文档库 最新最全的文档下载
当前位置:文档库 › OP07C中文资料

OP07C中文资料

OP07C中文资料
OP07C中文资料

OUT ?+

OFFSET N2

IN?IN+OFFSET N1

13

2

8612348765OFFSET N1

IN?

IN+

V CC?OFFSET N2V CC+OUT NC

D OR P PACKAGE

(TOP VIEW)NC ?No internal connection

OP07C,OP07D

https://www.wendangku.net/doc/f37780126.html, SLOS099F –OCTOBER 1979–REVISED JANUARY 2014

OP07x Precision Operational Amplifiers

Check for Samples:OP07C ,OP07D

FEATURES

DESCRIPTION These devices offer low offset and long-term stability ?Low Noise

by means of a low-noise,chopperless,bipolar-input-?No External Components Required

transistor amplifier circuit.For most applications,?Replace Chopper Amplifiers at a Lower Cost

external components are not required for offset nulling and frequency compensation.The true ?Wide Input-Voltage Range:0to ±14V Typ

differential input,with a wide input-voltage range and

?

Wide Supply-Voltage Range:±3V to ±18V outstanding common-mode rejection,provides

maximum flexibility and performance in high-noise

environments and in noninverting applications.Low

bias currents and extremely high input impedances

are maintained over the entire temperature range.

The OP07devices are unsurpassed for low-noise,

high-accuracy amplification of very-low-level signals.

These devices are characterized for operation from

0°C to 70°C.

Symbol

Please be aware that an important notice concerning availability,standard warranty,and use in critical applications of

7 6

4V CC+ OUT

V CC?

OFFSET N1 OFFSET N2

IN+

IN?1 8

3 2

COMPONENT COUNT

Resistors Transistors Capacitors 28 39 4

OP07C,OP07D

SLOS099F–OCTOBER1979–REVISED https://www.wendangku.net/doc/f37780126.html,

Schematic

Current values shown are nominal.

OP07C,OP07D https://www.wendangku.net/doc/f37780126.html, SLOS099F–OCTOBER1979–REVISED JANUARY2014

Absolute Maximum Ratings

over operating free-air temperature range(unless otherwise noted)(1)

MIN MAX UNIT V CC+(2)22 Supply voltage V

V CC–(2)–22 Differential input voltage(3)±30V

V I Input voltage range(either input)(4)±22V Duration of output short circuit(5)Unlimited

D package97

θJA Package thermal impedance,junction to free air(6)(7)°C/W

P package85

T J Operating virtual-junction temperature150°C Lead temperature1,6mm(1/16in)from case for10s260°C

T stg Storage temperature range–65150°C (1)Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device.These are stress ratings

only,and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied.Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)All voltage values,unless otherwise noted,are with respect to the midpoint between V CC+and V CC?.

(3)Differential voltages are at IN+with respect to IN?.

(4)The magnitude of the input voltage must never exceed the magnitude of the supply voltage or15V,whichever is less.

(5)The output may be shorted to ground or to either power supply.

(6)Maximum power dissipation is a function of T J(max),θJA,and T A.The maximum allowable power dissipation at any allowable ambient

temperature is P D=(T J(max)–T A)/θJA.Selecting the maximum of150°C can affect reliability.

(7)The package thermal impedance is calculated in accordance with JESD51-7.

Recommended Operating Conditions

over operating free-air temperature range(unless otherwise noted)

MIN MAX UNIT

V CC±Supply voltage±3±18V

V IC Common-mode input voltage V CC±=±15V–1313V

T A Operating free-air temperature070°C

OP07C,OP07D

SLOS099F–OCTOBER1979–REVISED https://www.wendangku.net/doc/f37780126.html,

Electrical Characteristics

at specified free-air temperature,V CC±=±15V(unless otherwise noted)(1)

OP07C OP07D PARAMETER TEST CONDITIONS T A(2)UNIT

MIN TYP MAX MIN TYP MAX

25°C60150

V IO Input offset voltage V O=0V R S=50ΩμV

0°C to70°C85250

Temperature coefficient

αVIO V O=0V R S=50Ω0°C to70°C0.5 2.5μV/°C of input offset voltage

Long-term drift of input

See(3)0.4μV/mo offset voltage

Offset adjustment range R S=20kΩ,See Figure125°C±4mV

25°C0.86

I IO Input offset current nA

0°C to70°C 1.68

Temperature coefficient

αIIO0°C to70°C1250pA/°C of input offset current

25°C±1.8±12

I IB Input bias current nA

0°C to70°C±2.2±14

Temperature coefficient

αIIB0°C to70°C1850pA/°C of input bias current

25°C±13±14±13±14 Common-mode input

V ICR V voltage range0°C to70°C±13±13.5±13±13.5

R L≥10kΩ±12±13±12±13

R L≥2kΩ25°C±11.5±12.8±11.5±12.8

V OM Peak output voltage V

R L≥1kΩ±12±12

R L≥2kΩ0°C to70°C±11±12.6±11±12.6

V CC=15V,V O=1.4V to11.4V,

25°C100400400

R L≥500kΩ

Large-signal differential

A VD V/mV

voltage amplification25°C120400120400

V O=±10,R L=2kΩ

0°C to70°C100400100400

B1Unity-gain bandwidth25°C0.40.60.40.6MHz

r i Input resistance25°C833731MΩ

25°C10012094110 Common-mode

CMRR V IC=±13V,R S=50ΩdB rejection ratio0°C to70°C9712094106

25°C732732 Supply-voltage sensitivity

k SVS V CC+=±3V to±18V,R S=50ΩμV/V (ΔV IO/ΔV CC)0°C to70°C10511051

V O=0,No load8015080150

P D Power dissipation25°C mW

V CC+=±3V,V O=0,No load4848

(1)Since long-term drift cannot be measured on the individual devices prior to shipment,this specification is not intended to be a warranty.

It is an engineering estimate of the averaged trend line of drift versus time over extended periods after the first30days of operation.

(2)All characteristics are measured with zero common-mode input voltage,unless otherwise specified.

(3)The package thermal impedance is calculated in accordance with JESD51-7.

OUT V CC

C+

IN?IN+–OP07C,OP07D

https://www.wendangku.net/doc/f37780126.html, SLOS099F –OCTOBER 1979–REVISED JANUARY 2014

Operating Characteristics

at specified free-air temperature,V CC =5V (unless otherwise noted)

OP07C OP07D PARAMETER

TEST CONDITIONS (1)UNIT

TYP TYP f =10Hz

10.510.5V n

Input offset voltage f =100Hz 10.210.3nV/√Hz f =1kHz 9.89.8V N(PP)

Peak-to-peak equivalent input noise voltage f =0.1Hz to 10Hz 0.380.38μV f =10Hz 0.350.35I n

Equivalent input noise current f =100Hz 0.150.15nV/√Hz f =1kHz 0.130.13I N(PP)

Peak-to-peak equivalent input noise current f =0.1Hz to 10Hz 1515pA SR Slew rate R L ≥2k Ω0.30.3V/μs (1)All characteristics are measured under open-loop conditions,with zero common-mode input voltage,unless otherwise noted.

APPLICATION INFORMATION

Figure 1.Input Offset-Voltage Null Circuit

OP07C,OP07D

SLOS099F–OCTOBER1979–REVISED https://www.wendangku.net/doc/f37780126.html,

REVISION HISTORY

Changes from Revision E(May2004)to Revision F Page

?Updated document to new TI data sheet format-no specification changes (1)

?Deleted Ordering Information table (1)

PACKAGING INFORMATION

(1) The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

Addendum-Page 1

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check https://www.wendangku.net/doc/f37780126.html,/productcontent for the latest availability information and additional product content details.

TBD: The Pb-Free/Green conversion plan has not been defined.

Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.

Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.

Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)

(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.

(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device.

(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

Addendum-Page 2

TAPE AND REEL INFORMATION

*All dimensions are nominal Device Package Type Package Drawing

Pins

SPQ Reel Diameter (mm)Reel Width W1(mm)A0(mm)B0(mm)K0(mm)P1(mm)W (mm)Pin1Quadrant OP-07DPSR SO

PS 82000330.016.48.2 6.6 2.512.016.0Q1OP07CDR SOIC

D 82500330.012.4 6.4 5.2 2.18.012.0Q1OP07CDRG4SOIC

D 82500330.012.4 6.4 5.2 2.18.012.0Q1OP07DDR SOIC D 82500

330.012.4 6.4 5.2 2.18.012.0Q1

*All dimensions are nominal

Device Package Type Package Drawing Pins SPQ Length(mm)Width(mm)Height(mm) OP-07DPSR SO PS82000367.0367.038.0 OP07CDR SOIC D8*******.5338.120.6 OP07CDRG4SOIC D8*******.5338.120.6

OP07DDR SOIC D8*******.5338.120.6

IMPORTANT NOTICE

Texas Instruments Incorporated and its subsidiaries(TI)reserve the right to make corrections,enhancements,improvements and other changes to its semiconductor products and services per JESD46,latest issue,and to discontinue any product or service per JESD48,latest issue.Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.All semiconductor products(also referred to herein as“components”)are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.

TI warrants performance of its components to the specifications applicable at the time of sale,in accordance with the warranty in TI’s terms and conditions of sale of semiconductor products.Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty.Except where mandated by applicable law,testing of all parameters of each component is not necessarily performed.

TI assumes no liability for applications assistance or the design of Buyers’products.Buyers are responsible for their products and applications using TI components.To minimize the risks associated with Buyers’products and applications,Buyers should provide adequate design and operating safeguards.

TI does not warrant or represent that any license,either express or implied,is granted under any patent right,copyright,mask work right,or other intellectual property right relating to any combination,machine,or process in which TI components or services are https://www.wendangku.net/doc/f37780126.html,rmation published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement https://www.wendangku.net/doc/f37780126.html,e of such information may require a license from a third party under the patents or other intellectual property of the third party,or a license from TI under the patents or other intellectual property of TI.

Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties,conditions,limitations,and notices.TI is not responsible or liable for such altered https://www.wendangku.net/doc/f37780126.html,rmation of third parties may be subject to additional restrictions.

Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements.

Buyer acknowledges and agrees that it is solely responsible for compliance with all legal,regulatory and safety-related requirements concerning its products,and any use of TI components in its applications,notwithstanding any applications-related information or support that may be provided by TI.Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures,monitor failures and their consequences,lessen the likelihood of failures that might cause harm and take appropriate remedial actions.Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in safety-critical applications.

In some cases,TI components may be promoted specifically to facilitate safety-related applications.With such components,TI’s goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements.Nonetheless,such components are subject to these terms.

No TI components are authorized for use in FDA Class III(or similar life-critical medical equipment)unless authorized officers of the parties have executed a special agreement specifically governing such use.

Only those TI components which TI has specifically designated as military grade or“enhanced plastic”are designed and intended for use in military/aerospace applications or environments.Buyer acknowledges and agrees that any military or aerospace use of TI components which have not been so designated is solely at the Buyer's risk,and that Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use.

TI has specifically designated certain components as meeting ISO/TS16949requirements,mainly for automotive use.In any case of use of non-designated products,TI will not be responsible for any failure to meet ISO/TS16949.

Products Applications

Audio https://www.wendangku.net/doc/f37780126.html,/audio Automotive and Transportation https://www.wendangku.net/doc/f37780126.html,/automotive

Amplifiers https://www.wendangku.net/doc/f37780126.html, Communications and Telecom https://www.wendangku.net/doc/f37780126.html,/communications

Data Converters https://www.wendangku.net/doc/f37780126.html, Computers and Peripherals https://www.wendangku.net/doc/f37780126.html,/computers

DLP?Products https://www.wendangku.net/doc/f37780126.html, Consumer Electronics https://www.wendangku.net/doc/f37780126.html,/consumer-apps

DSP https://www.wendangku.net/doc/f37780126.html, Energy and Lighting https://www.wendangku.net/doc/f37780126.html,/energy

Clocks and Timers https://www.wendangku.net/doc/f37780126.html,/clocks Industrial https://www.wendangku.net/doc/f37780126.html,/industrial

Interface https://www.wendangku.net/doc/f37780126.html, Medical https://www.wendangku.net/doc/f37780126.html,/medical

Logic https://www.wendangku.net/doc/f37780126.html, Security https://www.wendangku.net/doc/f37780126.html,/security

Power Mgmt https://www.wendangku.net/doc/f37780126.html, Space,Avionics and Defense https://www.wendangku.net/doc/f37780126.html,/space-avionics-defense Microcontrollers https://www.wendangku.net/doc/f37780126.html, Video and Imaging https://www.wendangku.net/doc/f37780126.html,/video

RFID https://www.wendangku.net/doc/f37780126.html,

OMAP Applications Processors https://www.wendangku.net/doc/f37780126.html,/omap TI E2E Community https://www.wendangku.net/doc/f37780126.html,

Wireless Connectivity https://www.wendangku.net/doc/f37780126.html,/wirelessconnectivity

Mailing Address:Texas Instruments,Post Office Box655303,Dallas,Texas75265

Copyright?2014,Texas Instruments Incorporated

相关文档