Standards for High Reliability ?

"Green" Device, Note 3 and 4

Mechanical Data

? Case: SOT-323

? Case Material: Molded Plastic, "Green" Molding Compound, Note 4. UL Flammability Classification Rating 94V-0 ? Moisture Sensitivity: Level 1 per J-STD-020C ? Terminal Connections: See Diagram

? Terminals: Solderable per MIL-STD-202, Method 208

? Lead Free Plating (Matte Tin Finish annealed over Alloy 42 leadframe).

? Marking Information: See Page 3 ? Ordering Information: See Page 3 ?

Weight: 0.006 grams (approximate)

SOT-323

TOP VIEW

Equivalent Circuit

Maximum Ratings @T A = 25°C unless otherwise specified

Characteristic

Symbol Value Units Drain-Source Voltage

V DSS 100 V Drain-Gate Voltage R GS ≤ 20K Ω V DGR 100 V Gate-Source Voltage Continuous V GSS ±20 V Drain Current (Note 1) Continuous Pulsed I D I DM

170 680

Thermal Characteristics @T A = 25°C unless otherwise specified

Characteristic

Symbol Value Units Total Power Dissipation (Note 1)

P d 200 mW Thermal Resistance, Junction to Ambient (Note 1) R θJA 625 °C/W Operating and Storage Temperature Range

T j , T STG

-55 to +150 °C

Notes:

1. Part mounted on FR-4 board with recommended pad layout, which can be found on our website at https://www.wendangku.net/doc/ea10451944.html,/datasheets/ap02001.pdf.

2. No purposefully added lead.

3. Diodes Inc.'s "Green" policy can be found on our website at https://www.wendangku.net/doc/ea10451944.html,/products/lead_free/index.php.

4. Product manufactured with Date Code 0627 (week 27, 2006) and newer are built with Green Molding Compound. Product manufactured prior to Date Code 0627 are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants.

元器件交易网https://www.wendangku.net/doc/ea10451944.html,

Electrical Characteristics @T A = 25°C unless otherwise specified

Characteristic

Symbol Min Typ Max Unit Test Condition

OFF CHARACTERISTICS (Note 5)

Drain-Source Breakdown Voltage BV DSS 100 ? ? V V GS = 0V, I D = 250μA Zero Gate Voltage Drain Current

I DSS ? ? 1.010 μA nA V DS = 100V, V GS = 0V V DS = 20V, V GS = 0V Gate-Body Leakage, Forward

I GSSF

V GS = 20V, V DS = 0V

ON CHARACTERISTICS (Note 5) Gate Threshold Voltage

V GS(th)0.8 1.4 2.0 V V DS = V GS , I D = 1mA

Static Drain-Source On-Resistance R DS (ON)?? ?? 6.0

10 Ω

V GS = 10V, I D = 0.17A V GS = 4.5V, I D = 0.17A

Forward Transconductance

g FS 80 370 ?

mS V DS = 10V, I D = 0.17A, f = 1.0KHz Drain-Source Diode Forward Voltage V SD ? 0.84 1.3 V V GS = 0V, I S = 0.34A DYNAMIC CHARACTERISTICS Input Capacitance C iss ? 29 60 pF Output Capacitance

C oss ? 10 15 pF Reverse Transfer Capacitance

C rss ? 2 6 pF V DS = 25V, V GS = 0V, f = 1.0MHz

SWITCHING CHARACTERISTICS Turn-On Rise Time t r ? ? 8 ns Turn-Off Fall Time t f ? ? 16 ns Turn-On Delay Time t D(ON)? ? 8 ns Turn-Off Delay Time

t D(OFF)

V DD = 30V, I D = 0.28A, R GEN = 50Ω, V GS = 10V

N E W P R O D U C T

5. Short duration pulse test used to minimize self-heating effect.

I ,

D R A I N -S O U R C

E C U R R E N T (A )

D V , DRAIN-SOURC

E VOLTAGE (V)Fig. 1 On-Region Characteristics

R , N O R M A L I Z E D D R A I N -S O U R C E O N -R E S I S T A N C E

D S (O N )I , DRAIN-SOURC

E CURRENT (A)

Fig. 2 On-Resistance Variation with Gate Voltage

and Drain-Source Current D

N O R M A L I Z E D T H R E S H O L D V O L T A G E G S (t h ),T , JUNCTION TEMPERATURE (oC)

Fig. 3 Gate Threshold Variation with Temperature J

R N O R M A L I Z E D O N -R E

S I S T A N C E

D S (O N ),T , JUNCTION TEMPERATUR

E (oC)

Fig. 4 On-Resistance Variation with T emperature J

C , C A P A C I T A N C E (p F )

V , DRAIN-SOURCE VOLTAGE (V)

Fig. 5 Typical Capacitance

P , P O W E R D I S S I P A T I O N (m W )

D T , AMBIENT TEMPERATUR

E (°C)Fig. 6 Power Derating Curve, T otal Package A

N E W P R O D U C T

Ordering Information (Notes 4 & 6)

Part Number

Case Packaging BSS123W-7-F

SOT-323 3000/Tape & Reel

Notes: 6. For packaging details, go to our website at https://www.wendangku.net/doc/ea10451944.html,/datasheets/ap02007.pdf.

Marking Information

K23

Y M

K23 = Product Type Marking Code YM = Date Code Marking Y = Year ex: N = 2002

M = Month ex: 9 = September

Date Code Key

Year

2002 2003 2004 2005 2006 2007 2008 2009 2010 2011 2012 Code

N P R S T U V W X Y Z

Month Jan

Feb

Mar

Apr

May

Jun

Jul

Aug

Sep

Oct

Nov

Dec

Package Outline Dimensions

SOT-323

Dim Min Max A 0.25 0.25 B 1.15 1.35 C 2.00 2.00 D 0.65 Nominal E 0.30 0.40 G 1.20 1.40 H 1.80 2.20 J 0.0 0.10 K 0.90 1.00 L 0.25 0.40 M 0.10 0.18

0° 8° All Dimensions in mm

N E W P R O D U C T

Suggested Pad Layout

X E

Y C

Dimensions Value (in mm)

Z 2.8 G 1.0 X 0.7 Y 0.9 C 1.9 E 0.65

IMPORTANT NOTICE

Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes without further notice to any product herein. Diodes Incorporated does not assume any liability arising out of the application or use of any product described herein; neither does it convey any license under its patent rights, nor the rights of others. The user of products in such applications shall assume all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on our website, harmless against all damages.

LIFE SUPPORT

Diodes Incorporated products are not authorized for use as critical components in life support devices or systems without the expressed written approval of the President of Diodes Incorporated.