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HPMD-7905中文资料

Agilent HPMD-7905 FBAR Duplexer for US PCS Band

Data Sheet

General Description

The HPMD-7905 is a miniaturized duplexer designed for US PCS handset, designed using Agilent Technologies’ Film Bulk Acoustic Resonator (FBAR) Technology. The HPMD-7905 features a very small size: it is less than 2 mm thick and has a footprint of only 5.6 x 11.9 mm2.

The HPMD-7905 enhances the sensitivity and dynamic range of CDMA receivers, providing more than 49 dB attenuation of transmitted signal at the receiver input, and more than 37 dB rejection of the transmit-generated noise in the receive band. Typical insertion loss in the Tx channel is only 2.5 dB, minimizing current drain from the power amplifier. Typical insertion loss in the Rx channel is 3.0 dB, improving receiver sensitivity.

Agilent’s thin-Film Bulk Acoustic Resonator (FBAR) technology makes possible high-Q filters at a fraction their usual size. The excellent power handling of the bulk-mode resonators supports the high output powers needed in PCS handsets, with virtually no added distortion.

Features

?Miniature size: less than 2 mm high;

5.6 x 11.9 footprint

?Rx Band: 1930-1990 MHz

Typical performance:

Rx noise blocking: 42dB

Insertion loss: 3.0 dB

?Tx Band: 1850-1910 MHz

Typical performance:

Tx interferer blocking: 54dB

Insertion Loss: 2.5 dB

?30 dBm Tx power handling

Applications

?Handsets or data terminals

operating in the US PCS frequency

band

Board Diagram

Functional Block Diagram

port numbers are circled

HPMD-7905 Electrical Specifications, Z O = 50?, T C[1] as indicated

+25°C[1,3] +85°C[1,2,3]–30°C[1,2,3] Symbol Parameters Units Min Typ Max Min Max Min Max f RX Receive Bandwidth MHz1930.6—1989.41930.61989.41930.61989.4 S23 Rx Attenuation in Transmit Band dB48——47—45—(1850.6–1853 MHz)

S23 Rx Attenuation in Transmit Band dB5054—47—47—(1853–1909.4 MHz)

S23 Rx Insertion Loss in Receive Band dB—— 3.5— 3.5— 4.5 (1930.6–1935 MHz)

S23 Rx Insertion Loss in Receive Band dB— 3.0 3.5— 3.8— 3.8 (1935–1987 MHz)

S23 Rx Insertion Loss in Receive Band dB—— 3.5— 3.8— 3.5 (1987–1989.4 MHZ)

? S23Ripple in Receive Band dB— 1.5—————

S22 Rx Return Loss in Receive Band dB8.0——8.0—8.0—

f TX Transmit Bandwidth MHz1850.6—1909.41850.61909.41850.61909.4 S31 Tx Attenuation in Receive Band dB39——37.5—32.5—(1930.6–1931 MHz)

S31 Tx Attenuation in Receive Band dB39——37.5—35—(1931–1934 MHz)

S31 Tx Attenuation in Receive Band dB3942—37.5—37.5—(1934–1987 MHz)

S31 Tx Attenuation in Receive Band dB37.5——35—37.5—(1987–1989.4 MHz)

S31 Tx Insertion Loss in Transmit Band dB— 2.5 3.0— 3.8— 3.8 (1850.6–1853 MHz)

S31 Tx Insertion Loss in Transmit Band dB— 2.5 3.0— 3.5— 3.5 (1853–1907 MHz)

S31 Tx Insertion Loss in Transmit Band dB—— 3.0— 3.8— 3.0 (1907–1909.4 MHz)

? S31Ripple in Transmit Band dB— 2.0—————

S11 Tx Return Loss in Transmit Band dB8.0——8.0—8.0—

IP3Third Order Intercept Point dBm—>60—————

S21Tx-Rx Isolation (1850.6–1860 MHz)dB49——47—47—

S21Tx-Rx Isolation (1860–1907 MHz)dB5054—48—47—

S21Tx-Rx Isolation (1907–1909.4 MHz)dB5054—45—48—

S21Tx-Rx Isolation (1930.6–1934 MHz)dB3942—38—35—

S21Tx-Rx Isolation (1934–1972 MHz)dB3942—38—38—

S21Tx-Rx Isolation (1972–1975 MHz)dB3942—37—38—

S21Tx-Rx Isolation (1975–1989.4 MHz)dB37——35—37—

Absolute Maximum Ratings[4] Parameter Unit Value Operating temperature[1]°C-30 to +85 Storage temperature[1]°C-30 to +100Notes:

1.T

is defined as case temperature, the temperature of the underside of the duplexer where it makes contact with the circuit board.

2.Specifications are given at operating temperature limits and room temperature. To estimate

performance at some intermediate temperature, use linear interpolation.

3.Specifications are guaranteed over the given temperature range, with the input power to the T x

port equal to +30 dBm (or lower) over all Tx frequencies. The application of input power levels in excess of +30 dBm will not destroy the duplexer, but its performance may exceed the specification limits given above.

4.Operation in excess of any one of these conditions may result in permanent damage to the device.

-10-20-30-40-50-60-70I N S E R T I O N L O S S A N D R E J E C T I O N (d B )

FREQUENCY (GHz)Figure 1. Tx and Rx Port Insertion Loss (typical). 1.82

1.84 1.86 1.88 1.90 1.92 1.94 1.96

2.001.98 2.02

FREQUENCY (GHz)

Figure 2. Insertion Loss Detail (typical).

0-5-10-15

-20R E T U R N L

O S S (d B )

1.82

1.84 1.86 1.88 1.90 1.92 1.94 1.96

2.001.98 2.02

FREQUENCY (GHz)S 11

S 22

Figure 3. Tx and Rx Port Return Loss (typical).0

-5-10

-15

-20R E T U R N L O S S (d B )

1.82

1.84 1.86 1.88 1.90 1.92 1.94 1.96

2.001.98 2.02

FREQUENCY (GHz)

S 33

Figure 4. Ant Port Return Loss (typical).

freq (1.850 GHz to 1.910 GHz)Figure 5. S11, Tx Port Impedance (typical).The plots below provide typical performance obtained from samples of the HPMD-7905duplexer.

In order to obtain the best performance from the

HPMD-7905 duplexer, refer to Design Note D007, which is

available from your Agilent Technologies technical support or sales departments.

freq (1.930 GHz to 1.990 GHz)

Figure 6. S22, Rx Port Impedance (typical).

A: freq (1.850 GHz to 1.910 GHz)B: freq (1.930 GHz to 1.990 GHz)

Figure 7. S33, Ant Port Impedance.A

-20-30

-40-50-60-70-80I S O L A T I O N (d B )

1.82

1.84 1.86 1.88 1.90 1.92 1.94 1.96

2.001.98 2.02

FREQUENCY (GHz)

Figure 8. S21, Isolation (typical).

S 21

0-5-10

-15-20-25-30-35-40-45-50R E T U R N L O S S (d B )

2.0

2.5

3.0

3.5

4.0

4.5

5.0

5.5

6.0

FREQUENCY (GHz)

Figure 9. Wideband Insertion Loss (typical).

S 31

S 23

-10-15-20

-25-30-35-40-45-50I S O L A T I O N (d B )

2.0

2.5

3.0

3.5

4.0

4.5

5.0

5.5

6.0

FREQUENCY (GHz)

Figure 10. Wideband Isolation (typical).

S 21

Note that the specifications given on page 2 are guaranteed when the duplexer is mounted on a ground surface with a hole pattern like that one shown in Figure 11. See Design Note D007,

Figure 11. Mounting (grounding) Pattern.

Figure 12. Outline Drawing.

which is available from your Agilent Technologies technical support or sales departments.Note that it is important that proper heat sinking be provided in order to remove the heat

generated in the Tx filter by the handset’s power amplifier.Failure to do so may result in excessive losses, especially at the top end of the Tx band.

0.86.14

.63.87

.36

.02

.511.371.88 ± 0.1

± 0.1

BOTTOM VIEW

Pin Number/Description 1 Tx Port 3 Ant Port 2 Rx Port 4 Ground

Note:

All dimensions in millimeters.

5.63 TOP VIEW

2. Material: polystyrene

3. Surface resistivity: 1x109 ohm-mm2+1.00"

-0.50"

-0 +1.00"

-0.50"

Notes:

1. All dimensions in mm.

2. 10 sprocket hole pitch accumulative tolerance ± 0.10 mm

3. Camber not exceed 1 mm in 250 mm

4. Pocket dimensions measured on a plane 0.3 mm above the bottom of the pocket.

5. Pocket depth measured from a plane on the inside bottom of the pocket to the top surface of the carrier.

6. Pocket position on relative to sprocket hole measure as true position of pocket, not the pocket hole. Figure 13. Tape Drawing.

Figure 14. Reel Drawing.

Solder Recommendations

The HPMD-7905 FBAR duplexer (and its variants) is an assembly consisting of two LCC ceramic packages, containing the Tx and Rx filters, mounted to a small circuit board. Both packages on the circuit board are mounted in place using Sn96.5/Ag3.5 solder (shaded in Table 1).Figure 15. Device Orientation.

USER FEED

COVER TAPE

User Feed Direction

Top View

Empty Pocket/Cavity

Leader: 100 pocket – 1 Meter Trailer: 100 pocket – 1 Meter

End View

xx xx 1x DO xx xx 1x

DO xx xx 1x DO xx xx 1x

DO The recommended solder profile for the FBAR duplexer is shown in Figure 16. Guidelines and a typical profile are both shown.This typical profile was tested on ten samples of the duplexer, each of which was subjected to the profile six times without effect upon the mechanical or electrical

characteristics of the device.

Alloy type

Melting temp.Recommended working Comments

(o C)

temperature (o C)

Sn42Bi58138160 – 180Lead free

Sn43Pb43Bi14144 – 163165 – 185Contains lead – some customers prohibit it.Sn63Pb37183200 – 240Contains lead – some customers prohibit it.Sn60Pb40186200 – 240Contains lead – some customers prohibit it.Sn91/Zn9

199200 – 240May have oxidation problems Sn96.2Ag2.5Cu0.8Sb0.5216235 – 255Popular lead free composition Sn95.8Ag3.5Cu0.7217235 – 255Other alloy ratios are available Sn100232260 – 280Too hot – will melt the duplexer Sn95Sb5235260 – 280Too hot – will melt the duplexer Sn97Cu3

240

260 – 300

Too hot – will melt the duplexer

Table 1. Solder Compositions Solder temperatures and times in excess of those given in the

guidelines of Table 1 may result in damage to the duplexer or changes in its characteristics.

https://www.wendangku.net/doc/ff9488697.html,/semiconductors

For product information and a complete list of distributors, please go to our web site.For technical assistance call:

Americas/Canada: +1 (800) 235-0312 or (408) 654-8675

Europe: +49 (0) 6441 92460China: 10800 650 0017Hong Kong: (+65) 6271 2451

India, Australia, New Zealand: (+65) 6271 2394Japan: (+81 3) 3335-8152(Domestic/International), or 0120-61-1280(Domestic Only)Korea: (+65) 6271 2194

Malaysia, Singapore: (+65) 6271 2054Taiwan: (+65) 6271 2654

Data subject to change.

100

150

200

250

TIME, seconds

T E M P E R A T U R E , °C

Figure 16. Recommended Solder Profile.

Part Number Ordering Information Part Number

No. of Devices

Container

HPMD-7905-BLK 25antistatic bag HPMD-7905-TR1

1000

13" reel