CHV2411A_0709中文资料

Ref. : DSCHV2411aQDG7254 - 11 Sept 07

1/10

Specifications subject to change without notice

Fully Integrated HBT K-band VCO

GaAs Monolithic Microwave IC

In QFN package

Description

The

CHV2411a-QDG is a monolithic

multifunction for frequency generation. It integrates a X-band “push-push” oscillator with frequency control (VCO) thanks to base-collector diodes, used as varactors, a K-band buffer amplifiers and a divider by 8. The VCO is fully integrated on HBT process. All the active devices are internally self biased.

The circuit is fully integrated on InGaP HBT process: 2μm emitter length, via holes through the substrate and high Q passive elements.

The chip is delivered in a 24 Leads RoHS compliant QFN4x4 package.

Main Features

K-band VCO+K-band buffers+Prescalar/8 Fully integrated VCO (no need for external

Resonator

Low phase noise

High temperature range

High frequency stability On chip self biased devices

Standard SMD package : 24L-QFN4x4

Main Characteristics

Symbol Parameter

Min Typ Max Unit F_out Specified output frequency range 24

24.125 24.25

GHz F_vco Oscillator frequency

F_out/2 GHz IF_out Output Intermediate frequency F_out/16 GHz Pout Output power at F_out

13 16 dBm PFI Output power at Intermediate frequency (IF) -3 0 dBm PN

SSB Phase Noise @ F_out @ 100 kHz

-90

-80 dBc/Hz

ESD Protection : Electrostatic discharge sensitive device. Observe handling precautions !

CHV2411aQDG K-band VCO Electrical Characteristics

Full temperature range

VCO & buffer Part

Symbol Parameters Min Typ Max Unit

F_out Output Frequency range (Operating band) 24 24.25 GHz

F_vco VCO frequency F_out/2

V_Tune Voltage Tuning range 1 6 V

Tuning sensitivity 250 400 725 MHz/V

Frequency drift rate 5 MHz/°C H1 Harmonics ? F_out -20 dBc

H3 Harmonics 3/2 F_out -40 dBc

H4 Harmonics 2 F_out -20 dBc

PN SSB Phase Noise given @ F_out @ 100 KHz -90 -80 dBc/Hz

Main Output (RF_Out) VSWR 2:1

Pulling into 2:1 VSWR for all phases 8 MHz

Pushing @ within the V_tune range 250MHz/V P_out Output Power on RF_out port 13 16 19 dBm

Positive supply current 140 170 mA

Prescalar Part

Symbol Parameters Min Typ Max Unit

IF_out IF Output Frequency F_out/16 GHz

Output Power -3 0 dBm

Positive supply current 80 110 mA

Prescalar Output (IF) VSWR 2:1

General

Symbol Parameters Min Typ Max Unit

VB,V1,VB1,V2,V

Positive supply voltage 5 V B2,VD

Total Positive supply current 220 280 mA +I

(IB1+IB2+I1+I2)

Top Operating temperature range -40 +100 °C

All the parameters are specified between 1V and 6V of Tuning Voltage

Remark :

The minimum and maximum values take into account the spread due to the operating temperature

and process spread.

These performance has been obtained with the chip in QFN package assembled on the recommended boards (ref. 96348 B) described in this document. These performances are highly dependent on this environment.

Absolute Maximum Ratings (1)

Symbol Parameters Values Unit

V_tune Positive Tuning voltage 10 V

+V Positive supply voltage 6 V

+ID Positive supply current (Prescalar) 120 mA

+IB1 / +IB2 Positive supply current (buffers 2 & 3) 50 / 55 mA

+I1 / +I2 Positive supply current (VCO+ buffer 1) 35 / 50 mA

+IB Positive supply current (prescalar‘s buffer) 15 mA

Top Operating temperature range (2) -40 to +100 °C

Tstg Storage temperature range -55 to +125 °C

(1) Operation of this device above anyone of these parameters may cause permanent damage. Duration < 1s

(2) temperature of the back side of the QFN package

K-band VCO

CHV2411aQDG

Typical QFN measurements on board 95791 (QFN plan)

Remark : The temperature mentioned below is taken at the back side of the QFN package.

T=100°C

T=25°C

T= -40°C

T=100°C

T=25°C

T= -40°C

Sensitivity versus Vtune

Output Frequency versus Vtune

CHV2411aQDG

K-band VCO

T=100°C

T=25°C

T= -40°C

T=100°C

T=25°C

T= -40°C

IF Output Power versus Vtune

Output Power @24GHz versus Vtune

K-band VCO

CHV2411aQDG

@ 10 kHz from Carrier

T=25°C

Phase Noise vs Tuning Voltage @ 100 kHz from Carrier

Phase Noise vs Offset frequency from carrier

Phase Noise versus Offset frequency from carrier Phase Noise versus Vtune

CHV2411aQDG K-band VCO QFN Outline

K-band VCO

CHV2411aQDG

QFN Pin-out description

Pin number Pin name

Symbol Name

Description

15,17 GND Ground

2 P IF_out IF output at 1.5 GHz 4

VT

V_Tune Frequency Tuning Port 5,11,13,20,21,23

VB, V1, VB1, VB2,V2, VD

+V Positive supply voltage

5 VB Positive supply voltage of 12 GHz prescalar’s buffer 11,21 V1,V2 Positive supply voltage of the VCO core+1st

stage of the 24GHZ buffers

13 VB1 Positive supply voltage of the 2nd & 3rd

stages of the 24GHZ buffers

20 VB2 Positive supply voltage of the 4th

stages of the 24GHZ buffers

23 VD Positive supply voltage of the Prescalar 16 RF F_out RF output at 24 GHz 2

P F_out/16

Prescalar output at 1.5 GHz 1,3,6,7,8,9,10,12,14,18, 19,22,24 Nc

Not connected

External Components and bias configuration (recommended)

Important: Need for a capacitor on the prescalar output port as a DC block (C2).

CHV2411aQDG

K-band VCO

Recommended Test Fixture (Ref. 96348 B) for measurements over Temperature Range

K-band VCO

CHV2411aQDG

ESD sensitivity Norm

Value

MIL-STD-1686C HBM Class 1 (<1000V)

ESD STM5.1-1998

HBM Class 0 (<250V)

Package Information

Parameter

Package body material RoHS-compliant Low stress Injection Molded Plastic Lead finish 100% matte Sn MSL Rating

MSL1

Recommended surface mount package assembly (see UMS AN0017)

For volume production the SMD type package can be treated as a standard surface mount component (please refer to the IPC/JEDEC J-STD-020C standard or equivalent). The assembly on the motherboard can be performed using a standard assembly process (e.g. stencil solder printing, standard pick-and-place machinery, and solder reflow oven). However, caution should be taken to perform a good and reliable contact over the whole pad area.

MAXIMUM RECOMMENDED REFLOW PROFILE for LEADFREE SMT ASSEMBLY PRODUCTS

Time (s)

T e m p e r a t u r e (°C )

Attention:

The solder thickness after reflow should be typical 50μm [2 mils] and the lateral alignment between the package and the motherboard should be within 50μm [2 mils].

It is important for the performance of the product that the whole overlapping area between the motherboard and package pads is connected. Voids or other improper connections, in particular, between the ground pads on motherboard and package will lead to a deterioration of the RF performance and the heat dissipation. The latter effect can reduce drastically reliability and lifetime of the product.

CHV2411aQDG K-band VCO

Ordering Information

24L-QFN4x4 Lead Free Package : CHV2411aQDG/XY

Stick: XY=20 Tape and reel: XY=21

Information furnished is believed to be accurate and reliable. However United Monolithic Semiconductors

S.A.S. assumes no responsibility for the consequences of use of such information nor for any infringement of

patents or other rights of third parties which may result from its use. No license is granted by implication or

otherwise under any patent or patent rights of United Monolithic Semiconductors S.A.S.. Specifications

mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. United Monolithic Semiconductors S.A.S. products are not authorised for use

as critical components in life support devices or systems without express written approval from United

Monolithic Semiconductors S.A.S.