FH25-33S-0.3SH中文资料

1

0.3 mm Contact Pitch, 0.9 mm above the board, Flexible Printed Circuit ZIF Connectors.

FH 25 Series

NEW

2004.6

s Features

1. Extremely light weight

The largest version, with all contacts loaded, weights only 0.11gramms.

2. Conductive traces on the PCB can run under the connector

No exposed contacts on the bottom of the connector.

3. High density together with reliable solderability on the board

Staggered contact points and the leads plus the nickel barriers assure sufficient distance to prevents solder bridging.

4. Easy FPC insertion and reliable electrical connection

Proven Flip Lock? actuator allows easy insertion of FPC.Tactile sensation when fully closed confirms complete electrical and mechanical connection.

5. Accepts standard thickness FPC

0.2 mm thick standard Flexible Printed Circuit board can be used. This is the only ultra-low profile ZIF connector allowing the use of standard FPC.

6. Board placement with automatic equipment

Flat top surface and packaging on the tape-and-reel allows use of vacuum nozzles.

Standard reel contains 5,000 connectors.

s Applications

Mobile phones, PDA’s, digital cameras, digital video cameras, LCD connections, plasma displays (PDP), camera modules and other compact devices requiring Flexible Printed Circuit connections using high reliability

ultra-small profile connectors.

0.9m m

3.45mm

17

.1

m m

(51pos. type)

0.6mm

Nickel barrier prevents Actuator open

FPC insertion direction

Actuator closed

FPC fully inserted

No exposed contacts

Metal fittings do not protrude outside of the connector body

FPC

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2

s Materials

s Ordering information

s Product Specifications

Note 2: The term ”storage” refers to products stored for long period of time prior to mounting and use. Operating Temperature Range and Humidity range covers non- conducting condition of installed connectors in storage, shipment or during transportation.

---(05)

SH

0.3

51S

FH25

12345

3

B Operation and Precautions

130°

FPC conductor surface

(Bottom side)

4Notes The coplanarity of each terminal lead is within 0.1.

The contact terminal lead position indicates the dimension from the E surface, the bottom surface of the insulator body.

Slight variations in color of the plastic compounds do not affect form, fit or function of the connector.

1

2

3

∞Number of contacts

00

0.1MAX.

0.1MAX.

0.15G

B

A

(0.15)

A * *

0.3

(C: FPC insertion slot dimension)

D

1

.

3

.

5

Polarizing mark indicator

Number of contacts indicator

(

1

.

3

5

)

(0.15)

(

.

4

)

(0.12)

.

9

(

I

n

c

l

u

d

i

n

g

c

o

n

t

a

c

t

t

e

r

m

i

n

a

l

l

e

a

d

s

)

(

1

.

8

)

2.3

E

(0.85)

(1.75)

1

22

1

G

s Specifications

Unit: mm

Embossed tape reel packaging (5,000 pieces/reel).

Order by number of reels.

5

0.25±0.05(Metal mask)

Recommended metal mask thickness:

t = 0.1 mm

∞Number of contacts

0.1H

H

0.7±0.03

(0.05)(0.2)

A

0.3

0.3±0.05(Land)

F U L L R

0.9±0.03

0.4±0.030.4±0.03

(0.15)

(0.15)

B±0.05

1.65±0.03

0.7±0.03

(0.25)

2.65±0.05

(0.2)

(0.2)(0.25)

(0.15)

(0.15)B Recommended PCB mounting pattern and metal mask dimensions

Covering film layer

2.8 M I N (A r e a w i t h r e m o v e d c o v e r i n g f i l m l a y e r )

S t i f f e n e r

2.8

0.2±0.03

C±0.05A±0.03

D±0.03

0.3±0.07

0.6±0.020.3+0.04

- 0.03

0.3+0.04- 0.03

2-R0.2 MAX

0.6±0.02

0.3±0.02

0.6±0.07

(2.3)

(0.6)1.1±0.151.2±0.150.3±0.15

0.5M I N

2

B Recommended FP

C Dimensions

Polyamide and thermally hardening adhesive is recommended as the stiffener materials.Overlap between covering film layer and stiffener is 0.5mm min.

12Unit: mm

Embossed tape reel packaging (5,000 pieces/reel).

Order by number of reels.

6

B Packaging Specification

Unit: mm q Reel Dimensions

q Embossed Carrier Tape Dimensions

Embossed carrier tape Top cover tape

(

?

8

)

(

?

3

8

)

(2)(D)

Blank portion

(10 pockets min.)

Blank portion

(10 pockets min.)

End portion Lead portion (400mm min.)

Mounting portion

?

1

3

±

.

5

7

B Recommended Temperature Profile

HRS test conditions Solder method :Reflow, IR/hot air

(Nihon Den-netsu Co., Ltd.’s Part Number:SENSBY NR-2)

Environment :Room air

Solder composition :Paste, 63%Sn/37%Pb

(Senju Metal Industry, Co., Ltd.’s Part Number:OZ63-201C-50-9)

Test board :Glass epoxy 70mm∞80mm∞1.6mm thick

Land dimensions:

0.3mm∞0.65mm,0.3mm∞0.8mm

Metal mask :0.23∞0.55∞0.1mm thick,

0.23∞0.65∞0.1mm thick

T e m p e r a t u r e

?)

Time (Seconds)

q Using Typical Solder Paste

HRS test condition Solder method

:Reflow, IR/hot air

(Nihon Den-netsu Co., Ltd.’s Part Number: SENSBY NR-2)

Environment

:Room air

Solder composition :Paste, 96.5%Sn/3.0%Ag/0.5%Cu

(Senju Metal Industry, Co., Ltd.’s Part Number:M705-221CM5-42-10.5)

Test board

:Glass epoxy 70mm∞80mm∞1.6mm thick Land dimensions:

0.3mm∞0.65mm, 0.3mm∞0.8mm

Metal mask

:0.23∞0.55∞0.1mm thick,0.23∞0.65∞0.1mm thick

The temperature profiles are based on the above conditions.In individual applications the actual temperature

may vary,depending on

solder paste type, volume/thickness and board size/thickness. Consult your solder paste and equipment manufacturer for specific recommendations.

T e m p e r a t u r e

?)

Time (Seconds)

q Using Lead-free Solder Paste

8B FH25 Series FPC Construction (Recommended)

Note: Recommended specification for FPC 0.2 ± 0.03 mm thick.

To prevent release of the lock due to FPC bending, use of the FPC with copper foil on rear side is NOT RECOMMENDED.

The contents of this catalog are current as of date of publication. Contents are subject to change without notice for the purpose of improvements.

5-23,OSAKI 5-CHOME,SHINAGAWA-KU,TOKYO 141-8587,JAPAN

PHONE: 81-3-3491-9741, FAX: 81-3-3493-2933

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