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DFM600LXS18-A000中文资料

DFM600LXS18-A000中文资料
DFM600LXS18-A000中文资料

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FEATURES

s Low Reverse Recovery Charge s High Switching Speed s Low Forward Voltage Drop s Isolated Base

APPLICATIONS

s Brake Chopper Diode s Boost and Buck Converters s Free-wheel Circuits s Motor Drives s Resonant Converters s Induction Heating

s Multi-level Switch Inverters

The DFM600LXS18-A000 is a single 1800 volt fast recovery diode (FRD) module. Designed for low power loss, the module is suitable for a variety of high voltage applications in motor drives and power conversion.Fast switching times and low reverse recovery losses allow high frequency operation making the device suitable for the latest drive designs employing PWM and high frequency switching.

These modules incorporate electrically isolated base plates and low inductance construction enabling circuit designers to optimise circuit layouts and utilise grounded heat sinks for safety.

ORDERING INFORMATION

Order As:

DFM600LXS18-A000

Note: When ordering, please use the complete part number.

Preliminary Information

DS5430-1.4 April 2001

KEY PARAMETERS V RRM 1800V

V F (typ)

2.0V I F

(max)600A I FM

(max)1200A

Fig. 2 Electrical connections - (not to scale)

Outline type code: L

(See package details for further information)1

2

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Units V A A A 2s W kV pC

ABSOLUTE MAXIMUM RATINGS

Stresses above those listed under 'Absolute Maximum Ratings' may cause permanent damage to the device. In extreme conditions, as with all semiconductors, this may include potentially hazardous rupture of the package. Appropriate safety precautions should always be followed. Exposure to Absolute Maximum Ratings may affect device reliability.T case = 25?C unless stated otherwise Symbol V RRM I F I FM I 2t P max V isol Q pd

Test Conditions

T vj = 25?C DC, T case = 65?C T case = 110?C, t p = 1ms V R = 0, t p = 10ms, T vj = 125?C T case = 25?C, T vj = 125?C

Commoned terminals to base plate. AC RMS, 1 min, 50Hz IEC1287. V 1 = 1500V, V 2 = 1100V, 50Hz RMS

Max.1800600120012020804.010

Parameter

Repetitive peak reverse voltage Forward current Max. forward current I 2t value fuse current rating Maximum power dissipation Isolation voltage Partial discharge

Test Conditions

Continuous dissipation -junction to case

Mounting torque 5Nm (with mounting grease)

--Mounting - M6

Electrical connections - M6

Parameter

Thermal resistance - diode

Thermal resistance - case to heatsink (per module)

Junction temperature Storage temperature range Screw torque

THERMAL AND MECHANICAL RATINGS

Symbol R th(j-c)

R th(c-h)

T j T stg -

Units ?C/kW

?C/kW

?C ?C Nm Nm

Max.48

1512512555

Typ.-

-----

Min.-

--–40--

Internal insulation:Al 2O 3Baseplate material:Cu Creepage distance:22mm Clearance:

12mm CTI (Critical Tracking Index):

175

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Test Conditions

I F = 600A,dI F /dt = 4000A/μs,

V R = 900V

Test Conditions

V R = 1800V, T vj = 125?C I F = 600A

I F = 600A, T vj = 125?C

-Parameter

Peak reverse current Forward voltage

Module inductance

STATIC ELECTRICAL CHARACTERISTICS

T vj = 25?C unless stated otherwise.Symbol I RM V F

L M

Units mA V V nH

Max.102.32.3-Typ.-2.02.015

Min.----Parameter

Peak reverse recovery current Reverse recovery charge Reverse recovery energy

Symbol I rr Q rr E rec

Units A μC mJ

Max.---Typ.440160120

Min.---DYNAMIC ELECTRICAL CHARACTERISTICS

T vj = 25?C unless stated otherwise.T vj = 125?C unless stated otherwise.Test Conditions

I F = 600A,dI F /dt = 4000A/μs,

V R = 900V

Parameter

Peak reverse recovery current Reverse recovery charge Reverse recovery energy

Symbol I rr Q rr E rec

Units A μC mJ

Max.---Typ.510270180

Min.---

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TYPICAL CHARACTERISTICS

Fig. 2 Diode typical forward characteristics Fig. 4 Transient thermal impedance

Fig. 5 Power dissipation Fig. 6 DC current rating vs case temperature

01000200030000

20

406080100120140160

Case temperature, T case - (?C)

P o w e r d i s s i p a t i o n , P t o t - (W )

0200

400

600

800

1000

1200

20

406080100120140160

Case temperature, T case - (?C)

D C f o r w a r d c u r r e n t , I F - (A )

Fig. 7 RBSOA

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PACKAGE DETAILS

For further package information, please contact your local Customer Service Centre. All dimensions in mm, unless stated otherwise. DO NOT SCALE.

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POWER ASSEMBLY CAPABILITY

The Power Assembly group was set up to provide a support service for those customers requiring more than the basic

semiconductor, and has developed a flexible range of heatsink and clamping systems in line with advances in device voltages and current capability of our semiconductors.

We offer an extensive range of air and liquid cooled assemblies covering the full range of circuit designs in general use today. The Assembly group continues to offer high quality engineering support dedicated to designing new units to satisfy the growing needs of our customers.

Using the latest CAD methods our team of design and applications engineers aim to provide the Power Assembly Complete Solution (PACs).

HEATSINKS

The Power Assembly group has its own proprietary range of extruded aluminium heatsinks. They have been designed to optimise the performance of Dynex semiconductors. Data with respect to air natural, forced air and liquid cooling (with flow rates) is available on request.

For further information on device clamps, heatsinks and assemblies, please contact your nearest sales representative or customer service office.

CUSTOMER SERVICE CENTRES

Mainland Europe Tel: +33 (0)1 58 04 91 00. Fax: +33 (0)1 46 38 51 33North America Tel: 011-800-5554-5554. Fax: 011-800-5444-5444

UK, Scandinavia & Rest Of World Tel: +44 (0)1522 500500. Fax: +44 (0)1522 500020SALES OFFICES

Mainland Europe Tel: +33 (0)1 58 04 91 00. Fax: +33 (0)1 46 38 51 33

North America Tel: (613) 723-7035. Fax: (613) 723-1518. Toll Free: 1.888.33.DYNEX (39639) /Tel: (949) 733-3005. Fax: (949) 733-2986.

UK, Scandinavia & Rest Of World Tel: +44 (0)1522 500500. Fax: +44 (0)1522 500020

These offices are supported by Representatives and Distributors in many countries world-wide.? Dynex Semiconductor 2001 Publication No. DS5430-1 Issue No. 1.4 April 2001

TECHNICAL DOCUMENTATION – NOT FOR RESALE. PRINTED IN UNITED KINGDOM

HEADQUARTERS OPERATIONS DYNEX SEMICONDUCTOR LTD Doddington Road, Lincoln.

Lincolnshire. LN6 3LF. United Kingdom.Tel: 00-44-(0)1522-500500Fax: 00-44-(0)1522-500550DYNEX POWER INC.99 Bank Street, Suite 410,

Ottawa, Ontario, Canada, K1P 6B9Tel: 613.723.7035Fax: 613.723.1518

Toll Free: 1.888.33.DYNEX (39639)

This publication is issued to provide information only which (unless agreed by the Company in writing) may not be used, applied or reproduced for any purpose nor form part of any order or contract nor to be regarded as a representation relating to the products or services concerned. No warranty or guarantee express or implied is made regarding the capability, performance or suitability of any product or service. The Company reserves the right to alter without prior notice the specification, design or price of any product or service. Information concerning possible methods of use is provided as a guide only and does not constitute any guarantee that such methods of use will be satisfactory in a specific piece of equipment. It is the user's responsibility to fully determine the performance and suitability of any equipment using such information and to ensure that any publication or data used is up to date and has not been superseded. These products are not suitable for use in any medical products whose failure to perform may result in significant injury

or death to the user. All products and materials are sold and services provided subject to the Company's conditions of sale, which are available on request.

All brand names and product names used in this publication are trademarks, registered trademarks or trade names of their respective owners.

https://www.wendangku.net/doc/e214385259.html,

e-mail: power_solutions@https://www.wendangku.net/doc/e214385259.html,

Datasheet Annotations:

Dynex Semiconductor annotate datasheets in the top right hard corner of the front page, to indicate product status. The annotations are as follows:-Target Information: This is the most tentative form of information and represents a very preliminary specification. No actual design work on the product has been started.Preliminary Information: The product is in design and development. The datasheet represents the product as it is understood but details may change.Advance Information: The product design is complete and final characterisation for volume production is well in hand.No Annotation: The product parameters are fixed and the product is available to datasheet specification.

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